| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/23/2004 | US20040184218 Semiconductor capacitor with diffusion prevention layer |
| 09/23/2004 | US20040184217 On-die de-coupling capacitor using bumps or bars |
| 09/23/2004 | US20040184131 Test-element-provided substrate, method of manufacturing the same, substrate for electro-optical device, electro-optical device, and electronic apparatus |
| 09/23/2004 | US20040183977 Liquid crystal display device and method of fabricating the same |
| 09/23/2004 | US20040183763 Liquid crystal display having aluminum wiring |
| 09/23/2004 | US20040183585 Semiconductor integrated circuit |
| 09/23/2004 | US20040183471 Method for making an led |
| 09/23/2004 | US20040183385 Multi-phase alternating-current rotational electric machine |
| 09/23/2004 | US20040183232 High thermal conductive material having high thermal conductivity and process for producing the same |
| 09/23/2004 | US20040183215 Free from an adverse influence on neighboring electronic circuits even if a nonaqueous electrolyte leaks from electronic devices |
| 09/23/2004 | US20040183213 Semiconductor packaging substrate and method of producing the same |
| 09/23/2004 | US20040183212 Electronic package with strengthened conductive pad |
| 09/23/2004 | US20040183211 Chip carrier with optimized circuitization pattern |
| 09/23/2004 | US20040183210 Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein |
| 09/23/2004 | US20040183209 High performance IC chip having discrete decoupling capacitors attached to its IC surface |
| 09/23/2004 | US20040183208 Semiconductor chip and production process therefor |
| 09/23/2004 | US20040183207 Multi-substrate microelectronic packages and methods for manufacture |
| 09/23/2004 | US20040183205 Wiring substrate, semiconductor device, semiconductor module, electronic equipment, method for designing wiring substrate, method for manufacturing semiconductor device, and method for manufacturing semiconductor module |
| 09/23/2004 | US20040183204 Semiconductor device and method for forming a semiconductor device using post gate stack planarization |
| 09/23/2004 | US20040183203 Composite sacrificial material |
| 09/23/2004 | US20040183202 Semiconductor device having copper damascene interconnection and fabricating method thereof |
| 09/23/2004 | US20040183201 Reliability |
| 09/23/2004 | US20040183200 Semiconductor device and method of manufacturing the same |
| 09/23/2004 | US20040183197 Semiconductor device including copper interconnect line and bonding pad, and method of manufacturing the same |
| 09/23/2004 | US20040183196 [metal bonding method for semiconductor circuit components employing prescribed feeds of metal balls] |
| 09/23/2004 | US20040183195 [under bump metallurgy layer] |
| 09/23/2004 | US20040183194 [gold bump structure and fabricating method thereof] |
| 09/23/2004 | US20040183193 Packaging method, packaging structure and package substrate for electronic parts |
| 09/23/2004 | US20040183192 Semiconductor device assembled into a chip size package |
| 09/23/2004 | US20040183191 Semiconductor apparatus |
| 09/23/2004 | US20040183190 Multi-chips stacked package |
| 09/23/2004 | US20040183188 Semiconductor module and semiconductor device |
| 09/23/2004 | US20040183187 Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element |
| 09/23/2004 | US20040183186 Low-profile electronic circuit module and method for manufacturing the same |
| 09/23/2004 | US20040183185 Packaged integrated circuits and methods of producing thereof |
| 09/23/2004 | US20040183184 Composite capacitor and stiffener for chip carrier |
| 09/23/2004 | US20040183183 Integrated circuit stacking system and method |
| 09/23/2004 | US20040183182 Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
| 09/23/2004 | US20040183180 Multi-chips stacked package |
| 09/23/2004 | US20040183179 Package structure for a multi-chip integrated circuit |
| 09/23/2004 | US20040183178 Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus |
| 09/23/2004 | US20040183175 Semiconductor package and method of fabricating same |
| 09/23/2004 | US20040183174 Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same |
| 09/23/2004 | US20040183172 Package for housing semiconductor chip, and semiconductor device |
| 09/23/2004 | US20040183171 Multi-frequency power delivery system |
| 09/23/2004 | US20040183170 Semiconductor device and method for manufacturing the same, circuit substrate and electronic apparatus |
| 09/23/2004 | US20040183169 IC chip package |
| 09/23/2004 | US20040183168 Lead frame and electronic component using same |
| 09/23/2004 | US20040183167 Recessed-bond semiconductor package substrate |
| 09/23/2004 | US20040183166 Preplated leadframe without precious metal |
| 09/23/2004 | US20040183165 Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin |
| 09/23/2004 | US20040183164 Semiconductor device with improved reliability and manufacturing method of the same |
| 09/23/2004 | US20040183163 Method for Forming a Protective Layer for Use In Packaging a Semiconductor Die |
| 09/23/2004 | US20040183162 Semiconductor device, and production method for manufacturing such semiconductor device |
| 09/23/2004 | US20040183155 Semiconductor device and method of manufacturing the same |
| 09/23/2004 | US20040183135 ESD dissipative structural components |
| 09/23/2004 | US20040183102 Semiconductor antenna proximity lines |
| 09/23/2004 | US20040183094 Structure to accommodate increase in volume expansion during solder reflow |
| 09/23/2004 | US20040183093 Pressure-contact type semiconductor device |
| 09/23/2004 | US20040183092 Pressed-contact type semiconductor device |
| 09/23/2004 | US20040183080 Silicon carbide semiconductor device and method for fabricating the same |
| 09/23/2004 | US20040183070 Solution processed pentacene-acceptor heterojunctions in diodes, photodiodes, and photovoltaic cells and method of making same |
| 09/23/2004 | US20040182994 Photo-sensor and method for manufacturing the photo-sensor |
| 09/23/2004 | US20040182915 Structure and method for bonding to copper interconnect structures |
| 09/23/2004 | US20040182911 Insulated bonding wire tool for microelectronic packaging |
| 09/23/2004 | US20040182604 Pinned electronic package with strengthened conductive pad |
| 09/23/2004 | US20040182601 Substrate for circuit wiring |
| 09/23/2004 | US20040182591 Photodetection sensor |
| 09/23/2004 | US20040182560 Apparatus and method of forming channels in a heat-exchanging device |
| 09/23/2004 | US20040182552 Heat sink for electronic devices and heat dissipating method |
| 09/23/2004 | US20040182551 Boiling temperature design in pumped microchannel cooling loops |
| 09/23/2004 | US20040182549 Thermally conductive silk-screenable interface material |
| 09/23/2004 | US20040182548 Multi-level microchannel heat exchangers |
| 09/23/2004 | US20040182544 Cooling device utilizing liquid coolant |
| 09/23/2004 | US20040182543 Heat dissipating arrangement for portable computer |
| 09/23/2004 | US20040182542 Heat sink |
| 09/23/2004 | US20040182540 Electronic apparatus having energy-saving cooling system |
| 09/23/2004 | US20040182277 Electroless Ni-B plating liquid, electronic device and method for manufacturing the same |
| 09/23/2004 | US20040182265 Wiring substrate |
| 09/23/2004 | US20040182099 Device and method for ferrofluid power generator and cooling system |
| 09/23/2004 | US20040182088 Cooling of electronics by electrically conducting fluids |
| 09/23/2004 | DE202004010118U1 Heat sink extension for a computer processor, has air guide that is attached to the top of the heat sink and conical shape to ensure cool air from outside the computer housing is directed onto the heat sink |
| 09/23/2004 | DE202004003790U1 Cooling unit with integrated thermal conduction tubes e.g. for cooling electric components, uses extrusion molded body with cooling fins for heat-sink |
| 09/23/2004 | DE19929542B4 Flächige Anordnung von Stimulationselektroden auf einem Chip und Herstellungsverfahren dazu und Verwendung als Retina-Implantat Dimensional arrangement of stimulating electrodes on a chip and manufacturing method thereof and use as retinal implant |
| 09/23/2004 | DE19734794B4 Leiterrahmen mit einer Vielzahl von Verdrahtungsteilen zur Verwendung bei einerHalbleitervorrichtung Leadframe having a plurality of wiring components for use in a semiconductor device |
| 09/23/2004 | DE19715926B4 Herstellungsverfahren für einen externen Anschluß für ein Kugelgitterarray-(BGA)Halbleiterbauteil Manufacturing method for an external connection for a Kugelgitterarray- (BGA) semiconductor device |
| 09/23/2004 | DE19704934B4 Kühlschiene mit zwei Kanälen Cooling rail with two channels |
| 09/23/2004 | DE10319509A1 Circuit module and production process for semiconductor elements especially for solar cells and clothing has carrier which can bend flexibly between the cells |
| 09/23/2004 | DE10311644A1 Motor vehicle drive comprises combustion engine and power electronics for control of electric machinery, with a support for the power electronics also acting as a heat sink, which is cooled by the engine coolant circuit |
| 09/23/2004 | DE10310568A1 Heat-sink arrangement for electronic component esp. high-power microprocessor, has thermal tube joined via evaporation zone in cooling-medium tight fashion to contact |
| 09/23/2004 | DE10309869A1 Semiconductor chip production process, fills contact holes with conductive material to connect circuits to conductor rail and then divides into chips |
| 09/23/2004 | DE10309614A1 Semiconductor structure and production process for high frequency uses has screen between semiconductor elements passing through substrate to underside metallization |
| 09/23/2004 | DE10306227A1 Power module for inverter has hollow cooling body carrying flow of cooling medium for heat removal, components on outside of the cooling body and connected to it in thermally conducting manner |
| 09/23/2004 | DE102004011958A1 Mikro-Stromrichter mit mehreren Ausgängen Micro-power converter with multiple outputs |
| 09/23/2004 | DE102004006513A1 Verfahren zum Herstellen einer Led A method of manufacturing an LED |
| 09/23/2004 | DE102004001829A1 Halbleitervorrichtung Semiconductor device |
| 09/22/2004 | EP1460889A2 Plastic package with high heat dissipation and method for manufacturing the same |
| 09/22/2004 | EP1460888A1 Low-profile electronic circuit module and method for manufacturing the same |
| 09/22/2004 | EP1460750A1 AC generator for vehicles |
| 09/22/2004 | EP1460749A1 Multi-phase alternating-current rotational electric machine |