| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/21/2004 | US6794759 Semiconductor device, liquid crystal display device and method of manufacturing the semiconductor device |
| 09/21/2004 | US6794757 Structure and method of forming an enlarged head on a plug to eliminate the enclosure requirement |
| 09/21/2004 | US6794756 Integrated circuit structure having low dielectric constant material and having silicon oxynitride caps over closely spaced apart metal lines |
| 09/21/2004 | US6794755 Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement |
| 09/21/2004 | US6794754 Semiconductor device with porous interlayer insulating film |
| 09/21/2004 | US6794752 Bonding pad structure |
| 09/21/2004 | US6794750 Semiconductor device |
| 09/21/2004 | US6794749 Chip package with grease heat sink |
| 09/21/2004 | US6794748 Substrate-less microelectronic package |
| 09/21/2004 | US6794747 Semiconductor device |
| 09/21/2004 | US6794746 Method of manufacturing semiconductor device, semiconductor device, narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head, ink jet printer, micromachine, liquid crystal panel, and electronic device |
| 09/21/2004 | US6794745 Lead on chip type semiconductor package |
| 09/21/2004 | US6794743 Structure and method of high performance two layer ball grid array substrate |
| 09/21/2004 | US6794742 Inverter module having a plurality of terminals at a predetermined pitch |
| 09/21/2004 | US6794740 Leadframe package for semiconductor devices |
| 09/21/2004 | US6794739 Semiconductor device, process for production thereof, and electronic equipment |
| 09/21/2004 | US6794738 Leadframe-to-plastic lock for IC package |
| 09/21/2004 | US6794737 Spring structure with stress-balancing layer |
| 09/21/2004 | US6794736 Semiconductor device |
| 09/21/2004 | US6794735 High permeability composite films to reduce noise in high speed interconnects |
| 09/21/2004 | US6794733 Increasing the susceptability of an integrated circuit to ionizing radiation |
| 09/21/2004 | US6794732 Semiconductor device and method of manufacturing the same |
| 09/21/2004 | US6794729 Stacked capacitor and method of forming the same as well as semiconductor device using the same and circuit board using the same |
| 09/21/2004 | US6794726 MOS antifuse with low post-program resistance |
| 09/21/2004 | US6794702 Semiconductor device and fabrication method thereof |
| 09/21/2004 | US6794694 Inter-wiring-layer capacitors |
| 09/21/2004 | US6794693 Semiconductor device and manufacturing method thereof |
| 09/21/2004 | US6794691 Use of irregularly shaped conductive filler features to improve planarization of the conductive layer while reducing parasitic capacitance introduced by the filler features |
| 09/21/2004 | US6794680 Semiconductor device having pad |
| 09/21/2004 | US6794674 Integrated circuit device and method for forming the same |
| 09/21/2004 | US6794606 Laser repair operation |
| 09/21/2004 | US6794312 Layering nitrided oxide on a silicon substrate |
| 09/21/2004 | US6794311 Method and apparatus for treating low k dielectric layers to reduce diffusion |
| 09/21/2004 | US6794299 Various methods of controlling conformal film deposition processes, and a system for accomplishing same |
| 09/21/2004 | US6794286 Process for fabricating a metal wiring and metal contact in a semicondutor device |
| 09/21/2004 | US6794285 Slurry for CMP, and method of manufacturing semiconductor device |
| 09/21/2004 | US6794283 Semiconductor device and fabrication method thereof |
| 09/21/2004 | US6794273 Semiconductor device and manufacturing method thereof |
| 09/21/2004 | US6794272 Wafer thinning using magnetic mirror plasma |
| 09/21/2004 | US6794267 Process of manufacturing semiconductor device |
| 09/21/2004 | US6794263 Method of manufacturing a semiconductor device including alignment mark |
| 09/21/2004 | US6794248 Method of fabricating semiconductor memory device and semiconductor memory device driver |
| 09/21/2004 | US6794244 Semiconductor device and method of manufacturing the same |
| 09/21/2004 | US6794238 Process for forming metallized contacts to periphery transistors |
| 09/21/2004 | US6794226 Semiconductor device incorporating elements formed of refractory metal-silicon-nitrogen and method for fabrication |
| 09/21/2004 | US6794224 Semiconductor device including leads in communication with contact pads thereof and a stereolithographically fabricated package substantially encapsulating the leads and methods for fabricating the same |
| 09/21/2004 | US6794223 Structure and process for reducing die corner and edge stresses in microelectronic packages |
| 09/21/2004 | US6794222 HDI module with integral conductive electromagnetic shield |
| 09/21/2004 | US6794205 Chip scale marker and method of calibrating marking position |
| 09/21/2004 | US6794030 Heat conductive sheet and method of producing the sheet |
| 09/21/2004 | US6794026 Radiating sheet and PDP panel |
| 09/21/2004 | US6793795 Utilizing ferrous and/or ferric salts and dimensionally stable insoluble anodes; full surface uniform deposition; rapidly and completely filling small width and diameter recesses; avoiding gas or liquid inclusions |
| 09/21/2004 | US6793502 Press (non-soldered) contacts for high current electrical connections in power modules |
| 09/21/2004 | US6793500 Radial contact pad footprint and wiring for electrical components |
| 09/21/2004 | US6793123 Packaging for multi-processor shared-memory system |
| 09/21/2004 | US6793116 Solder ball and interconnection structure using the same |
| 09/21/2004 | US6793009 CTE-matched heat pipe |
| 09/21/2004 | US6793007 High flux heat removal system using liquid ice |
| 09/21/2004 | US6792677 Method of manufacturing an electronic component unit |
| 09/16/2004 | WO2004080134A2 High frequency chip packages with connecting elements |
| 09/16/2004 | WO2004079974A2 Industrial ethernet switch |
| 09/16/2004 | WO2004079823A2 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
| 09/16/2004 | WO2004079822A1 Semiconductor device, semiconductor body and method of manufacturing thereof |
| 09/16/2004 | WO2004079821A1 Packaging structure of high frequency semiconductor device, high frequency transmitter and high frequency receiver employing it |
| 09/16/2004 | WO2004079797A2 High speed electronics interconnect and method of manufacture |
| 09/16/2004 | WO2004079791A2 Interconnect structure having improved stress migration reliability |
| 09/16/2004 | WO2004079399A2 Integrated thermal sensor for optoelectronic modules |
| 09/16/2004 | WO2004079285A1 Structure of heat conduction superconducting tube capable of transmitting heat for long distance |
| 09/16/2004 | WO2004059728A3 Method of fabricating an integrated circuit and semiconductor chip |
| 09/16/2004 | WO2004017408A3 Integrated circuit with id code and method of manufacturing same |
| 09/16/2004 | WO2004003974A3 Composite heat sink with metal base and graphite fins |
| 09/16/2004 | WO2003105223A3 Quad flat non-leaded package comprising a semiconductor device |
| 09/16/2004 | US20040181766 Wiring method in layout design of semiconductor integrated circuit, semiconductor integrated circuit and functional macro |
| 09/16/2004 | US20040180540 Substrate fabrication method and substrate |
| 09/16/2004 | US20040180539 Method of forming a penetration electrode and substrate having a penetration electrode |
| 09/16/2004 | US20040180538 Method for producing a copper connection |
| 09/16/2004 | US20040180535 Contact integration method |
| 09/16/2004 | US20040180534 Semiconductor integrated circuit device and fabrication method for semiconductor integrated circuit device |
| 09/16/2004 | US20040180529 Semiconductor device and manufacturing method therefor |
| 09/16/2004 | US20040180527 Method of manufacturing semiconductor device |
| 09/16/2004 | US20040180526 Solder on a sloped surface |
| 09/16/2004 | US20040180525 Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same |
| 09/16/2004 | US20040180524 Shielded multi-conductor interconnect bus for MEMS |
| 09/16/2004 | US20040180517 Method for structuring a flat substrate consisting of a glass-type material |
| 09/16/2004 | US20040180506 Diffusion barriers comprising a self-assembled monolayer |
| 09/16/2004 | US20040180486 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument |
| 09/16/2004 | US20040180475 Mold die and method for manufacturing semiconductor device using the same |
| 09/16/2004 | US20040180474 Electronic assembly having electrically-isolated heat-conductive structure and method therefor |
| 09/16/2004 | US20040180472 Method of assembling a semiconductor device including sweeping (with a squeegee) encapsulant over the device repeatedly |
| 09/16/2004 | US20040180470 Substrates having increased thermal conductivity for semiconductor structures |
| 09/16/2004 | US20040180468 Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatus |
| 09/16/2004 | US20040180296 Novel method to improve bump reliability for flip chip device |
| 09/16/2004 | US20040180223 silica-based organic film containing polyorganosiloxane; etching rate using hydrofluoric acid is reduced |
| 09/16/2004 | US20040180203 Nanomaterial compositions with distinctive shape and morphology |
| 09/16/2004 | US20040180188 Silicon-based composition, low dielectric constant film, semiconductor device, and method for producing low dielectric constant film |
| 09/16/2004 | US20040179411 Method and apparatus for hermetic sealing of assembled die |
| 09/16/2004 | US20040179383 Micro power converter with multiple outputs |
| 09/16/2004 | US20040179344 Electronic device capable of preventing electromagnetic wave from being radiated |
| 09/16/2004 | US20040179341 Power module |
| 09/16/2004 | US20040179340 Heat sink fastener |