| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/02/2004 | US20040169276 Method of packaging a semiconductor chip |
| 09/02/2004 | US20040169275 Area-array device assembly with pre-applied underfill layers on printed wiring board |
| 09/02/2004 | US20040169274 Semiconductor devices and methods for manufacturing the same |
| 09/02/2004 | US20040169273 Ball grid array semiconductor package and method of fabricating the same |
| 09/02/2004 | US20040169272 Chip on board with heat sink attachment and assembly |
| 09/02/2004 | US20040169271 Circuit device and method of manufacture thereof |
| 09/02/2004 | US20040169270 Semiconductor device and lead frame used therefor |
| 09/02/2004 | US20040169268 Circuit arrangement |
| 09/02/2004 | US20040169267 Chip shaped electronic device and a method of producing the same |
| 09/02/2004 | US20040169266 Power supply packaging system |
| 09/02/2004 | US20040169265 Two-stage transfer molding device to encapsulate MMC module |
| 09/02/2004 | US20040169264 Integrated chip package structure using organic substrate and method of manufacturing the same |
| 09/02/2004 | US20040169263 Compliant package with conductive elastomeric posts |
| 09/02/2004 | US20040169262 Co-packaged control circuit, transistor and inverted diode |
| 09/02/2004 | US20040169261 Lead frame and its manufacturing method |
| 09/02/2004 | US20040169260 Actively-shielded signal wires |
| 09/02/2004 | US20040169258 Semiconductor wafer having separation groove on insulating film on dicing line region and its manufacturing method |
| 09/02/2004 | US20040169255 Semiconductor device and method of manufacturing same |
| 09/02/2004 | US20040169254 Shallow trench antifuse and methods of making and using same |
| 09/02/2004 | US20040169237 Semiconductor integrated circuit device |
| 09/02/2004 | US20040169234 Bipolar ESD protection structure |
| 09/02/2004 | US20040169232 Semiconductor apparatus with improved ESD withstanding voltage |
| 09/02/2004 | US20040169231 Bipolar ESD protection structure |
| 09/02/2004 | US20040169230 Bipolar ESD protection structure |
| 09/02/2004 | US20040169229 Semiconductor structure comprising an electrostatic discharge (esd) protection device |
| 09/02/2004 | US20040169216 Semiconductor device and method of manufacturing same |
| 09/02/2004 | US20040169206 Semiconductor memory devices having dummy active regions |
| 09/02/2004 | US20040169203 Bumped die and wire bonded board-on-chip package |
| 09/02/2004 | US20040169198 Semiconductor device |
| 09/02/2004 | US20040169190 Semiconductor pressure sensor device |
| 09/02/2004 | US20040169086 Ic card |
| 09/02/2004 | US20040168826 Selectively configurable circuit board |
| 09/02/2004 | US20040168825 Multilayer printed circuit board and multilayer printed circuit board manufacturing method |
| 09/02/2004 | US20040168819 Header assembly for optoelectronic devices |
| 09/02/2004 | US20040168447 Cooling apparatus boiling and condensing refrigerant with low height and easily assembled |
| 09/02/2004 | DE20313842U1 Chipträgerelement und Bauelementgehäuse Chip carrier element and component housing |
| 09/02/2004 | DE202004010401U1 Small lead-free metallic heat conductive plate useful for cooling personal computer processors is based on cobalt crystallization phase change at low temperature |
| 09/02/2004 | DE202004010340U1 Internal cooling system for electronic equipment has top and bottom sets of cooling fins mounted on framework with deep cooling chip which has a temperature less than room temperature on one face |
| 09/02/2004 | DE202004007471U1 Fanless heat sink arrangement for a computer processor, has a heat conducting plate brought into close contact with the processor surface by a spring mechanism with a heat pipe in turn connected to the conducting plate |
| 09/02/2004 | DE10358641A1 Kühlervorrichtung zum beidseitigen Kühlen einer Halbleitervorrichtung Cooler device for double-sided cooling a semiconductor device |
| 09/02/2004 | DE10339022A1 Halbleitervorrichtung Semiconductor device |
| 09/02/2004 | DE10334426A1 Halbleitervorrichtung Semiconductor device |
| 09/02/2004 | DE10324615A1 Electronic component comprises a semiconductor chip with contact surfaces on an active surface, a plastic housing composition in which the chip with side edges and a rear side are embedded, and a heat-conducting plate |
| 09/02/2004 | DE10307800A1 Halbleiterbauteil Semiconductor device |
| 09/02/2004 | DE10297047T5 Lötfreie Leiterplatten-Baugruppe Solderless PCB assembly |
| 09/02/2004 | DE10250621B4 Verfahren zum Erzeugen verkapselter Chips und zum Erzeugen eines Stapels aus den verkapselten Chips A method for generating encapsulated chips and for producing a stack of the encapsulated chips |
| 09/02/2004 | DE10145752B4 Nicht-leitendes, ein Band oder einen Nutzen bildendes Substrat, auf dem eine Vielzahl von Trägerelementen ausgebildet ist Non-conductive, tape, or a benefit-forming substrate on which a plurality of carrier elements is |
| 09/02/2004 | CA2516058A1 Flip-chip component packaging process and flip-chip component |
| 09/01/2004 | EP1453092A2 Semiconductor integrated device and apparatus for designing the same |
| 09/01/2004 | EP1453091A1 Ceramic multilayer board with monolithic layer structure and method for the production thereof |
| 09/01/2004 | EP1453090A2 Manufacturing method of semiconductor device |
| 09/01/2004 | EP1453089A2 Semiconductor substrate of high reliability |
| 09/01/2004 | EP1452614A1 Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it |
| 09/01/2004 | EP1452566A1 Thermosetting resin composition, process for producing the same, and suspension-form mixture |
| 09/01/2004 | EP1452326A2 Method and apparatus for fixing a functional material onto a surface |
| 09/01/2004 | EP1451873A2 Wearable biomonitor with flexible thinned integrated circuit |
| 09/01/2004 | EP1451871A2 Semiconductor device, and means for checking the authenticity |
| 09/01/2004 | EP1451870A2 Semiconductor with multiple rows of bond pads |
| 09/01/2004 | EP1451869A2 Semiconductor device and method of enveloping an integrated circuit |
| 09/01/2004 | EP1451866A2 Method of manufacturing circuits |
| 09/01/2004 | EP1451860A1 Cmos process with an integrated, high performance, silicide agglomeration fuse |
| 09/01/2004 | EP1451858A1 Interconnects with improved barrier layer adhesion |
| 09/01/2004 | EP1451771A1 Method for making a module comprising at least an electronic component |
| 09/01/2004 | EP1451759A2 Semiconductor device, card, methods of initializing, checking the authenticity and the identity thereof |
| 09/01/2004 | CN2638241Y Improved glass sealed diode |
| 09/01/2004 | CN2638240Y Radiator of central processor |
| 09/01/2004 | CN2638239Y Radiator device |
| 09/01/2004 | CN2638238Y Fixed device for radiator mechanism |
| 09/01/2004 | CN1526169A Method of producing a lamp |
| 09/01/2004 | CN1526168A Single package containing multiple integrated circuit devices |
| 09/01/2004 | CN1526167A Lead frame and its manufacturing method |
| 09/01/2004 | CN1526166A Electronic package with high density interconnect and associated methods |
| 09/01/2004 | CN1526165A Improved surface mount package |
| 09/01/2004 | CN1526164A Liquid-cooled power semiconductor device heatsink |
| 09/01/2004 | CN1526162A Use of diverse materials in air-cavity packaging of electronic devices |
| 09/01/2004 | CN1526029A Thermal interface material and heat sink configuration |
| 09/01/2004 | CN1525988A Fluorinated aromatic polymer and use thereof |
| 09/01/2004 | CN1525811A Power ring architecture for embedded low drop off voltage reglators |
| 09/01/2004 | CN1525809A Case body for electronic component embarkation and formation method thereof |
| 09/01/2004 | CN1525804A Circuit board and its manufacturing method |
| 09/01/2004 | CN1525644A 半导体集成电路器件 The semiconductor integrated circuit device |
| 09/01/2004 | CN1525631A Microminiature power converter |
| 09/01/2004 | CN1525571A Semiconductor device possessing connection bonding pad and manufacturing method thereof |
| 09/01/2004 | CN1525565A Semiconductor integrated device and apparatus for designing the same |
| 09/01/2004 | CN1525564A 电子电路装置 Electronic circuit means |
| 09/01/2004 | CN1525563A Semiconductor device and method of manufacturing same |
| 09/01/2004 | CN1525562A Semiconductor device and method of manufacturing same |
| 09/01/2004 | CN1525559A Wiring substrate |
| 09/01/2004 | CN1525558A Heatsink arrangement for semiconductor device |
| 09/01/2004 | CN1525557A Light sensitive element packaging material combination and using method thereof |
| 09/01/2004 | CN1525556A Wiring substrate |
| 09/01/2004 | CN1525555A Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus |
| 09/01/2004 | CN1525545A Soft soldering method for semiconductor components and semiconductor device |
| 09/01/2004 | CN1525544A Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 09/01/2004 | CN1525543A Method for fabricating a thin film semiconductor device |
| 09/01/2004 | CN1525272A Fan controlling equipment and method |
| 09/01/2004 | CN1165209C Method for manufacturing multilayer integrated substrate and multilayer ceramic element |
| 09/01/2004 | CN1165082C Ring semiconductor controlled rectifier assembly |
| 09/01/2004 | CN1165081C Robust interconnect structure |
| 09/01/2004 | CN1165080C Cooling apparatus for boiling and condensing refrigerant |