Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2004
09/22/2004EP1460690A1 Optimization of routing layers and board space requirements in a BGA package (fka BGA package)
09/22/2004EP1460689A2 Electronic devices
09/22/2004EP1460688A2 Resin sealed electronic assembly and method of manufacturing the same
09/22/2004EP1460687A1 Recessed Wire Bonded Semiconductor Package Substrate
09/22/2004EP1460686A2 Method for Thin Film Resistor Integration in Dual Damascene Structure
09/22/2004EP1460684A1 No-flow underfill process and material therefor
09/22/2004EP1460681A2 Silicon carbide semiconductor device and method for fabricating the same
09/22/2004EP1460654A1 Inductive device and method for producing the same
09/22/2004EP1459381A2 Shielding for electromagnetic interference
09/22/2004EP1459380A1 Memory device packaging including stacked passive devices and method for making the same
09/22/2004EP1459379A1 Ebullition cooling device for heat generating component
09/22/2004EP1459378A2 Cooling device for a chip and method for production thereof
09/22/2004EP1459375A1 Method of manufacturing an electronic device
09/22/2004EP1459359A1 Arrangement comprising a capacitor
09/22/2004EP1459353A2 Self-ionized and inductively-coupled plasma for sputtering and resputtering
09/22/2004EP1458816A1 Chain extension for thermal materials
09/22/2004EP1218688A4 Method and apparatus for three dimensional inspection of electronic components
09/22/2004EP1095545B1 A thermal management device and method of making such a device
09/22/2004EP1089874A4 LOW $g(k) DIELECTRIC INORGANIC/ORGANIC HYBRID FILMS AND METHOD OF MAKING
09/22/2004EP1053592B1 Encapsulated surface wave component and collective method for making same
09/22/2004CN2643485Y Wafer packaging assembly
09/22/2004CN2643484Y Structure of radiating fin
09/22/2004CN2643483Y Radiating fin
09/22/2004CN2643482Y Riveting press fixture for radiator rack
09/22/2004CN2643481Y Improved structure for heat emission
09/22/2004CN2643480Y Card type circuit module
09/22/2004CN2643379Y Heat radiating fin
09/22/2004CN2643378Y Flow guiding apparatus
09/22/2004CN1531755A Semiconductor structure implementing sacrificial material and methods for making and implementing same
09/22/2004CN1531754A Direct heatpipe attachment to die using center point loading
09/22/2004CN1531749A Method for multilevel copper interconnects for ultra large scale integration
09/22/2004CN1531216A Monolithic direct converting transceiver and producing method thereof
09/22/2004CN1531199A Electronic component package, substrate, electronic components and manufacture thereof
09/22/2004CN1531194A Semiconductor devices
09/22/2004CN1531173A Fluid driving component and heat transfer system
09/22/2004CN1531119A LED module with high-efficient radiation
09/22/2004CN1531118A Improvement of thermal conductivity and luminosity promote structure of LED
09/22/2004CN1531116A Sealing structure and producing method thereof
09/22/2004CN1531111A 半导体装置 Semiconductor device
09/22/2004CN1531109A Semiconductor device and forming method thereof
09/22/2004CN1531094A Semiconductor devices
09/22/2004CN1531093A Microminiature power converter with multiple output
09/22/2004CN1531092A Resin sealing semiconductor device and producing method thereof
09/22/2004CN1531091A Semiconductor device, electronic apparatus, carrier placode, their manufacturing methods and electronic equipment
09/22/2004CN1531090A Semiconductor device, electronic apparatus and their manufacturing methods, electronic equipment
09/22/2004CN1531089A Semiconductor device, electronic apparatus and their manufacturing methods, elecronic equipment
09/22/2004CN1531088A Semiconductor device, electronic apparatus and their manufacturing methods, electronic equipment
09/22/2004CN1531087A Laminated semiconductor sealer
09/22/2004CN1531086A Semiconductor device, producing method thereof, electronic apparatus and method
09/22/2004CN1531085A Semiconductor devices
09/22/2004CN1531084A Semiconductor assembly with at least two chips with shared contact chip and unified in shell
09/22/2004CN1531082A Semiconductor structure with common origin leading wire
09/22/2004CN1531081A Interposer, interposer assembly and device assembly therewith
09/22/2004CN1531079A Integrated module with delayed assembly
09/22/2004CN1531078A Multiple metal internal ligature arrangement with stress remove increasement and producing method thereof
09/22/2004CN1531077A Thin-membrane electric crystal with structure of organic LED display device and making process
09/22/2004CN1531076A Semiconductor device and producing method thereof
09/22/2004CN1531075A Electronic device and producing method thereof
09/22/2004CN1531074A Sealing strucrture of semiconductor and electrical property path of circuit board
09/22/2004CN1531072A High-thermal conductivity silicon-aluminium alloy sealing material with low-density and expansion coefficient, preparing method thereof
09/22/2004CN1531071A Semiconductor device and producing method thereof
09/22/2004CN1531069A Electronic device and producing method thereof
09/22/2004CN1531068A Electronic device and producing method thereof
09/22/2004CN1531067A Circuit device and producing method thereof
09/22/2004CN1531058A Rear sectional method for preventing fuse semiconductor from damage of its side wall
09/22/2004CN1531043A Producing method for electronic device and chip carrier
09/22/2004CN1531041A Method for packing semiconductor device on printing circuit board and the printing circuit board
09/22/2004CN1531039A Graphic drawing device and method, detector for the device
09/22/2004CN1531027A Producing method for semiconductor device, semiconductor device, circuit placode and electronic apparatus
09/22/2004CN1531026A Semiconductor device and producing method thereof
09/22/2004CN1530972A Inductor and producing method thereof
09/22/2004CN1530911A Circuit board assembly and disc coil
09/22/2004CN1530701A Placode and producing method thereof, placode for electro-optical device, electro-optic device and electronic apparatus
09/22/2004CN1530625A Producing method and structure for heat superconductive heat transfer block
09/22/2004CN1530470A Tin-plating method
09/22/2004CN1168364C Cooling device for cooling heating element, circuit module and electronic device
09/22/2004CN1168153C Luminous device and its mfg. method
09/22/2004CN1168143C Thin wire of gold alloy and manufacture and use thereof
09/22/2004CN1168142C Fan unit with guide design
09/22/2004CN1168141C Heat sink using phase state conversion of fluid
09/22/2004CN1168140C Semiconductor package and its making method
09/22/2004CN1168139C Thin semicondcutor device and its preparing process
09/22/2004CN1168138C Inverted packed sheet electronic packing piece and its producing method and electronic device therewith
09/22/2004CN1168137C Semiconductor device, method for manufacturing the same, circuit board and flexible substrate
09/22/2004CN1168135C Electronics Structure and its forming method
09/22/2004CN1168133C Semiconductor chip, semiconductor device and mfg. method therefor
09/22/2004CN1168132C Technology for producing semiconductor device
09/22/2004CN1168131C Method of forming copper wiring in semiconductor device
09/22/2004CN1168130C Method of forming copper wiring in semicoductor device
09/22/2004CN1168126C Electronic part and its manufacturing method
09/22/2004CN1168106C Multilayered electronic part with minimum silver diffusion and its manufacturing method
09/21/2004US6795952 System and method for product yield prediction using device and process neighborhood characterization vehicle
09/21/2004US6795317 Fastening device
09/21/2004US6795315 Cooling system
09/21/2004US6794978 Accurate multi-ground inductors for high-speed integrated circuits
09/21/2004US6794961 High frequency circuit module
09/21/2004US6794763 Semiconductor device and method of manufacturing the same
09/21/2004US6794762 Electronic component and fabrication method thereof
09/21/2004US6794761 No-flow underfill material
09/21/2004US6794760 Integrated circuit interconnect