| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/16/2004 | US20040179339 Multiple integrated circuit package module |
| 09/16/2004 | US20040179338 Loop thermosyphon with wicking structure and semiconductor die as evaporator |
| 09/16/2004 | US20040179336 Channeled heat dissipation device and a method of fabrication |
| 09/16/2004 | US20040179335 Double-winged radiator for central processing unit |
| 09/16/2004 | US20040179147 Display device and manufacturing method of the same |
| 09/16/2004 | US20040179144 Thin film transistor substrate for liquid crystal display panel and manufacturing method thereof |
| 09/16/2004 | US20040179050 Pattern drawing apparatus and pattern drawing method for forming patterns, that have mirror image relationship to each other with respect to a substrate, on both sides of the substrate, and test apparatus for use in the pattern drawing apparatus |
| 09/16/2004 | US20040178879 Micromachined heaters for microfluidic devices |
| 09/16/2004 | US20040178876 Circuit board assembly and flat coil |
| 09/16/2004 | US20040178854 Semiconductor device having balanced circuit for use in high frequency band |
| 09/16/2004 | US20040178515 Flip-chip package with underfill dam for stress control |
| 09/16/2004 | US20040178514 Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the method |
| 09/16/2004 | US20040178513 Memory card substrate with alternating contacts |
| 09/16/2004 | US20040178512 Interconnections for a semiconductor device |
| 09/16/2004 | US20040178511 Method of attaching a die to a substrate |
| 09/16/2004 | US20040178510 Electronic parts packaging structure and method of manufacturing the same |
| 09/16/2004 | US20040178508 Stacked semiconductor device |
| 09/16/2004 | US20040178506 Integrated circuit |
| 09/16/2004 | US20040178503 Torch Bump |
| 09/16/2004 | US20040178502 Semiconductor device |
| 09/16/2004 | US20040178501 Tape circuit substrate having wavy beam leads and semiconductor chip package using the same |
| 09/16/2004 | US20040178500 Semiconductor device and method for manufacturing same |
| 09/16/2004 | US20040178499 Semiconductor package with multiple sides having package contacts |
| 09/16/2004 | US20040178498 Wire bonding to full array bonding pads on active circuitry |
| 09/16/2004 | US20040178497 Semiconductor integrated circuit |
| 09/16/2004 | US20040178496 Memory expansion and chip scale stacking system and method |
| 09/16/2004 | US20040178495 Microelectronic devices and methods for packaging microelectronic devices |
| 09/16/2004 | US20040178494 Semiconductor package with heat sink |
| 09/16/2004 | US20040178493 Voltage island circuit placement |
| 09/16/2004 | US20040178492 Multi-layer wiring board, IC package, and method of manufacturing multi-layer wiring board |
| 09/16/2004 | US20040178491 Method for fabricating semiconductor components by forming conductive members using solder |
| 09/16/2004 | US20040178490 Semiconductor device |
| 09/16/2004 | US20040178488 Techniques for packaging multiple device components |
| 09/16/2004 | US20040178487 Electronic circuit unit that is easy to manufacture and method of manufacturing the same |
| 09/16/2004 | US20040178485 Semiconductor device housing plural stacked semiconductor elements |
| 09/16/2004 | US20040178484 Interposer, interposer package and device assembly employing the same |
| 09/16/2004 | US20040178483 Method of packaging a quad flat no-lead semiconductor and a quad flat no-lead semiconductor |
| 09/16/2004 | US20040178482 Techniques for packaging a multiple device component |
| 09/16/2004 | US20040178481 Dual metal stud bumping for flip chip applications |
| 09/16/2004 | US20040178479 Semiconductor device structured to prevent oxide damage during hdp cvd |
| 09/16/2004 | US20040178477 Semiconductor wafer |
| 09/16/2004 | US20040178473 Package with integrated inductor and/or capacitor |
| 09/16/2004 | US20040178472 Electromagnetic shielding structure |
| 09/16/2004 | US20040178455 Semiconductor device |
| 09/16/2004 | US20040178454 Semiconductor device with improved protection from electrostatic discharge |
| 09/16/2004 | US20040178453 Geometry-controllable design blocks of MOS transistors for improved ESD protection |
| 09/16/2004 | US20040178427 A-C:H ISFET device, manufacturing method, and testing methods and apparatus thereof |
| 09/16/2004 | US20040178425 Semiconductor device having fuse |
| 09/16/2004 | US20040178424 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device |
| 09/16/2004 | US20040178423 Adhesive film for underfill and semiconductor device using the same |
| 09/16/2004 | US20040178418 Housing for a photoactive semiconductor chip and a method for the production thereof |
| 09/16/2004 | US20040178411 Substrate for display, method of manufacturing the same and display having the same |
| 09/16/2004 | US20040178390 Organic species that facilitate charge transfer to or from nanostructures |
| 09/16/2004 | US20040178250 Oriented connections for leadless and leaded packages |
| 09/16/2004 | US20040177999 Wiring substrate |
| 09/16/2004 | US20040177997 Electronic apparatus |
| 09/16/2004 | US20040177984 Microelectronic component assemblies having lead frames adapted to reduce package bow |
| 09/16/2004 | US20040177947 Optimized heat sink using high thermal conducting base and low thermal conducting fins |
| 09/16/2004 | US20040177655 Apparatus for cleaning a substrate having metal interconnects |
| 09/16/2004 | US20040177498 Electronic device and manufacturing same |
| 09/16/2004 | DE202004007195U1 Verbindungskonstruktion einer Wärmeleitplatte Joint construction of a heat conducting plate |
| 09/16/2004 | DE19816489B4 Verfahren und Vorrichtung zum Prüfen der Filtereffizienz von für den Einsatz in einer Reinraumumgebung bestimmten Geweben Method and device for testing the efficiency of filter intended for use in a clean room environment tissues |
| 09/16/2004 | DE19750896B4 Halbleitereinrichtung mit einer leitenden Schicht und ihr Herstellungsverfahren A semiconductor device having a conductive layer and its manufacturing method |
| 09/16/2004 | DE19708002B4 Anschlußrahmen für Halbleiterbauelement Lead frame for semiconductor device |
| 09/16/2004 | DE19548489B4 Eingangs/Ausgangsschutzschaltung Input / output protection circuit |
| 09/16/2004 | DE10353285A1 Padanordnung einer integrierten Schaltung und Verfahren zum Herstellen der Padanordnung Pad arrangement of an integrated circuit and method of manufacturing the pad arrangement |
| 09/16/2004 | DE10329646A1 Electronic component with several identical, parallel-connected electronic circuit units, e.g. integrated circuits |
| 09/16/2004 | DE10320646A1 Electronic component, typically integrated circuit, system support and manufacturing method, with support containing component positions in lines and columns, starting with coating auxiliary support with photosensitive layer |
| 09/16/2004 | DE10310141A1 Schaltungsanordnung für zu kühlende Bauelemente und entsprechendes Kühlungsverfahren Circuitry for components to be cooled and corresponding cooling method |
| 09/16/2004 | DE10309689A1 Keramischer Körper mit monolithischem Schichtaufbau und Verfahren zu seiner Herstellung A ceramic body with a monolithic layer structure and process for its preparation |
| 09/16/2004 | DE10309079A1 Semiconductor appliance consists of at least one non-wrapped chip inserted in pocket-shaped depression of wafer pack, with contacting members including contact faces |
| 09/16/2004 | DE10308926A1 Semiconductor chip appliance with exchange of signals between semiconductor substrates takes place via lateral contacts in substrate side faces, instead of via printed circuit board |
| 09/16/2004 | DE10308855A1 Semiconductor wafer for electronic components, with integrated circuits in lines and columns for semiconductor chips on wafer top surface with strip-shaped dividing regions between chip integrated circuits |
| 09/16/2004 | DE10308323A1 Halbleiterchipanordnung mit ROM Semiconductor chip assembly with ROM |
| 09/16/2004 | DE10308275A1 Strahlungsresistentes Halbleiterbauteil Radiation-resistant semiconductor device |
| 09/16/2004 | DE10297292T5 Verbesserung der Auslösung eines ESD-NMOS durch die Verwendung einer N-Unterschicht Improving the triggering of an NMOS ESD through the use of a N-undercoat layer |
| 09/16/2004 | DE10297264T5 Halbleitervorrichtung und Verfahren zu deren Herstellung Semiconductor device and process for their preparation |
| 09/16/2004 | DE102004010633A1 Elektronisches Baulelement zum Verkleben einer Mehrzahl von Elektroden und Verfahren zum Montieren desselben The same electronic Baulelement for bonding a plurality of electrodes, and method of assembling |
| 09/16/2004 | DE102004010126A1 Magnetsensor und Verfahren zur Herstellung desselben Magnetic sensor and method for manufacturing the same |
| 09/16/2004 | DE102004008204A1 Spritzschutz und Wärmesenke Splash guard and heat sink |
| 09/15/2004 | EP1458226A2 Circuit board assembly and flat coil |
| 09/15/2004 | EP1458027A1 Semiconductor device |
| 09/15/2004 | EP1458025A2 Integrated circuits having separate power supply lines |
| 09/15/2004 | EP1458024A2 Interposer and semiconductor device |
| 09/15/2004 | EP1458023A2 Electronic assembly having electrically-isolated heat conductive structure and method therefor |
| 09/15/2004 | EP1458022A2 Semiconductor device and method of manufacturing the same, semiconductor wafer, circuit board and electronic instrument |
| 09/15/2004 | EP1457583A2 Mechanical enhancement of dense and porous organosilicate materials by UV exposure |
| 09/15/2004 | EP1457269A2 Apparatus for cleaning a substrate having metal interconnects |
| 09/15/2004 | EP1457098A1 Ball grid array package |
| 09/15/2004 | EP1456882A2 Circuit arrangement comprising electronic components on a nonconducting supporting substrate |
| 09/15/2004 | EP1456881A2 Method for determining the esd/latch-up resistance of an integrated circuit |
| 09/15/2004 | EP1456880A2 Electronic component and method for producing the same |
| 09/15/2004 | EP1456859A1 Inductive component |
| 09/15/2004 | EP1456434A1 A method of depositing dielectric materials in damascene applications |
| 09/15/2004 | EP1456021A1 Laminates prepared from impregnated flexible graphite sheets |
| 09/15/2004 | EP1145430B1 Integrated tuner architecture |
| 09/15/2004 | CN2641997Y Radiator |
| 09/15/2004 | CN2641834Y Semiconductor rectifying chip using nano material as passivation film |
| 09/15/2004 | CN2641833Y 液体冷却装置 Liquid cooling device |
| 09/15/2004 | CN2641832Y Plant board heat pipe structure with through holes |