Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2014
02/27/2014US20140054757 Semiconductor device, and method of manufacturing semiconductor device
02/27/2014US20140054752 Semiconductor memory device and fabrication method thereof
02/27/2014US20140054751 Semiconductor device
02/27/2014US20140054750 Scribe line structure for wafer dicing and method of making the same
02/27/2014US20140054749 Semiconductor device
02/27/2014US20140054742 Semiconductor Structure
02/27/2014US20140054739 Semiconductor device and electronic device
02/27/2014US20140054726 Method of producing semiconductor wafer, semiconductor wafer, method of producing semiconductor device and semiconductor device
02/27/2014US20140054707 Electrostatic discharge (esd) protection device
02/27/2014US20140054604 Semiconductor device having improved heat dissipation
02/27/2014US20140054534 Self-aligned interconnection for integrated circuits
02/27/2014DE112012002165T5 Leistungshalbleitermodul und Verfahren zu dessen Herstellung The power semiconductor module and method for its production
02/27/2014DE102013210972A1 Halbleiterbauelement Semiconductor device
02/27/2014DE102013111154A1 Method for testing semiconductor component e.g. trench FETs, involves applying electrical test potential on additional electrode to detect defects in component cell
02/27/2014DE102013109282A1 Verfahren zum Schmelzen einer Laserschmelzsicherung und Verfahren zur Bearbeitung eines Wafers A method of melting a laser fuse and method for processing a wafer
02/27/2014DE102013108986A1 Anschlussstruktur sowie Halbleiterelement und Modelsubstrat mit einer solchen Anschlussstruktur Connection structure and semiconductor element and model substrate with such a connection structure
02/27/2014DE102013108979A1 Anschlussstruktur und Halbleiterbauelement Connection structure and semiconductor device
02/27/2014DE102013108808A1 Verfahren zur Herstellung eines Kühlkörpers und Kühlkörper A method for manufacturing a heat sink and heat sink
02/27/2014DE102013108704A1 Ein Verfahren zum Herstellen einer Metallpadstruktur eines Die, ein Verfahren zum Herstellen eines Bondpads eines Chips, einer Die-Anordnung und einer Chipanordnung A method of manufacturing a Metallpadstruktur The one, a method for manufacturing a bonding pad of a chip, a die assembly and a die assembly
02/27/2014DE102012219877A1 Haftklebemasse insbesondere zur Kapselung einer elektronischen Anordnung PSA useful for encapsulating an electronic device
02/27/2014DE102012107876A1 Trägerplatte, Vorrichtung mit Trägerplatte sowie Verfahren zur Herstellung einer Trägerplatte Support plate device with support plate and method for producing a carrier plate
02/27/2014DE102012107684A1 Kühlkörper für mindestens ein zu kühlendes Bauelement sowie Verfahren zur Herstellung eines Kühlkörpers Heat sink for at least one component to be cooled and processes for producing a heat sink
02/27/2014DE102011002026A1 Halbleitermodul mit Schaltelementen A semiconductor module with switching elements
02/27/2014DE102010029504B4 Bauelement mit einer Durchkontaktierung und Verfahren zu dessen Herstellung Component with a plated-through hole and process for its preparation
02/26/2014EP2701479A1 Electronic apparatus
02/26/2014EP2701192A1 Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device
02/26/2014EP2701190A2 Cooling unit for at least one component to be cooled and method for manufacturing a cooling unit
02/26/2014EP2701189A1 Method for self-assembly of substrates and devices obtained thereof
02/26/2014EP2701156A2 One-bit memory cell for nonvolatile memory and associated controlling method
02/26/2014EP2701155A2 One-bit memory cell for nonvolatile memory and associated controlling method
02/26/2014EP2700290A2 Cooling fin structure
02/26/2014EP2700101A1 Improvements in or relating to thyristor clamped assemblies
02/26/2014EP2700100A1 Flip-chip, face-up and face-down centerbond memory wirebond assemblies
02/26/2014EP2700099A1 Multi-chip module with stacked face-down connected dies
02/26/2014EP2700098A1 Multiple die face-down stacking for two or more die
02/26/2014EP2700097A1 Flip-chip, face-up and face-down wirebond combination package
02/26/2014EP2700096A1 Stacked chip-on-board module with edge connector
02/26/2014EP2700095A2 Semiconductor device and manufacturing method thereof
02/26/2014EP2700094A1 Method of direct silicon tiling of a tiled image sensor array
02/26/2014EP2700093A1 A starting substrate for semiconductor engineering having substrate-through connections and a method for making same
02/26/2014EP2700092A1 Vias in porous substrates
02/26/2014EP2700091A1 A routing layer for mitigating stress in a semiconductor die
02/26/2014EP2700090A1 Interposer having molded low cte dielectric
02/26/2014CN203457484U Liquid cooling radiator
02/26/2014CN203457062U Power converter with self-excitation synchronous rectification circuit
02/26/2014CN203456473U High-power diode package chip
02/26/2014CN203456469U Thyristor chip
02/26/2014CN203456465U 电致发光装置 Electroluminescent device
02/26/2014CN203456459U Infrared receiver module
02/26/2014CN203456455U 发光二极管显示屏 LED display
02/26/2014CN203456452U Integrated circuit packaging piece
02/26/2014CN203456451U 集成电路模块 IC module
02/26/2014CN203456450U 智能功率模块 Intelligent Power Module
02/26/2014CN203456449U 引线框架 Leadframe
02/26/2014CN203456448U Multi-leg position semiconductor integrated circuit lead frame
02/26/2014CN203456447U Large-power integrated circuit lead frame resistant to layer separation and water vapor entering
02/26/2014CN203456446U Arranging structure of triode lead supports
02/26/2014CN203456445U Low-power diode package chip
02/26/2014CN203456444U Diode packaging structure
02/26/2014CN203456443U Lead frame assembly and lead frame thereof
02/26/2014CN203456442U Low-cost high-applicability semiconductor chip back face metallization structure for eutectic package
02/26/2014CN203456441U Parallel loop heat pipe radiator
02/26/2014CN203456440U Self heat radiation semiconductor packaging structure
02/26/2014CN203456439U 混合集成电路模块 Hybrid IC module
02/26/2014CN203456438U Diode package chip
02/26/2014CN203456437U 半导体桥式整流器 Semiconductor Bridge Rectifiers
02/26/2014CN203456436U Wearing type semiconductor packaging structure
02/26/2014CN203456435U Semiconductor packaging structure containing nano-material
02/26/2014CN203456434U Semiconductor packaging structure containing carbon fiber layer
02/26/2014CN203456433U Impact-resistant semiconductor packaging structure
02/26/2014CN203456432U Electromagnetic-shielding-type semiconductor packaging structure
02/26/2014CN203454875U Vapor chamber
02/26/2014CN103608919A Above motherboard interposer with peripheral circuits
02/26/2014CN103608918A Lead frame strip for reduced mold sticking during degating
02/26/2014CN103608917A Ultra-thin power transistor and synchronous buck converter having customized footprint
02/26/2014CN103608916A Semiconductor device and method for manufacturing semiconductor device
02/26/2014CN103608915A Circuit module
02/26/2014CN103608913A Vias in porous substrates
02/26/2014CN103608896A Method for producing semiconductor device
02/26/2014CN103608622A Heat sink assembly for opto-electronic components and a method for producing the same
02/26/2014CN103606549A Display panel and image display system using same
02/26/2014CN103606547A Integrated circuit layout structure using laser trimming process and integrated chip
02/26/2014CN103606544A Electrostatic discharge resistant LDMOS device
02/26/2014CN103606543A Rewiring metal layer and manufacturing method thereof
02/26/2014CN103606542A TSV metal interconnection structure and manufacturing method thereof
02/26/2014CN103606541A Plastic split lead frame
02/26/2014CN103606540A Frame-based small-distance multi-device SMT package and manufacturing process thereof
02/26/2014CN103606539A Frame-based flat package adopting opening-optimization technology and manufacturing process thereof
02/26/2014CN103601501A Low temperature co-fired ceramic method by mixed conductor structure
02/26/2014CN102723284B Method for manufacturing front-mounted three-dimensional line on single side of chip by using first etching and later packaging and packaging structure of three-dimensional line
02/26/2014CN102543840B Self-aligned contact etch method
02/26/2014CN102543667B Forming method of graph of aligned layer on silicon chip
02/26/2014CN102446900B Electromigration reliability test structure for multilayer of metal interconnected metal wires
02/26/2014CN102446887B Circuit structure of simulation cascaded inductance capable of being reduced at equal proportion and method
02/26/2014CN102446881B Universal packaging substrate and packaging method thereof
02/26/2014CN102403256B Buried layer and manufacturing method, long hole contact and triode
02/26/2014CN102392280B Full-automatic electroplating production line for semi-conductor lead frames
02/26/2014CN102318051B Semiconductor chip with reinforcement layer
02/26/2014CN102254881B 半导体装置 Semiconductor device
02/26/2014CN102208389B Semiconductor package, substrate and manufacturing method thereof
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