| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/08/2004 | CN2640038Y Chip packing structure |
| 09/08/2004 | CN2640037Y Integral circuit keyset |
| 09/08/2004 | CN2639946Y Computer heat sink |
| 09/08/2004 | CN2639945Y Universal computer heat-sink finned sheet base |
| 09/08/2004 | CN2639683Y High luminous effect cold light lamp for landscape |
| 09/08/2004 | CN1528039A Voltage limiting protection for high frequency power device |
| 09/08/2004 | CN1528018A High performance silicon contact for flip chip |
| 09/08/2004 | CN1528017A A cooling arrangement for an integrated circuit |
| 09/08/2004 | CN1528014A Chip lead frames |
| 09/08/2004 | CN1528012A Structural reinforcement of highly porous low k dielectric films by ILD posts |
| 09/08/2004 | CN1528002A Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat disspation work |
| 09/08/2004 | CN1527928A Apparatus and method for controlling the temperature of an integrated circuit device |
| 09/08/2004 | CN1527888A Electroless-plating solution and semiconductor device |
| 09/08/2004 | CN1527793A Method for forming microelectronic spring structures on a substrate |
| 09/08/2004 | CN1527407A Semiconductor device and producing method thereof |
| 09/08/2004 | CN1527384A 半导体器件 Semiconductor devices |
| 09/08/2004 | CN1527382A Structure of pad in IC and its formation process |
| 09/08/2004 | CN1527376A Method for forming distribution structure |
| 09/08/2004 | CN1527375A Solid through hole structure and method |
| 09/08/2004 | CN1527372A Equipment for arranging and distributing welding flux column according to array |
| 09/08/2004 | CN1527370A Method for producing semiconductor device |
| 09/08/2004 | CN1527367A Diode making process and structure |
| 09/08/2004 | CN1527366A Mechanical performace to improve compact and porous organic silicate material by ultraviolet radiation |
| 09/08/2004 | CN1527115A Thin film transistor and electronic device and producing method thereof |
| 09/08/2004 | CN1527102A Film forming method and apparatus, method and apparatus for producing base plate and electronic equipment |
| 09/08/2004 | CN1527065A Magnetic sensor and producing method thereof |
| 09/08/2004 | CN1526682A Glass ceramics synthetic and sintered glass ceramics used in circuit board |
| 09/08/2004 | CN1165992C Semiconductor chip with surface covering layer |
| 09/08/2004 | CN1165991C Semi-conductor and its producing method |
| 09/08/2004 | CN1165990C Metal material for electronic unit, electronic unit, electronic equipment and treating method for metal material |
| 09/08/2004 | CN1165989C Semiconductor and method for producing same |
| 09/08/2004 | CN1165986C Fabrication method for sell aligned Cu diffusion barrier in integrated circuit |
| 09/08/2004 | CN1165980C Semiconductor device and testing method for mfg. same |
| 09/08/2004 | CN1165979C Integrated circuit package method |
| 09/08/2004 | CN1165978C Mounting structure, method of manufacturing the same |
| 09/08/2004 | CN1165874C Reinforced integrated circuit |
| 09/08/2004 | CN1165592C Curable epoxy-based compositions |
| 09/08/2004 | CN1165584C Polyarylene sulfide resin composition for electronic part encapsulation |
| 09/08/2004 | CN1165564C Polyacrylene compositions with enhanced modulus profiles |
| 09/07/2004 | US6789238 System and method to improve IC fabrication through selective fusing |
| 09/07/2004 | US6788598 Test key for detecting overlap between active area and deep trench capacitor of a DRAM and detection method thereof |
| 09/07/2004 | US6788561 Semiconductor integrated circuit device with reduced coupling noise |
| 09/07/2004 | US6788552 Method and apparatus for reducing substrate bias voltage drop |
| 09/07/2004 | US6788546 Multi-chip module |
| 09/07/2004 | US6788545 Composite electronic component and method of producing same |
| 09/07/2004 | US6788538 Retention of heat sinks on electronic packages |
| 09/07/2004 | US6788536 Fan holder for heat sink |
| 09/07/2004 | US6788522 Multi-layered unit including electrode and dielectric layer |
| 09/07/2004 | US6788171 Millimeter wave (MMW) radio frequency transceiver module and method of forming same |
| 09/07/2004 | US6788135 Terminating pathway for a clock signal |
| 09/07/2004 | US6788129 Integrated circuit having a programmable element and method of operating the circuit |
| 09/07/2004 | US6788084 Temperature control of electronic devices using power following feedback |
| 09/07/2004 | US6788074 System and method for using a capacitance measurement to monitor the manufacture of a semiconductor |
| 09/07/2004 | US6787930 Alignment marks and manufacturing method for the same |
| 09/07/2004 | US6787928 Integrated circuit device having pads structure formed thereon and method for forming the same |
| 09/07/2004 | US6787927 Plurality of bonding wires electrically connecting the bonding pads and the corresponding inner leads, each bonding wire has a plurality of bends electrically isolated from conductive parts on the chip |
| 09/07/2004 | US6787926 Wire stitch bond on an integrated circuit bond pad and method of making the same |
| 09/07/2004 | US6787924 Semiconductor device capable of preventing solder balls from being removed in reinforcing pad |
| 09/07/2004 | US6787923 Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks |
| 09/07/2004 | US6787922 Semiconductor chip—mounting board |
| 09/07/2004 | US6787921 During the reflowing process, the carrier is supported by the solder balls having high-melting-temperature cores, so that the collapse level is controlled |
| 09/07/2004 | US6787920 Electronic circuit board manufacturing process and associated apparatus |
| 09/07/2004 | US6787918 Substrate structure of flip chip package |
| 09/07/2004 | US6787916 Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity |
| 09/07/2004 | US6787915 Rearrangement sheet, semiconductor device and method of manufacturing thereof |
| 09/07/2004 | US6787914 Tungsten-based interconnect that utilizes thin titanium nitride layer |
| 09/07/2004 | US6787912 Barrier material for copper structures |
| 09/07/2004 | US6787909 High frequency semiconductor device |
| 09/07/2004 | US6787908 Pad metallization over active circuitry |
| 09/07/2004 | US6787907 Semiconductor device with dual damascene wiring |
| 09/07/2004 | US6787906 Bit line pad and borderless contact on bit line stud with localized etch stop layer formed in an undermined region |
| 09/07/2004 | US6787904 Semiconductor integrated circuit device |
| 09/07/2004 | US6787903 Semiconductor device with under bump metallurgy and method for fabricating the same |
| 09/07/2004 | US6787902 Package structure with increased capacitance and method |
| 09/07/2004 | US6787901 Stacked dies utilizing cross connection bonding wire |
| 09/07/2004 | US6787900 Semiconductor module and insulating substrate thereof |
| 09/07/2004 | US6787897 Wafer-level package with silicon gasket |
| 09/07/2004 | US6787896 Semiconductor die package with increased thermal conduction |
| 09/07/2004 | US6787895 Leadless chip carrier for reduced thermal resistance |
| 09/07/2004 | US6787894 Apparatus and method for leadless packaging of semiconductor devices |
| 09/07/2004 | US6787893 Pillar member made of aluminum or copper is bonded to a copper pattern which is interposed between the semiconductor element and the insulating substrate, an electroconductive path is formed |
| 09/07/2004 | US6787892 Semiconductor device and semiconductor device manufacturing method |
| 09/07/2004 | US6787889 Multilevel leadframe for a packaged integrated circuit and method of fabrication |
| 09/07/2004 | US6787888 High permeability composite films to reduce noise in high speed interconnects |
| 09/07/2004 | US6787886 Semiconductor device and methods of fabricating the same |
| 09/07/2004 | US6787885 Low temperature hydrophobic direct wafer bonding |
| 09/07/2004 | US6787882 Semiconductor varactor diode with doped heterojunction |
| 09/07/2004 | US6787880 ESD parasitic bipolar transistors with high resistivity regions in the collector |
| 09/07/2004 | US6787878 Semiconductor device having a potential fuse, and method of manufacturing the same |
| 09/07/2004 | US6787876 Semiconductor device |
| 09/07/2004 | US6787875 Self-aligned vias in an integrated circuit structure |
| 09/07/2004 | US6787873 Semiconductor device for providing a noise shield |
| 09/07/2004 | US6787870 Semiconductor component with integrated circuit, cooling body, and temperature sensor |
| 09/07/2004 | US6787855 Semiconductor device and method of manufacturing same |
| 09/07/2004 | US6787833 Integrated circuit having a barrier structure |
| 09/07/2004 | US6787815 High-isolation semiconductor device |
| 09/07/2004 | US6787803 Test patterns for measurement of low-k dielectric cracking thresholds |
| 09/07/2004 | US6787801 Wafer with additional circuit parts in the kerf area for testing integrated circuits on the wafer |
| 09/07/2004 | US6787799 Device and method for detecting a reliability of integrated semiconductor components at high temperatures |
| 09/07/2004 | US6787706 Ceramic circuit board |