| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/26/2015 | US20150054019 Semiconductor device |
| 02/26/2015 | US20150054018 Light-emitting device |
| 02/26/2015 | US20150054002 Semiconductor structure and manufacturing method thereof |
| 02/26/2015 | US20150053954 Electronic device, image display apparatus, and substrate for configuring image display apparatus |
| 02/26/2015 | US20150053911 Semiconductor memory device |
| 02/26/2015 | US20150053774 Methods to fabricate integrated circuits by assembling components |
| 02/26/2015 | US20150053666 Semiconductor device including asymmetric electrode arrangement |
| 02/26/2015 | US20150053350 Bonding method, bonding apparatus, and method for manufacturing substrate |
| 02/26/2015 | DE112013002708T5 Netzwerk elektronischer Vorrichtungen, die auf einem flexiblen Träger angebracht sind, und Kommunikationsverfahren Network of electronic devices which are mounted on a flexible carrier, and communication method |
| 02/26/2015 | DE112012006409T5 Mehrfachstapel-BBUL-Paket A multi-stack BBUL package |
| 02/26/2015 | DE112012006033T5 Befestigung einer mikroelektronischen Vorrichtung auf einem umgekehrten mikroelektronischen Paket Attaching a microelectronic device on a reverse microelectronic package |
| 02/26/2015 | DE112011103146B4 Verfahren zum Verbessern der mechanischen Eigenschaften von Halbleiterzwischenverbindungen mit Nanopartikeln A method for improving the mechanical properties of semiconductor nanoparticles with intermediate compounds |
| 02/26/2015 | DE10259035B4 ESD-Schutzbauelement und Schaltungsanordnung mit einem ESD-Schutzbauelement ESD protection device and circuit with an ESD protection device |
| 02/26/2015 | DE102014111829A1 Ein Halbleitermodul und ein Verfahren zu dessen Fabrikation durch erweiterte Einbettungstechnologien A semiconductor module and a method for its manufacture by embedding Advanced Technologies |
| 02/26/2015 | DE102014104716B3 Leistungshalbleitermodul The power semiconductor module |
| 02/26/2015 | DE102013216709A1 Halbleiteranordnung, verfahren zur herstellung einer anzahl von chipbaugruppen und verfahren zur herstellung einer halbleiteranordnung A semiconductor device, method for manufacturing a number of chip assemblies and methods for making a semiconductor device |
| 02/26/2015 | DE102013109079A1 Verfahren zum Durchtrennen von Substraten und Halbleiterchip A method for cutting substrates and semiconductor chip |
| 02/26/2015 | DE102011002419B4 Befestigungsanordnung für eine Wärmesenke Mounting arrangement for a heat sink |
| 02/25/2015 | EP2840872A1 Electronic device and method of manufacturing electronic device |
| 02/25/2015 | EP2840607A1 Semiconductor module |
| 02/25/2015 | EP2840606A2 Semiconductor package |
| 02/25/2015 | EP2840605A2 A semiconductor component having a lateral semiconductor device and a vertical semiconductor device |
| 02/25/2015 | EP2840604A1 Semiconductor device and cooler for semiconductor device |
| 02/25/2015 | EP2840603A1 Refrigeration device |
| 02/25/2015 | EP2840602A2 Cavity package for electronic component and crystal oscillator |
| 02/25/2015 | EP2840375A1 Device with a micro- or nanoscale structure |
| 02/25/2015 | EP2839507A1 Thermally conductive polymer compostions to reduce molding cycle time |
| 02/25/2015 | EP2839312A1 Optical sensor arrangement |
| 02/24/2015 | US8966433 Support method, recording medium storing design support program and semiconductor device |
| 02/24/2015 | US8966424 Methods for cell phasing and placement in dynamic array architecture and implementation of the same |
| 02/24/2015 | US8966410 Semiconductor structure and method for fabricating semiconductor layout |
| 02/24/2015 | US8965712 Life predicting method for solder joint, life predicting apparatus for solder joint and electronic device |
| 02/24/2015 | US8965572 Frame feeding system and frame feeding method |
| 02/24/2015 | US8964489 Semiconductor memory device capable of optimizing an operation time of a boosting circuit during a writing period |
| 02/24/2015 | US8964483 Semiconductor device and memory system |
| 02/24/2015 | US8964409 Electronic module with EMI protection |
| 02/24/2015 | US8964403 Wiring board having a reinforcing member with capacitors incorporated therein |
| 02/24/2015 | US8964402 Electronic device, interposer and method of manufacturing electronic device |
| 02/24/2015 | US8964400 Circuitry arrangement for reducing a tendency towards oscillations |
| 02/24/2015 | US8964389 Electronic component cooling unit and power converting device |
| 02/24/2015 | US8964385 Air flow system |
| 02/24/2015 | US8964190 Alignment apparatus, substrates stacking apparatus, stacked substrates manufacturing apparatus, exposure apparatus and alignment method |
| 02/24/2015 | US8963657 On-chip slow-wave through-silicon via coplanar waveguide structures, method of manufacture and design structure |
| 02/24/2015 | US8963346 Semiconductor wafer and semiconductor device |
| 02/24/2015 | US8963345 Encapsulation device having improved sealing |
| 02/24/2015 | US8963344 Epoxy resin composition for semiconductor encapsulation, cured product thereof, and semiconductor device |
| 02/24/2015 | US8963343 Ferroelectric memories with a stress buffer |
| 02/24/2015 | US8963342 Structures, architectures, systems, methods, algorithms and software for configuring an integrated circuit for multiple packaging types |
| 02/24/2015 | US8963341 Process for placing, securing and interconnecting electronic components |
| 02/24/2015 | US8963340 No flow underfill or wafer level underfill and solder columns |
| 02/24/2015 | US8963338 III-nitride transistor stacked with diode in a package |
| 02/24/2015 | US8963337 Thin wafer support assembly |
| 02/24/2015 | US8963336 Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same |
| 02/24/2015 | US8963335 Tunable composite interposer |
| 02/24/2015 | US8963334 Die-to-die gap control for semiconductor structure and method |
| 02/24/2015 | US8963333 Apparatus, system, and method for wireless connection in integrated circuit packages |
| 02/24/2015 | US8963332 Semiconductor device with dummy lines |
| 02/24/2015 | US8963331 Semiconductor constructions, semiconductor processing methods, methods of forming contact pads, and methods of forming electrical connections between metal-containing layers |
| 02/24/2015 | US8963330 Circuit structures and electronic systems |
| 02/24/2015 | US8963329 Semiconductor device |
| 02/24/2015 | US8963328 Reducing delamination between an underfill and a buffer layer in a bond structure |
| 02/24/2015 | US8963327 Semiconductor device including wiring board with semiconductor chip |
| 02/24/2015 | US8963326 Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration |
| 02/24/2015 | US8963325 Power device and power device module |
| 02/24/2015 | US8963324 Semiconductor device |
| 02/24/2015 | US8963323 Heat-transfer structure |
| 02/24/2015 | US8963322 Electric power conversion apparatus |
| 02/24/2015 | US8963321 Semiconductor device including cladded base plate |
| 02/24/2015 | US8963320 Integrated circuit packaging system with thermal structures and method of manufacture thereof |
| 02/24/2015 | US8963319 Semiconductor chip with through hole vias |
| 02/24/2015 | US8963318 Packaged semiconductor device |
| 02/24/2015 | US8963317 Thermal dissipation through seal rings in 3DIC structure |
| 02/24/2015 | US8963316 Semiconductor device and method for manufacturing the same |
| 02/24/2015 | US8963315 Semiconductor device with surface electrodes |
| 02/24/2015 | US8963314 Packaged semiconductor product and method for manufacture thereof |
| 02/24/2015 | US8963313 Heterogeneous chip integration with low loss interconnection through adaptive patterning |
| 02/24/2015 | US8963312 Stacked chip package and method for forming the same |
| 02/24/2015 | US8963311 PoP structure with electrically insulating material between packages |
| 02/24/2015 | US8963310 Low cost hybrid high density package |
| 02/24/2015 | US8963308 Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device |
| 02/24/2015 | US8963307 Compact device package |
| 02/24/2015 | US8963305 Method and apparatus for multi-chip structure semiconductor package |
| 02/24/2015 | US8963304 Semiconductor device and semiconductor device mounting structure |
| 02/24/2015 | US8963303 Power electronic device |
| 02/24/2015 | US8963302 Stacked packaged integrated circuit devices, and methods of making same |
| 02/24/2015 | US8963301 Integrated circuit package and method of making the same |
| 02/24/2015 | US8963300 Semiconductor device with selective planished leadframe |
| 02/24/2015 | US8963299 Semiconductor package and fabrication method thereof |
| 02/24/2015 | US8963298 EMI shielding package structure and method for fabricating the same |
| 02/24/2015 | US8963293 High resistivity silicon-on-insulator substrate and method of forming |
| 02/24/2015 | US8963292 Semiconductor device having backside redistribution layers and method for fabricating the same |
| 02/24/2015 | US8963286 Finger metal oxide metal capacitor structures |
| 02/24/2015 | US8963285 Semiconductor device and method of manufacturing thereof |
| 02/24/2015 | US8963284 Semiconductor devices having E-fuse structures and methods of fabricating the same |
| 02/24/2015 | US8963282 Crack stop structure and method for forming the same |
| 02/24/2015 | US8963281 Simultaneous isolation trench and handle wafer contact formation |
| 02/24/2015 | US8963278 Three-dimensional integrated circuit device using a wafer scale membrane |
| 02/24/2015 | US8963266 Devices including bond pad having protective sidewall seal |
| 02/24/2015 | US8963253 Bi-directional bipolar junction transistor for high voltage electrostatic discharge protection |
| 02/24/2015 | US8963223 Scalable integrated MIM capacitor using gate metal |