| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/09/2004 | US20040174677 CPU and electronic chipset cooler |
| 09/09/2004 | US20040174655 Interdigitated capacitor structure for an integrated circuit |
| 09/09/2004 | US20040174651 Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials |
| 09/09/2004 | US20040174484 Active matrix type liquid crystal display device and method of manufacturing the same |
| 09/09/2004 | US20040174231 High-frequency semiconductor device |
| 09/09/2004 | US20040174228 High-frequency circuit and high-frequency package |
| 09/09/2004 | US20040174223 High speed electronics interconnect and method of manufacture |
| 09/09/2004 | US20040174179 Modifying a semiconductor device to provide electrical parameter monitoring |
| 09/09/2004 | US20040174164 Magnetic sensor and method for fabricating the same |
| 09/09/2004 | US20040173941 Exposed die molding apparatus |
| 09/09/2004 | US20040173917 pad for external connection may not be corroded irrespective of a connected state of a wire; chip-on-chip structure; surface protective film for covering internal wiring |
| 09/09/2004 | US20040173916 Pressure and heat cured semiconductor die packages having reduced voids in a die attach bondline |
| 09/09/2004 | US20040173915 Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same |
| 09/09/2004 | US20040173914 Semiconductor device |
| 09/09/2004 | US20040173913 Capacitive semiconductor sensor |
| 09/09/2004 | US20040173912 Damascene processes for forming conductive structures |
| 09/09/2004 | US20040173911 Semiconductor device |
| 09/09/2004 | US20040173910 to reduce the effective dielectric constant of the insulating film while maintaining better reliability of the semiconductor device, which otherwise may be deteriorated by a moisture absorption |
| 09/09/2004 | US20040173909 Conductive through wafer vias |
| 09/09/2004 | US20040173908 Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof |
| 09/09/2004 | US20040173907 Bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structures and method thereof |
| 09/09/2004 | US20040173906 Semiconductor integrated circuit device and fabrication process thereof |
| 09/09/2004 | US20040173905 Interconnection structure |
| 09/09/2004 | US20040173904 Integrated circuit feature layout for improved chemical mechanical polishing |
| 09/09/2004 | US20040173903 Thin type ball grid array package |
| 09/09/2004 | US20040173902 Ball grid array package stack |
| 09/09/2004 | US20040173901 Thermally enhanced electronic flip-chip packaging with external-connector side die and method |
| 09/09/2004 | US20040173900 [contact structure and manufacturing method thereof] |
| 09/09/2004 | US20040173899 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
| 09/09/2004 | US20040173898 Semiconductor apparatus having system-in-package arrangement with improved heat dissipation |
| 09/09/2004 | US20040173897 Heat spreader with down set leg attachment feature |
| 09/09/2004 | US20040173896 Plastic lead frames for semiconductor devices |
| 09/09/2004 | US20040173895 Semiconductor device and manufacturing method thereof |
| 09/09/2004 | US20040173894 Integrated circuit package including interconnection posts for multiple electrical connections |
| 09/09/2004 | US20040173893 Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings |
| 09/09/2004 | US20040173892 Multilayer laser trim interconnect method |
| 09/09/2004 | US20040173891 Intermediate board, intermediate board with a semiconductor device, substrate board with an intermediate board, structural member including a semiconductor device, an intermediate board and a substrate board, and method of producing an intermediate board |
| 09/09/2004 | US20040173890 Front-and-back electrically conductive substrate and method for manufacturing same |
| 09/09/2004 | US20040173889 Multiple die package |
| 09/09/2004 | US20040173888 Semiconductor package and semiconductor package mounting method |
| 09/09/2004 | US20040173887 Test vehicle ball grid array package |
| 09/09/2004 | US20040173885 Semiconductor device |
| 09/09/2004 | US20040173882 Plastic lead frames for semiconductor devices and packages including same |
| 09/09/2004 | US20040173881 Space-efficient package for laterally conducting device |
| 09/09/2004 | US20040173880 High speed electronics interconnect and method of manufacture |
| 09/09/2004 | US20040173879 High-frequency power amplifier |
| 09/09/2004 | US20040173878 Accessing internal nodes of flip-chip packaged integrated circuits to measure voltage transitions at the nodes. |
| 09/09/2004 | US20040173877 Semiconductor device and manufacturing method for same |
| 09/09/2004 | US20040173838 Semiconductor integrated circuit device and the method of producing the same |
| 09/09/2004 | US20040173825 Semiconductor devices and methods of forming the same |
| 09/09/2004 | US20040173822 High speed electronics interconnect and method of manufacture |
| 09/09/2004 | US20040173803 Interconnect structure having improved stress migration reliability |
| 09/09/2004 | US20040173797 Thin film transistor array panel for liquid crystal display |
| 09/09/2004 | US20040173751 Electronic device and method for manufacturing the same |
| 09/09/2004 | US20040173567 Method of forming a lamination film pattern and improved lamination film pattern |
| 09/09/2004 | US20040173392 Electrical apparatus, cooling system therefor, and electric vehicle |
| 09/09/2004 | US20040173375 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 09/09/2004 | US20040173372 Electronic component for adhesion of a plurality of electrodes and method of mounting the same |
| 09/09/2004 | US20040173371 Surface mounting package |
| 09/09/2004 | US20040173345 Thermal transfer interface system and methods |
| 09/09/2004 | US20040173339 Radiator fan |
| 09/09/2004 | US20040173338 Heat-transfer device |
| 09/09/2004 | US20040172819 Wiring board, method of manufacturing the same, semiconductor device, electronic module, and electronic apparatus |
| 09/09/2004 | US20040172818 Method of manufacturing solder mask of printed circuit board |
| 09/09/2004 | US20040172813 Method for manufacturing semiconductor device, semiconductor device, circuit board, and electronic apparatus |
| 09/09/2004 | DE202004009273U1 Cooling system for electronic components e.g. in computer, has pair of finned heat sink units together with electrical fans |
| 09/09/2004 | DE202004009233U1 Kühlkörper mit geneigten Flächen Heatsink with inclined surfaces |
| 09/09/2004 | DE202004004147U1 Cooling arrangement for removal of waste heat from output semi-conductors in control units for welding extruders, comprises a hollow cooling block through which cool air flows |
| 09/09/2004 | DE19520700B4 Halbleiterbausteinanordnung Semiconductor chip layout |
| 09/09/2004 | DE10350770A1 Druckkontakt-Halbleiterbauelement mit Blindsegment The pressure contact type semiconductor device having dummy segment |
| 09/09/2004 | DE10346292A1 Elktronikgehäuse mit anschlußleitungslosem Leitungsrahmen und Sensormodul, das dasselbe umfaßt Elktronikgehäuse with connection cable and Wi-lead frame sensor module comprising the same |
| 09/09/2004 | DE10309130A1 Fan-less cooling system for computer processor or power circuitry, has baseplate of high thermal conductivity, and e.g. aluminum plate connected to layer |
| 09/09/2004 | DE10308928A1 Direkt auf ungehäusten Bauelementen erzeugte freitragende Kontaktierstrukturen Directly generated on unpackaged devices cantilever contacting structures |
| 09/09/2004 | DE10307537A1 Integrated module with delay element has means of controlling and checking signal propagation times |
| 09/09/2004 | DE10306620A1 Integrated test circuit for testing integrated semiconductor circuits tests multiple internal voltages in an integrated circuit |
| 09/09/2004 | DE10240461A9 Universelles Gehäuse für ein elektronisches Bauteil mit Halbleiterchip und Verfahren zu seiner Herstellung Universal enclosure for an electronic device having semiconductor chip and process for its preparation |
| 09/09/2004 | DE102004009254A1 Halbleiter-Drucksensorvorrichtung A semiconductor pressure sensor device |
| 09/09/2004 | DE102004005685A1 Verfahren zum Herstellen einer elektronischen Komponente A method of manufacturing an electronic component |
| 09/09/2004 | DE102004004596A1 Programmieren von Antifuses mit unscharf vorgegebener Obergrenze für den Programmierstrom Antifuse programming with fuzzy predetermined upper limit for the programming current |
| 09/09/2004 | DE102004004532A1 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 09/09/2004 | DE10149688B4 Verfahren zum Herstellen einer Mikrokontaktfeder auf einem Substrat A method of manufacturing a micro-contact spring on a substrate |
| 09/09/2004 | DE10065722B9 Verfahren zur Herstellung einer elektrischen Verbindung und Vorrichtung mit einer elektrischen Verbindung A method for making an electrical connection and an electrical connection device with |
| 09/08/2004 | EP1455560A2 Circuit device for components which need to be cooled |
| 09/08/2004 | EP1455392A1 Semiconductor device and method for manufacturing the same |
| 09/08/2004 | EP1455391A1 Power semiconductor module with sensor |
| 09/08/2004 | EP1455302A1 Method for manufacturing an IC element including a coil |
| 09/08/2004 | EP1454956A1 Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials |
| 09/08/2004 | EP1454382A1 Interposer assembly for soldered electrical connections |
| 09/08/2004 | EP1454356A1 High frequency signal transmission structure |
| 09/08/2004 | EP1454349A2 Trilayered beam mems device and related methods |
| 09/08/2004 | EP1454339A1 An integrated circuit resistant to the formation of cracks in a passivation layer |
| 09/08/2004 | EP1454333A1 Mems device having a trilayered beam and related methods |
| 09/08/2004 | EP1454218A1 Chipset cooling device of video graphic adapter card |
| 09/08/2004 | EP1454108A1 Heat dissipating component using high conducting inserts |
| 09/08/2004 | EP0834243B1 Photolithographically patterned spring contact |
| 09/08/2004 | CN2640202Y High-density power source module packing structure |
| 09/08/2004 | CN2640042Y Appliance for manufacturing heat-cnoducting pipe |
| 09/08/2004 | CN2640041Y Heat pipe water-cooling heat-sink system |
| 09/08/2004 | CN2640040Y Heat-sink mould set |
| 09/08/2004 | CN2640039Y Improved CPU cooling structure |