Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2014
02/26/2014CN102148575B Rectifier wafer terminal structure
02/26/2014CN102136472B Semiconductor apparatus module
02/26/2014CN102136459B Packaging structure and manufacture method thereof
02/26/2014CN102132489B Method for manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic device, and radio watch
02/26/2014CN101847599B Method of forming sensing circuit and structure therefor
02/26/2014CN101840116B TFT-LCD (Thin Film Transistor-Liquid Crystal Diode) array substrate and manufacture method thereof
02/25/2014US8660627 Analyte monitoring device and methods of use
02/25/2014US8659908 Protective circuit board cover
02/25/2014US8659900 Circuit board including a heat radiating plate
02/25/2014US8659175 Integrated circuit package system with offset stack
02/25/2014US8659174 Semiconductor device
02/25/2014US8659173 Isolated wire structures with reduced stress, methods of manufacturing and design structures
02/25/2014US8659172 Semiconductor device and method of confining conductive bump material with solder mask patch
02/25/2014US8659171 Patch on interposer assembly and structures formed thereby
02/25/2014US8659170 Semiconductor device having conductive pads and a method of manufacturing the same
02/25/2014US8659169 Corner structure for IC die
02/25/2014US8659168 Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board
02/25/2014US8659166 Memory device, laminated semiconductor substrate and method of manufacturing the same
02/25/2014US8659165 Contact and VIA interconnects using metal around dielectric pillars
02/25/2014US8659163 Semiconductor device having through electrode and method of fabricating the same
02/25/2014US8659162 Semiconductor device having an interconnect structure with TSV using encapsulant for structural support
02/25/2014US8659161 Chip package with reinforced positive alignment features
02/25/2014US8659160 Die structure, manufacturing method and substrate thereof
02/25/2014US8659159 Integrated circuit device with interconnects arranged parallel to each other and connected to contact via, and method for manufacturing same
02/25/2014US8659157 Adhesive composition for producing semiconductor device and adhesive sheet for producing semiconductor device
02/25/2014US8659155 Mechanisms for forming copper pillar bumps
02/25/2014US8659154 Semiconductor device including adhesive covered element
02/25/2014US8659153 Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods
02/25/2014US8659152 Semiconductor device
02/25/2014US8659150 Semiconductor module
02/25/2014US8659149 Semiconductor structure with galvanic isolation
02/25/2014US8659148 Tileable sensor array
02/25/2014US8659147 Power semiconductor circuit device and method for manufacturing the same
02/25/2014US8659146 Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing
02/25/2014US8659145 Semiconductor device
02/25/2014US8659144 Power and ground planes in package substrate
02/25/2014US8659143 Stub minimization for wirebond assemblies without windows
02/25/2014US8659142 Stub minimization for wirebond assemblies without windows
02/25/2014US8659141 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
02/25/2014US8659140 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
02/25/2014US8659139 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
02/25/2014US8659138 Semiconductor package having electrode on side surface, and semiconductor device
02/25/2014US8659137 Stacked semiconductor device and manufacturing method thereof
02/25/2014US8659136 Semiconductor memory device, semiconductor package and system having stack-structured semiconductor chips
02/25/2014US8659135 Semiconductor device stack and method for its production
02/25/2014US8659134 Multi-chip package and manufacturing method
02/25/2014US8659133 Etched surface mount islands in a leadframe package
02/25/2014US8659132 Microelectronic package assembly, method for disconnecting a microelectronic package
02/25/2014US8659131 Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut
02/25/2014US8659130 Power module and power module manufacturing method
02/25/2014US8659129 Semiconductor device and method of manufacturing same
02/25/2014US8659128 Flip chip package structure with heat dissipation enhancement and its application
02/25/2014US8659127 Wiring substrate, semiconductor device and manufacturing method thereof
02/25/2014US8659126 Integrated circuit ground shielding structure
02/25/2014US8659125 Chipset package structure
02/25/2014US8659123 Metal pad structures in dies
02/25/2014US8659121 Semiconductor devices with orientation-free decoupling capacitors and methods of manufacture thereof
02/25/2014US8659120 Semiconductor device substrate and semiconductor device
02/25/2014US8659106 Light emitting device and method of manufacturing the light emitting device
02/25/2014US8659086 ESD protection for bipolar-CMOS-DMOS integrated circuit devices
02/25/2014US8659050 Slim LED package
02/25/2014US8659019 Semiconductor device
02/25/2014US8659018 Semiconductor device and integrated semiconductor device
02/25/2014US8658914 Electronic component device and method for manufacturing the same
02/25/2014US8658533 Semiconductor interconnect structure with multi-layered seed layer providing enhanced reliability and minimizing electromigration
02/25/2014US8658493 Manufacturing method of semiconductor device
02/25/2014US8658473 Ultrathin buried die module and method of manufacturing thereof
02/25/2014US8658471 Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof
02/25/2014US8658465 System and method to manufacture an implantable electrode
02/25/2014DE202014000544U1 Kühlstruktur für Mobilgerät The cooling structure for a mobile device
02/25/2014CA2644234C Method and apparatus for cooling semiconductor chips
02/25/2014CA2574230C Heat pipe heat sink
02/20/2014WO2014028670A1 THIN SUBSTRATE PoP STRUCTURE
02/20/2014WO2014028567A1 Solder on trace technology for interconnect attachment
02/20/2014WO2014028075A1 Flexible ultrasound inspection system
02/20/2014WO2014028066A1 Flexible sized die for use in multi-die integrated circuit
02/20/2014WO2014027536A1 Dc-dc converter device
02/20/2014WO2014027476A1 Semiconductor device
02/20/2014WO2014027406A1 Heat-receiving device, cooling device, and electronic device
02/20/2014WO2014027405A1 Heat-receiving device, cooling device, and electronic device
02/20/2014WO2014027380A1 Group iii nitride semiconductor element and method for manufacturing same
02/20/2014WO2014027376A1 Thermosetting resin sheet, semiconductor device, and method for manufacturing semiconductor device
02/20/2014WO2014026858A1 Integrated semiconductor device
02/20/2014WO2014026675A2 Method for producing hollow bodies, particularly for coolers, hollow body and cooler containing electrical and/or electronic components
02/20/2014WO2014026349A1 Detection circuit and detection method
02/20/2014WO2013184210A3 Hierarchical structured surfaces
02/20/2014US20140051957 Analyte Monitoring Device and Methods of Use
02/20/2014US20140051244 Method of forming an integrated circuit device
02/20/2014US20140051243 Package for semiconductor device including guide rings and manufacturing method of the same
02/20/2014US20140050243 Cmos-compatible gold-free contacts
02/20/2014US20140050032 Semiconductor memory device
02/20/2014US20140049862 Miniature Passive Structures for ESD Protection and Input and Output Matching
02/20/2014US20140049280 Multi-chip semiconductor apparatus
02/20/2014US20140049193 Accelerator Having Acceleration Channels Formed Between Covalently Bonded Chips
02/20/2014US20140048959 Microelectronic package having non-coplanar, encapsulated microelectronic devices and a bumpless build-up layer
02/20/2014US20140048958 Pad Sidewall Spacers and Method of Making Pad Sidewall Spacers
02/20/2014US20140048957 THIN SUBSTRATE PoP STRUCTURE
02/20/2014US20140048956 Forming array contacts in semiconductor memories
02/20/2014US20140048955 Semiconductor assembly board with back-to-back embedded semiconductor devices and built-in stoppers
02/20/2014US20140048953 Semiconductor structures including sub-resolution alignment marks
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