| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/15/2004 | CN2641831Y Combination device of radiation fin and heat pipe |
| 09/15/2004 | CN2641830Y Vacuum closing structure for radiation pipe/box |
| 09/15/2004 | CN2641829Y Radiation fin |
| 09/15/2004 | CN2641828Y Combined radiation fin |
| 09/15/2004 | CN2641827Y Combination structure of radiation box and pipe |
| 09/15/2004 | CN2641826Y Fixator for CPU heet sink |
| 09/15/2004 | CN2641825Y Radiator structure |
| 09/15/2004 | CN2641824Y Composite chip contruction substrade |
| 09/15/2004 | CN2641822Y IC package assembly |
| 09/15/2004 | CN2641703Y Liquid cooling type radiator module for servo |
| 09/15/2004 | CN2641702Y Positioning structure for radiator |
| 09/15/2004 | CN2641701Y Radiator for computer |
| 09/15/2004 | CN2641451Y Illuinating device composed of thin light-emitting diode |
| 09/15/2004 | CN1529909A Integrated circuit having energy-absovbing structure |
| 09/15/2004 | CN1529872A IC card |
| 09/15/2004 | CN1529544A Circuit board for flip-chip connection and manufacturing method thereof |
| 09/15/2004 | CN1529541A Variable universal circuit board |
| 09/15/2004 | CN1529361A Chip packaging structure and chip and subtrate electric connection structure |
| 09/15/2004 | CN1529360A Miniature efficient self-circulating electronic cooler |
| 09/15/2004 | CN1529359A Chip packaging signal transmission structure and substrate |
| 09/15/2004 | CN1529358A Ball gate array packaging and printed circuit board using same |
| 09/15/2004 | CN1529357A Package device for placing semiconductor chip and producing method and semiconductor devices thereof |
| 09/15/2004 | CN1529275A Semiconductor device |
| 09/15/2004 | CN1529274A Semiconductor device |
| 09/15/2004 | CN1528852A Epoxy plastic cement and preparing method thereof |
| 09/15/2004 | CN1167131C Substrate and method for making structure for loading multiple semiconductor bared chip device |
| 09/15/2004 | CN1167130C Operation process of semiconductor device |
| 09/15/2004 | CN1167129C Static discharge protecting element and realated circuit |
| 09/15/2004 | CN1167128C Electrofusion fuse and its array and arrangement |
| 09/15/2004 | CN1167127C Semiconductor device |
| 09/15/2004 | CN1167126C Radiator and semiconductor laser device using and same semiconductor laser stack thereof |
| 09/15/2004 | CN1167125C Fixer of radaitor |
| 09/15/2004 | CN1167124C Epoxy molding material for packing semiconductor device, and production method and semiconductor device using said materials |
| 09/15/2004 | CN1167123C Semiconductor package whose package sealant possesses shoulder portion and mould for packaging said semiconductor package |
| 09/15/2004 | CN1167122C 半导体器件 Semiconductor devices |
| 09/15/2004 | CN1167121C Semiconductor package with structure capable of preventing sealant from overflowing and its making method |
| 09/15/2004 | CN1167107C Method for manufacturing low dielectric constant inter-level integrated circuit structure |
| 09/15/2004 | CN1167080C Conductive paste, ceramic multilayer substrate, and method for mfg. ceramic multilayer substrate |
| 09/15/2004 | CN1166738C Flame-retardant resin composition and semiconductive sealing material made of same |
| 09/15/2004 | CN1166476C Method for prepn. of metal powder |
| 09/14/2004 | USRE38588 Does not contain no pb, and also has excellent solderability (or solder wettability) and provides a strong junction with a solder, and does not cause nonuniform thickness of the plated layer even in reflow processing; tin based alloy |
| 09/14/2004 | US6792578 Hard macro having an antenna rule violation free input/output ports |
| 09/14/2004 | US6792365 Sequential unique marking |
| 09/14/2004 | US6792333 Product management method, program for performing product management, and storage medium having recorded the program therein |
| 09/14/2004 | US6792056 Cancellation circuit that suppresses electromagnetic interference in a high speed circuit using a function generator |
| 09/14/2004 | US6791847 Retention module for heat sink |
| 09/14/2004 | US6791839 Mixtures of curable polysiloxanes, low melting metal fillers and spacers, laminated between electronic substrates; heat exchanging |
| 09/14/2004 | US6791838 Flexible assembly system and mechanism adapted for an optical projection apparatus |
| 09/14/2004 | US6791837 Heat dissipating assembly with air guide device |
| 09/14/2004 | US6791835 Electronic device |
| 09/14/2004 | US6791818 Electronic device |
| 09/14/2004 | US6791697 Scatterometry structure with embedded ring oscillator, and methods of using same |
| 09/14/2004 | US6791439 Connection structure for high-frequency circuit substrate, manufacturing method thereof and high frequency circuit device |
| 09/14/2004 | US6791438 Radio frequency module and method for manufacturing the same |
| 09/14/2004 | US6791434 Flat group-delay low-pass filter, mounting structure thereof, flat group-delay low-pass filter device, and optical signal receiver |
| 09/14/2004 | US6791383 Reduced gate leakage current in thin gate dielectric CMOS integrated circuits |
| 09/14/2004 | US6791349 Electrical component with a contact and method for forming a contact on a semiconductor material |
| 09/14/2004 | US6791199 Heat radiating semiconductor device |
| 09/14/2004 | US6791197 Reducing layer separation and cracking in semiconductor devices |
| 09/14/2004 | US6791196 Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the same |
| 09/14/2004 | US6791195 Semiconductor device and manufacturing method of the same |
| 09/14/2004 | US6791194 Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same |
| 09/14/2004 | US6791193 Chip mounting substrate, first level assembly, and second level assembly |
| 09/14/2004 | US6791191 Integrated circuits protected against reverse engineering and method for fabricating the same using vias without metal terminations |
| 09/14/2004 | US6791190 Self-aligned contact/borderless contact opening and method for forming same |
| 09/14/2004 | US6791188 Thin film aluminum alloy and sputtering target to form the same |
| 09/14/2004 | US6791186 Mounting substrate and structure having semiconductor element mounted on substrate |
| 09/14/2004 | US6791185 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer |
| 09/14/2004 | US6791184 Support assembly for an integrated circuit package having solder columns |
| 09/14/2004 | US6791183 Power semiconductor module and cooling element for holding the power semiconductor module |
| 09/14/2004 | US6791182 Semiconductor device |
| 09/14/2004 | US6791180 Ceramic circuit board and power module |
| 09/14/2004 | US6791178 Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices |
| 09/14/2004 | US6791177 Integrated circuit packaging that uses guard conductors to isolate noise-sensitive signals within the package substrate |
| 09/14/2004 | US6791175 Stacked type semiconductor device |
| 09/14/2004 | US6791174 Semiconductor device with gel resin vibration limiting member |
| 09/14/2004 | US6791173 Semiconductor device and its manufacturing method |
| 09/14/2004 | US6791172 Power semiconductor device manufactured using a chip-size package |
| 09/14/2004 | US6791171 Systems for testing and packaging integrated circuits |
| 09/14/2004 | US6791169 Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor |
| 09/14/2004 | US6791168 Semiconductor package with circuit side polymer layer and wafer level fabrication method |
| 09/14/2004 | US6791167 Resin-molded device and manufacturing apparatus thereof |
| 09/14/2004 | US6791166 Stackable lead frame package using exposed internal lead traces |
| 09/14/2004 | US6791165 Device for shielding transmission lines from ground or power supply |
| 09/14/2004 | US6791164 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
| 09/14/2004 | US6791162 Unit cell architecture for electrical interconnects |
| 09/14/2004 | US6791159 Optical module |
| 09/14/2004 | US6791158 Integrated inductor |
| 09/14/2004 | US6791157 Integrated circuit package incorporating programmable elements |
| 09/14/2004 | US6791149 Diffusion barrier layer for semiconductor wafer fabrication |
| 09/14/2004 | US6791138 Use of atomic oxygen process for improved barrier layer |
| 09/14/2004 | US6791135 Semiconductor device with improved capacitive element and method of forming the same |
| 09/14/2004 | US6791133 Interposer capacitor built on silicon wafer and joined to a ceramic substrate |
| 09/14/2004 | US6791130 Photoconductor-on-active-pixel (POAP) sensor utilizing a multi-layered radiation absorbing structure |
| 09/14/2004 | US6791128 Semiconductor integrated circuit device and method for designing the same |
| 09/14/2004 | US6791127 Semiconductor device having a condenser chip for reducing a noise |
| 09/14/2004 | US6791036 Circuit elements using z-axis interconnect |
| 09/14/2004 | US6791034 Circuit board and production method therefor |
| 09/14/2004 | US6791024 Single package system employing protective case; efficienct, reliable |
| 09/14/2004 | US6790792 Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers |