| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/01/2004 | CN1165079C Chip package with heat transferring structure |
| 09/01/2004 | CN1164970C Liquid crystal display, wiring substrate and making method thereof |
| 08/31/2004 | US6785447 Single and multilayer waveguides and fabrication process |
| 08/31/2004 | US6785147 Circuit module |
| 08/31/2004 | US6785144 High density stackable and flexible substrate-based devices and systems and methods of fabricating |
| 08/31/2004 | US6785143 Semiconductor memory module |
| 08/31/2004 | US6785137 Method and system for removing heat from an active area of an integrated circuit device |
| 08/31/2004 | US6785136 Coupling mechanism for radiator |
| 08/31/2004 | US6785135 Cooling device, electronic apparatus, display unit, and method of producing cooling device |
| 08/31/2004 | US6785134 Embedded liquid pump and microchannel cooling system |
| 08/31/2004 | US6784765 Multilayer ceramic device |
| 08/31/2004 | US6784685 Testing vias and contacts in an integrated circuit |
| 08/31/2004 | US6784558 Semiconductor device inlcluding optimized driver layout for integrated circuit with staggered bond pads |
| 08/31/2004 | US6784557 Semiconductor device including a diffusion layer formed between electrode portions |
| 08/31/2004 | US6784556 Design of interconnection pads with separated probing and wire bonding regions |
| 08/31/2004 | US6784555 Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes |
| 08/31/2004 | US6784554 Semiconductor device and manufacturing method thereof |
| 08/31/2004 | US6784552 Structure having reduced lateral spacer erosion |
| 08/31/2004 | US6784551 Electronic device having a trimming possibility and at least one semiconductor chip and method for producing the electronic device |
| 08/31/2004 | US6784550 Thermal processing method is described which improves metal polishing and increases conductivity following polish |
| 08/31/2004 | US6784549 Semiconductor device having a capacitor and a metal interconnect layer with tungsten as a main constituent material and containing molybdenum |
| 08/31/2004 | US6784548 Semiconductor device having dummy patterns for metal CMP |
| 08/31/2004 | US6784547 Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers |
| 08/31/2004 | US6784545 Semiconductor device having pad electrode connected to wire |
| 08/31/2004 | US6784544 Semiconductor component having conductors with wire bondable metalization layers |
| 08/31/2004 | US6784543 Projection-like connection terminals |
| 08/31/2004 | US6784542 Semiconductor device having a ball grid array and a fabrication process thereof |
| 08/31/2004 | US6784541 Resin is filled around the semiconductor chips so that they are sandwiched between the wiring board and the heat spread plate, as well as a mounting method for the semiconductor module |
| 08/31/2004 | US6784540 Semiconductor device package with improved cooling |
| 08/31/2004 | US6784539 Thermally enhanced semiconductor chip having integrated bonds over active circuits |
| 08/31/2004 | US6784538 Heat transfer structure for a semiconductor device utilizing a bismuth glass layer |
| 08/31/2004 | US6784537 Semiconductor device of surface-mounting type |
| 08/31/2004 | US6784536 Metal heat sink plate (a.k.a ?heatslug?) dissipates heat away from the semiconductor die and is usually made of a metal or metal alloy with relatively high thermal conductivity, such as cu, al, and cu w |
| 08/31/2004 | US6784535 Composite lid for land grid array (LGA) flip-chip package assembly |
| 08/31/2004 | US6784534 Thin integrated circuit package having an optically transparent window |
| 08/31/2004 | US6784533 Semiconductor device |
| 08/31/2004 | US6784532 Power/ground configuration for low impedance integrated circuit |
| 08/31/2004 | US6784531 Power distribution plane layout for VLSI packages |
| 08/31/2004 | US6784530 Circuit component built-in module with embedded semiconductor chip and method of manufacturing |
| 08/31/2004 | US6784528 Shorten a time taken to manufacture the semiconductor device by simplifying a providing method of a wiring that electrically connects the semiconductor integrated circuit to the substrate |
| 08/31/2004 | US6784525 Semiconductor component having multi layered leadframe |
| 08/31/2004 | US6784524 Stress shield for microelectronic dice |
| 08/31/2004 | US6784523 Method of fabricating semiconductor device |
| 08/31/2004 | US6784522 Electronic semiconductor device having a thermal spreader |
| 08/31/2004 | US6784516 Insulative cap for laser fusing |
| 08/31/2004 | US6784503 Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration |
| 08/31/2004 | US6784502 Method of forming contacts, methods of contacting lines, methods of operating integrated circuitry, and integrated circuits |
| 08/31/2004 | US6784501 Process for forming metalized contacts to periphery transistors |
| 08/31/2004 | US6784498 Low capacitance ESD protection device and integrated circuit including the same |
| 08/31/2004 | US6784497 Semiconductor device |
| 08/31/2004 | US6784496 Circuit and method for an integrated charged device model clamp |
| 08/31/2004 | US6784485 Diffusion barrier layer and semiconductor device containing same |
| 08/31/2004 | US6784478 Junction capacitor structure and fabrication method therefor in a dual damascene process |
| 08/31/2004 | US6784457 Semiconductor device and manufacturing method thereof |
| 08/31/2004 | US6784409 Electronic device with encapsulant of photo-set resin and production process of same |
| 08/31/2004 | US6784378 Compliant off-chip interconnects |
| 08/31/2004 | US6784376 Solderable injection-molded integrated circuit substrate and method therefor |
| 08/31/2004 | US6784374 Printed wiring board and manufacturing method therefor |
| 08/31/2004 | US6784367 Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies |
| 08/31/2004 | US6784123 Insulation film on semiconductor substrate and method for forming same |
| 08/31/2004 | US6784121 Integrated circuit dielectric and method |
| 08/31/2004 | US6784119 Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition |
| 08/31/2004 | US6784113 Chip on board and heat sink attachment methods |
| 08/31/2004 | US6784109 Method for fabricating semiconductor devices including wiring forming with a porous low-k film and copper |
| 08/31/2004 | US6784102 Laterally interconnecting structures |
| 08/31/2004 | US6784099 Dual-sided semiconductor device and method of forming the device with a resistive element that requires little silicon surface area |
| 08/31/2004 | US6784097 Method of manufacturing a semiconductor device with a self-aligned contact |
| 08/31/2004 | US6784092 Method of forming insulating film and method of manufacturing semiconductor device |
| 08/31/2004 | US6784089 Flat-top bumping structure and preparation method |
| 08/31/2004 | US6784088 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped |
| 08/31/2004 | US6784087 Method of fabricating cylindrical bonding structure |
| 08/31/2004 | US6784086 Lead-free solder structure and method for high fatigue life |
| 08/31/2004 | US6784066 Method for manufacturing semiconductor device and semiconductor device manufactured thereby |
| 08/31/2004 | US6784050 Fringing capacitor structure |
| 08/31/2004 | US6784045 Microchannel formation for fuses, interconnects, capacitors, and inductors |
| 08/31/2004 | US6784041 Semiconductor device and method of manufacturing the same |
| 08/31/2004 | US6784027 Light-emitting semiconductor component |
| 08/31/2004 | US6784026 Microelectronic die including low RC under-layer interconnects |
| 08/31/2004 | US6784022 Method of dicing a semiconductor wafer and heat sink into individual semiconductor integrated circuits |
| 08/31/2004 | US6784021 Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatus |
| 08/31/2004 | US6784020 Package structure and method for making the same |
| 08/31/2004 | US6784019 Intercrossedly-stacked dual-chip semiconductor package and method of fabricating the same |
| 08/31/2004 | US6784002 Method to make wafer laser marks visable after bumping process |
| 08/31/2004 | US6784000 Method for measurement of electromigration in semiconductor integrated circuits |
| 08/31/2004 | US6783867 High melting point metallizing layer, which consists mainly of a high melting point metal such as w and/or mo, and an intervening metal layer, which has a melting point of not greater than 1,000 degrees c. and consists mainly of at least |
| 08/31/2004 | US6783862 Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures |
| 08/31/2004 | US6783859 Waterproofing; protective coatings for semiconductor |
| 08/31/2004 | US6783828 Resin composition, adhesive film for semiconductor device, and laminated film with metallic foil and semiconductor device using the same |
| 08/31/2004 | US6783811 Uv light irradiation process on a metal oxide film in vacuum or in an atmosphere of reducing gas at a temperature maintained between 25 degrees c. and 300 degrees c to reduce resistance |
| 08/31/2004 | US6783801 Methods for making a paste of materials to form bumps for screen print processes |
| 08/31/2004 | US6783589 Diamondoid-containing materials in microelectronics |
| 08/31/2004 | US6783393 Package for opto-electrical components |
| 08/31/2004 | US6782942 Tabular heat pipe structure having support bodies |
| 08/31/2004 | US6782941 Heatsink and heatsink device using the heatsink |
| 08/31/2004 | US6782897 Method of protecting a passivation layer during solder bump formation |
| 08/31/2004 | US6782745 Slosh supressor and heat sink |
| 08/31/2004 | US6782613 Interposer structures having formed thereon a plurality of conductive pillars or recesses that are adapted to make electrical contact with the leads of an integrated circuit package |
| 08/31/2004 | US6782612 Manufacturing process of IC module |
| 08/31/2004 | US6782611 Method of assembling a multi-chip device |
| 08/31/2004 | US6782610 Method for fabricating a wiring substrate by electroplating a wiring film on a metal base |