| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/07/2004 | US6787705 Interconnection structure of semiconductor element |
| 09/07/2004 | US6787700 Structure of joining chip part to bus bars |
| 09/07/2004 | US6787480 Manufacturing method of semicondcutor device |
| 09/07/2004 | US6787467 Method of forming embedded copper interconnections and embedded copper interconnection structure |
| 09/07/2004 | US6787460 Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses and conductive contacts so formed |
| 09/07/2004 | US6787449 Method for the formation of RuSixOy-containing barrier layers for high-k dielectrics |
| 09/07/2004 | US6787445 Method for fabricating semiconductor device |
| 09/07/2004 | US6787444 Interconnection structures and methods of fabrication |
| 09/07/2004 | US6787442 Method of making a semiconductor having multi-layered electrodes including nickel and phosphorus and solder formed with tin and an alkaline earth metal |
| 09/07/2004 | US6787431 Method and semiconductor wafer configuration for producing an alignment mark for semiconductor wafers |
| 09/07/2004 | US6787399 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 09/07/2004 | US6787398 Method of fabricating a high frequency signal amplification device |
| 09/07/2004 | US6787397 Semiconductor device protective overcoat with enhanced adhesion to polymeric materials and method of fabrication |
| 09/07/2004 | US6787396 Method of manufacturing LOC semiconductor assembled with room temperature adhesive |
| 09/07/2004 | US6787395 Method of manufacturing a multi-chip module |
| 09/07/2004 | US6787394 Methods of wafer level fabrication and assembly of chip scale packages |
| 09/07/2004 | US6787393 Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor package |
| 09/07/2004 | US6787392 Structure and method of direct chip attach |
| 09/07/2004 | US6787390 Electrical and thermal contact for use in semiconductor devices |
| 09/07/2004 | US6787389 Semiconductor device having pads for connecting a semiconducting element to a mother board |
| 09/07/2004 | US6787388 Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD device |
| 09/07/2004 | US6787380 Electrically-conductive grid shield for semiconductors |
| 09/07/2004 | US6787247 Injection molded heat dissipation device |
| 09/07/2004 | US6787242 Adhesion promoters for polymer coatings on metals are articulated into at least two head groups connected by a hydrocarbon spacer group. one head group reacts particularly well with polymer molecules. other head groups form a durable |
| 09/07/2004 | US6787093 Semiconductor resin molding method |
| 09/07/2004 | US6786385 Semiconductor device with gold bumps, and method and apparatus of producing the same |
| 09/07/2004 | CA2459216A1 Circuit arrangement for components to be cooled and corresponding cooling method |
| 09/02/2004 | WO2004075370A2 Minimum-dimension, fully-silicided mos driver and esd protection design for optimized inter-finger coupling |
| 09/02/2004 | WO2004075336A1 High frequency circuit |
| 09/02/2004 | WO2004075312A1 Packaging of organic light-emitting diodes using reactive polyurethane |
| 09/02/2004 | WO2004075305A1 Semi-conductor component with an encapsulation made of elastic material |
| 09/02/2004 | WO2004075294A2 Flip-chip component packaging process and flip-chip component |
| 09/02/2004 | WO2004075293A1 Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device |
| 09/02/2004 | WO2004075292A1 Cooling assembly comprising micro-jets |
| 09/02/2004 | WO2004075291A1 Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member |
| 09/02/2004 | WO2004075290A1 Semiconductor module |
| 09/02/2004 | WO2004075289A1 Cover glass for semiconductor package and method for producing same |
| 09/02/2004 | WO2004075288A1 Integrated electronic component having specifically produced nanotubes in vertical structures |
| 09/02/2004 | WO2004075282A1 Semiconductor device and radiation detector employing it |
| 09/02/2004 | WO2004075281A1 Semiconductor device and radiation detector employing it |
| 09/02/2004 | WO2004075280A1 Semiconductor device |
| 09/02/2004 | WO2004075267A1 Semiconductor device and semiconductor production management system |
| 09/02/2004 | WO2004075265A2 Methods for selectively bumping integrated circuit substrates and related structures |
| 09/02/2004 | WO2004075261A2 Thermal interconnect systems methods of production and uses thereof |
| 09/02/2004 | WO2004075254A2 Electronic component and method of manufacturing same |
| 09/02/2004 | WO2004075221A2 Micro fuse |
| 09/02/2004 | WO2004074366A2 Molding compositions containing quaternary organophosphonium salts |
| 09/02/2004 | WO2004074210A1 Ceramics-metal composite body and method of producing the same |
| 09/02/2004 | WO2004074168A2 Packaged microchip with thermal stress relief |
| 09/02/2004 | WO2004051743A3 Radiation protection in integrated circuits |
| 09/02/2004 | US20040172606 Semiconductor device having embedded array |
| 09/02/2004 | US20040171921 Analyte monitoring device and methods of use |
| 09/02/2004 | US20040171277 Method of forming a conductive metal line over a semiconductor wafer |
| 09/02/2004 | US20040171269 Substrate processing method |
| 09/02/2004 | US20040171264 Methods of polishing, interconnect-fabrication, and producing semiconductor devices |
| 09/02/2004 | US20040171263 Method for forming fuse integrated with dual damascene process |
| 09/02/2004 | US20040171256 Mask layer and interconnect structure for dual damascene semiconductor manufacturing |
| 09/02/2004 | US20040171249 Low-loss coplanar waveguides and method of fabrication |
| 09/02/2004 | US20040171246 Method of improving copper interconnect of semiconductor devices for bonding |
| 09/02/2004 | US20040171239 Method of manufacturing semiconductor device having MIM capacitor element |
| 09/02/2004 | US20040171218 Semiconductor memory devices having dummy active regions |
| 09/02/2004 | US20040171214 Capacitor, circuit board, method of formation of capacitor, and method of production of circuit board |
| 09/02/2004 | US20040171203 Agglomeration control using early transition metal alloys |
| 09/02/2004 | US20040171200 Active matrix substrate for liquid crystal display and its fabrication |
| 09/02/2004 | US20040171195 Semiconductor wafer having a metal silicate dielectric layer with a dopant having dissociable oxygen, particularly CaO or SrO; enhanced electrical properties; CMOS gates, memory cells, and capacitors |
| 09/02/2004 | US20040171194 Method and apparatus for packaging electronic components |
| 09/02/2004 | US20040171193 Semiconductor device and its manufacturing method |
| 09/02/2004 | US20040171192 Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card |
| 09/02/2004 | US20040171191 planarized wire bonding contacts on the die contacts, and a planarized polymer layer encapsulating the wire bonding contacts, which prevents contact between the die encapsulant and the integrated circuits and functions as a stress defect barrier |
| 09/02/2004 | US20040171190 Circuit substrate device, method for producing the same, semiconductor device and method for producing the same |
| 09/02/2004 | US20040171189 Semiconductor plastic package and process for the production thereof |
| 09/02/2004 | US20040171186 Method of protecting microfabricated devices with protective caps |
| 09/02/2004 | US20040171179 Substrate mapping |
| 09/02/2004 | US20040170927 for organic light emitting displays; solar cells |
| 09/02/2004 | US20040170825 Device cover having a gapped adhesive preform thereon for covering a device on an electronic substrate |
| 09/02/2004 | US20040170820 Multimetallic nanofillers with domain size less than 100 nanometers exhibiting transparency to visible light that differs by more than 20% as compared to fillers having a domain size of at least one micron. |
| 09/02/2004 | US20040170819 Encapsulation using microcellular foamed materials |
| 09/02/2004 | US20040170766 Electroless plating method and device, and substrate processing method and apparatus |
| 09/02/2004 | US20040170754 polyamic acid contained in an adhesive layer is partially imidated, and after forming a porous layer, both layers are subjected to imide conversion; adhesive strength between adhesive layer and porous layer increases |
| 09/02/2004 | US20040170513 Fluid drive unit and heat transport system |
| 09/02/2004 | US20040170006 Interconnect module with reduced power distribution impedance |
| 09/02/2004 | US20040170004 Industrial ethernet switch |
| 09/02/2004 | US20040170001 Heat sink mounting assembly |
| 09/02/2004 | US20040170000 Heat dissipating device and electronic apparatus including the same |
| 09/02/2004 | US20040169998 Coated heat spreaders |
| 09/02/2004 | US20040169833 Exposure apparatus and exposure method |
| 09/02/2004 | US20040169541 Semiconductor integrated device and apparatus for designing the same |
| 09/02/2004 | US20040169474 Fine particle sizes; narrow particle size distribution |
| 09/02/2004 | US20040169444 Method of producing piezoelectric component and piezoelectric component |
| 09/02/2004 | US20040169316 Encapsulation method and leadframe for leadless semiconductor packages |
| 09/02/2004 | US20040169292 Standoffs for centralizing internals in packaging process |
| 09/02/2004 | US20040169291 [bump layout on silicon chip] |
| 09/02/2004 | US20040169289 Semiconductor device, a method of manufacturing the same and an electronic device |
| 09/02/2004 | US20040169287 Flip-chip type semiconductor device and method of manufacturing the same |
| 09/02/2004 | US20040169286 Semiconductor device and method for manufacturing the same |
| 09/02/2004 | US20040169285 Memory module having interconnected and stacked integrated circuits |
| 09/02/2004 | US20040169283 Integrated circuit devices and methods of forming the same that have a low dielectric insulating interlayer between conductive structures |
| 09/02/2004 | US20040169282 Semiconductor device and method of fabricating the same |
| 09/02/2004 | US20040169278 Bumped die and wire bonded board-on-chip package |
| 09/02/2004 | US20040169277 Multileveled printed circuit board unit including substrate interposed between stacked bumps |