| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/14/2004 | US6790789 Ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made |
| 09/14/2004 | US6790788 Method of improving stability in low k barrier layers |
| 09/14/2004 | US6790776 Barrier layer for electroplating processes |
| 09/14/2004 | US6790775 Method of forming a through-substrate interconnect |
| 09/14/2004 | US6790774 Method of forming a wiring film by applying high temperature/high pressure |
| 09/14/2004 | US6790767 Method for formation of copper diffusion barrier film using aluminum |
| 09/14/2004 | US6790763 Substrate processing method |
| 09/14/2004 | US6790761 Method of fabricating a semiconductor device |
| 09/14/2004 | US6790760 Method of manufacturing an integrated circuit package |
| 09/14/2004 | US6790759 Semiconductor device with strain relieving bump design |
| 09/14/2004 | US6790757 Wire bonding method for copper interconnects in semiconductor devices |
| 09/14/2004 | US6790752 Methods of controlling VSS implants on memory devices, and system for performing same |
| 09/14/2004 | US6790751 Semiconductor substrate for a one-chip electronic device and related manufacturing method |
| 09/14/2004 | US6790748 Thinning techniques for wafer-to-wafer vertical stacks |
| 09/14/2004 | US6790744 Monolithically integrated solid-state sige thermoelectric energy converter for high speed and low power circuits |
| 09/14/2004 | US6790723 Semiconductor device and method of manufacturing the same |
| 09/14/2004 | US6790712 Semiconductor device and method for fabricating the same |
| 09/14/2004 | US6790711 Method of making semiconductor device |
| 09/14/2004 | US6790710 Method of manufacturing an integrated circuit package |
| 09/14/2004 | US6790709 Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices |
| 09/14/2004 | US6790708 Encapsulation process using a partial slot cover and a package formed by the process |
| 09/14/2004 | US6790707 Method of preparing a sample of a semiconductor structure for adhesion testing |
| 09/14/2004 | US6790706 Apparatus and method for leadless packaging of semiconductor devices |
| 09/14/2004 | US6790705 Manufacturing method for semiconductor apparatus |
| 09/14/2004 | US6790704 Method for capacitively coupling electronic devices |
| 09/14/2004 | US6790703 Apparatus for aligning die to interconnect metal on flex substrate |
| 09/14/2004 | US6790702 Three-dimensional multichip module |
| 09/14/2004 | US6790695 Semiconductor device and method of manufacturing the same |
| 09/14/2004 | US6790694 High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same |
| 09/14/2004 | US6790685 Method of forming a test pattern, method of measuring an etching characteristic using the same and a circuit for measuring the etching characteristic |
| 09/14/2004 | US6790684 Wafer on wafer packaging and method of fabrication for full-wafer burn-in and testing |
| 09/14/2004 | US6790663 Methods of contacting lines and methods of forming an electrical contact in a semiconductor device |
| 09/14/2004 | US6790596 Having high sensitivity and causing less gelation |
| 09/14/2004 | US6790478 Method for selectively coating ceramic surfaces |
| 09/14/2004 | US6790381 Trivalent metallic atom complexes containig acetylacetonate and alcoholate |
| 09/14/2004 | US6790333 Applying functional alloy plating to an electronic component to be mounted using an electrolytic procedure with a pulse waveform, functional alloy plating comprising tin and silver |
| 09/14/2004 | US6789611 Bubble cycling heat exchanger |
| 09/14/2004 | US6789610 High performance cooling device with vapor chamber |
| 09/14/2004 | US6789609 Heat sink assembly structure |
| 09/14/2004 | CA2120523C Electrically conductive compositions and methods for the preparation and use thereof |
| 09/10/2004 | WO2004077899A1 Ceramic circuit board and conductive paste used therefor |
| 09/10/2004 | WO2004077896A2 Multi-die semiconductor package |
| 09/10/2004 | WO2004077638A1 Testing using independently controllable voltage islands |
| 09/10/2004 | WO2004077622A1 Dielectric sheet |
| 09/10/2004 | WO2004077575A1 Lead frame and light receiving module comprising it |
| 09/10/2004 | WO2004077561A1 Multilayer unit containing electrode layer and dielectric layer |
| 09/10/2004 | WO2004077560A1 Multilayer printed wiring board |
| 09/10/2004 | WO2004077559A1 Integrated circuit package and method for producing it |
| 09/10/2004 | WO2004077557A1 A plastics leadframe and an integrated circuit package fabricated using the leadframe |
| 09/10/2004 | WO2004077556A1 Semiconductor integrated circuit device and its power supply wiring method |
| 09/10/2004 | WO2004077549A1 Semiconductor device and radiation detector employing it |
| 09/10/2004 | WO2004077548A2 Connection technology for power semiconductors |
| 09/10/2004 | WO2004077547A2 Internal connection system for power semiconductors comprising large-area terminals |
| 09/10/2004 | WO2004077546A2 Self-supporting contacting structures that are directly produced on components without housings |
| 09/10/2004 | WO2004077532A1 Methods of forming electrical connections within ferroelectric devices |
| 09/10/2004 | WO2004077527A2 Area-array device assembly with pre-applied underfill layers on printed wiring board |
| 09/10/2004 | WO2004077525A2 Ball grid array with bumps |
| 09/10/2004 | WO2004077513A2 Packaging system for power supplies |
| 09/10/2004 | WO2004077508A2 Lead frame with included passive devices |
| 09/10/2004 | WO2004077506A2 Resistive vias in a substrate and method of making |
| 09/10/2004 | WO2004077499A2 Method for integration of single and dual gate logic into one mask set |
| 09/10/2004 | WO2004077463A1 Multilayer unit containing electrode layer and dielectric layer |
| 09/10/2004 | WO2004077450A1 Semiconductor chip arrangement with rom |
| 09/10/2004 | WO2004076952A1 Heat sunk, laser module, laser device, and laser-processing device |
| 09/10/2004 | WO2004076857A2 Method and apparatus for low-cost electrokinetic pump manufacturing |
| 09/10/2004 | WO2004076724A1 SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY, HEAT SINK USING THE SAME, AND METHOD FOR PRODUCING SURFACE-TREATED Al SHEET EXCELLENT IN SOLDERABILITY |
| 09/10/2004 | WO2004076585A1 Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device |
| 09/10/2004 | WO2004068576A3 Method of forming a catalyst containing layer over a patterned dielectric |
| 09/10/2004 | WO2004057666A3 Rf power transistor with internal bias feed |
| 09/10/2004 | WO2004053973A8 Method of packaging integrated circuits, and integrated circuit packages produced by the method |
| 09/10/2004 | WO2004020022A3 Valve pump |
| 09/10/2004 | WO2003085725A3 In package power supplies for integrated circuits |
| 09/10/2004 | CA2516404A1 Curable composition and method of preparing same, light-shielding paste,light-shielding resin and method of forming same, light-emitting diode package and semiconductor device |
| 09/09/2004 | US20040176488 dielectric constant of a blending material is decreased and the mechanical strength of the nanoporous aerogel is increased; near spherical nanopores; small pore size |
| 09/09/2004 | US20040175933 Method of forming wiring structure |
| 09/09/2004 | US20040175930 Method of manufacturing semiconductor device and semiconductor device |
| 09/09/2004 | US20040175927 Contact structure for an integrated semiconductor device |
| 09/09/2004 | US20040175920 Interface and method of forming an interface for a silicon contact |
| 09/09/2004 | US20040175918 Novel formation of an aluminum contact pad free of plasma induced damage by applying CMP |
| 09/09/2004 | US20040175917 Metal electrode and bonding method using the metal electrode |
| 09/09/2004 | US20040175916 Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| 09/09/2004 | US20040175915 Tape circuit board and semiconductor chip package including the same |
| 09/09/2004 | US20040175914 Semiconductor device fabrication method |
| 09/09/2004 | US20040175896 Method to form a cross network of air gaps within IMD layer |
| 09/09/2004 | US20040175883 Semiconductor device and method for fabricating the same |
| 09/09/2004 | US20040175875 Diamond composite heat spreader having thermal conductivity gradients and associated methods |
| 09/09/2004 | US20040175866 Plastic housing comprising several semiconductor chips and a wiring modification plate, and method for producing the plastic housing in an injection-molding mold |
| 09/09/2004 | US20040175864 Leadframe-to-plastic lock for IC package |
| 09/09/2004 | US20040175863 Method of attaching a leadframe to singulated semiconductor dice |
| 09/09/2004 | US20040175862 Semiconductor chip package and method for manufacturing the same |
| 09/09/2004 | US20040175861 Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture |
| 09/09/2004 | US20040175657 Dual-solder flip-chip solder bump |
| 09/09/2004 | US20040175580 Barrier layer for an article and method of making said barrier layer by expanding thermal plasma |
| 09/09/2004 | US20040175512 Barrier layer for an article and method of making said barrier layer by expanding thermal plasma |
| 09/09/2004 | US20040174690 Lead-frame configuration for chips |
| 09/09/2004 | US20040174682 Semiconductor package with heat sink |
| 09/09/2004 | US20040174681 Blindmate heat sink assembly |
| 09/09/2004 | US20040174680 Circuit arrangement for components to be cooled and corresponding cooling method |
| 09/09/2004 | US20040174679 Flexible assembly system and mechanism adapted for an optical projection apparatus |
| 09/09/2004 | US20040174678 Cooling element for high temperature devices |