| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/26/2004 | WO2004073066A1 Line element and semiconductor circuit applied with line element |
| 08/26/2004 | WO2004073063A1 Electronic device and semiconductor device |
| 08/26/2004 | WO2004073062A2 Method of manufacturing a reinforced semiconductor wafer |
| 08/26/2004 | WO2004073059A1 Method for planarizing bumped die |
| 08/26/2004 | WO2004073047A2 Uv-blocking layer for reducing uv-induced charging of sonos dual-bit flash memory devices in beol processing |
| 08/26/2004 | WO2004073031A2 Alternative flip chip in leaded molded package design and method for manufacture |
| 08/26/2004 | WO2004073023A2 Low voltage nmos-based electrostatic discharge clamp |
| 08/26/2004 | WO2004073019A2 Semiconductor die package with reduced inductance and reduced die attach flow out |
| 08/26/2004 | WO2004073016A2 On-carrier impedance transform network |
| 08/26/2004 | WO2004073013A2 Electronic component comprising a semiconductor chip and method for producing said component |
| 08/26/2004 | WO2004072998A2 Protecting resin-encapsulated components |
| 08/26/2004 | WO2004072146A1 Process for producing high-purity epoxy resin and epoxy resin composition |
| 08/26/2004 | WO2004051134A3 Vacuum heat insulator and its manufacturing method |
| 08/26/2004 | WO2004042791A3 Method and apparatus for monitoring integrated circuit fabrication |
| 08/26/2004 | WO2004037712A3 Method for producing a packaged integrated circuit with a microcavity |
| 08/26/2004 | WO2004034467A3 Sublithographic nanoscale memory architecture |
| 08/26/2004 | WO2004034422A3 Wafer coating and singulation method |
| 08/26/2004 | WO2004015744A3 Via programmable gate array interconnect architecture |
| 08/26/2004 | WO2003079752A3 Unit cell architecture for electrical interconnects |
| 08/26/2004 | WO2003061006B1 Stacked die in die bga package |
| 08/26/2004 | US20040167801 Analyte monitoring device and methods of use |
| 08/26/2004 | US20040166702 Semiconductor device having external contact terminals and method for using the same |
| 08/26/2004 | US20040166693 Sputtering target compositions, and methods of inhibiting copper diffusion into a substrate |
| 08/26/2004 | US20040166682 Semiconductor device for charge-up damage evaluation and charge-up damage evaluation method |
| 08/26/2004 | US20040166680 Method of manufacturing semiconductor device |
| 08/26/2004 | US20040166674 Method for making damascene interconnect with bilayer capping film |
| 08/26/2004 | US20040166670 Method for forming three-dimensional structures on a substrate |
| 08/26/2004 | US20040166666 Semiconductor device and method of manufacturing the same |
| 08/26/2004 | US20040166665 Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition |
| 08/26/2004 | US20040166663 Method for constructing a wafer-interposer assembly |
| 08/26/2004 | US20040166662 MEMS wafer level chip scale package |
| 08/26/2004 | US20040166661 Method for forming copper bump antioxidation surface |
| 08/26/2004 | US20040166660 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
| 08/26/2004 | US20040166659 Top layers of metal for high performance IC's |
| 08/26/2004 | US20040166657 Semiconductor device and its manufacturing method |
| 08/26/2004 | US20040166646 Methods for use in forming a capacitor and structures resulting from same |
| 08/26/2004 | US20040166630 Stitch and select implementation in twin MONOS array |
| 08/26/2004 | US20040166617 Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times |
| 08/26/2004 | US20040166609 Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion |
| 08/26/2004 | US20040166607 Methods for fabricating interposers including upwardly protruding DAMS |
| 08/26/2004 | US20040166605 Fabrication method of semiconductor integrated circuit device |
| 08/26/2004 | US20040166444 forming marks nonparallel to the direction of generation of a factor that hinders reading; consecutive marks have different portions subjected to hindrance to reading, and the results of reading of the marks are compared with each other |
| 08/26/2004 | US20040166329 Method for fabricating a thin line structure, multilayered structure and multilayered intermediate structure |
| 08/26/2004 | US20040166326 Polyphenol resin, method for producing the same, epoxy resin composition and use thereof |
| 08/26/2004 | US20040166325 substantially free of halogen, phosphorous, and antimony |
| 08/26/2004 | US20040166241 Molding compositions containing quaternary organophosphonium salts |
| 08/26/2004 | US20040165975 Apparatus for and method of packaging semiconductor devices |
| 08/26/2004 | US20040165362 Chip scale package structures and method of forming conductive bumps thereon |
| 08/26/2004 | US20040165361 Module component and method of manufacturing the same |
| 08/26/2004 | US20040165356 Leadless leadframe electronic package and sensor module incorporating same |
| 08/26/2004 | US20040165355 CPU cooling structure |
| 08/26/2004 | US20040165354 Heat radiating structure for electronic device |
| 08/26/2004 | US20040165353 Electrically isolated module |
| 08/26/2004 | US20040165352 Housing structure of electronic device and heat radiation method therefor |
| 08/26/2004 | US20040165350 Heat sink assembly with heat pipe |
| 08/26/2004 | US20040165349 Duct for cooling multiple components in a processor-based device |
| 08/26/2004 | US20040165336 Multi-layered unit including electrode and dielectic layer |
| 08/26/2004 | US20040165334 Multi-layered unit |
| 08/26/2004 | US20040165327 Circuitry for protecting electronic circuits against electrostatic discharges and methods of operating the same |
| 08/26/2004 | US20040165098 Camera module |
| 08/26/2004 | US20040164981 Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication |
| 08/26/2004 | US20040164760 Wireless radio frequency technique design and method for testing |
| 08/26/2004 | US20040164722 Integrated circuit leadframes patterned for measuring the accurate amplitude of changing currents |
| 08/26/2004 | US20040164432 Cascaded die mountings with spring-loaded contact-bond options |
| 08/26/2004 | US20040164431 substrate having a first side configured to receive a semiconductor chip and a second side having conductive pads arranged in an array of rows and columns, wherein at least one edge of said array is not fully populated with pads. |
| 08/26/2004 | US20040164430 conductive patterns, which are to be electrodes, are exposed from side surfaces of an insulating resin that seals the entire circuit device; fillets of a brazing material are formed at the sides of the device when circuit device is mounted. |
| 08/26/2004 | US20040164429 Chip carrier film, method of manufacturing the chip carrier film and liquid crystal display using the chip carrier film |
| 08/26/2004 | US20040164428 Method of manufacturing a semiconductor device and a semiconductor device |
| 08/26/2004 | US20040164427 Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations |
| 08/26/2004 | US20040164426 Each electrically conductive adhesive bump connects a bonding pad and a corresponding bump pad, and has a smaller diameter at the central portion thereof than at the end portions thereof. |
| 08/26/2004 | US20040164425 one package includes a plurality of chips, each of which is capable of functioning as one memory chip; dicing line interposed between basic chips that configures a part of the memory chip; bump connecting the logic chip and the memory chip |
| 08/26/2004 | US20040164424 Flexibility enhanced integrated circuit carrier |
| 08/26/2004 | US20040164422 Semiconductor integrated circuit having pads layout for increasing signal integrity and reducing chip size |
| 08/26/2004 | US20040164421 Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devices |
| 08/26/2004 | US20040164420 Sputtering target compositions, and methods of inhibiting copper diffusion into a substrate |
| 08/26/2004 | US20040164419 Multilevel copper interconnects with low-k dielectrics and air gaps |
| 08/26/2004 | US20040164418 Semiconductor device having a pillar structure |
| 08/26/2004 | US20040164417 Semiconductor device and manufacturing method thereof |
| 08/26/2004 | US20040164415 Electrode employing nitride-based semiconductor of III-V group compound, and producing method thereof |
| 08/26/2004 | US20040164414 Semiconductor device package and method of making the same |
| 08/26/2004 | US20040164413 Underfilled, encapsulated semiconductor die assemblies and methods of fabrication |
| 08/26/2004 | US20040164411 Semiconductor package and method for fabricating the same |
| 08/26/2004 | US20040164410 Die package |
| 08/26/2004 | US20040164409 Soft error resistant semiconductor device |
| 08/26/2004 | US20040164408 Noise eliminating system on chip and method of making same |
| 08/26/2004 | US20040164407 Semiconductor device, power amplifier device and PC card |
| 08/26/2004 | US20040164406 Discrete circuit component having an up-right circuit die with lateral electrical connections |
| 08/26/2004 | US20040164405 Heatsink arrangement for semiconductor device |
| 08/26/2004 | US20040164404 Semiconductor package with heat dissipating structure |
| 08/26/2004 | US20040164403 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material |
| 08/26/2004 | US20040164402 metal coupling member is deformable to absorb a stress generated between the semiconductor chip and the heat dissipation member, both of which are joined through metal-metal bonding. |
| 08/26/2004 | US20040164401 Module with adhesively attached heat sink |
| 08/26/2004 | US20040164400 Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the same |
| 08/26/2004 | US20040164399 Semiconductor device and manufacturing method therefor |
| 08/26/2004 | US20040164398 System-on-a-chip with multi-layered metallized through-hole interconnection |
| 08/26/2004 | US20040164397 Power ring architecture for embedded low drop off voltage reglators |
| 08/26/2004 | US20040164396 Interconnect substrate and method of manufacture thereof, electronic component and method of manufacturing thereof, circuit board and electronic instrument |
| 08/26/2004 | US20040164395 sealed in a resin package and having its terminals exposed on a bottom surface of the package. |
| 08/26/2004 | US20040164394 Multi-chip package and method for manufacturing the same |
| 08/26/2004 | US20040164393 Stacked semiconductor module |