| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/28/2004 | US6798044 Flip chip in leaded molded package with two dies |
| 09/28/2004 | US6798043 Structure and method for isolating porous low-k dielectric films |
| 09/28/2004 | US6798042 Pin diode and method for fabricating the diode |
| 09/28/2004 | US6798039 Integrated circuit inductors having high quality factors |
| 09/28/2004 | US6798035 Bonding pad for low k dielectric |
| 09/28/2004 | US6798022 Semiconductor device with improved protection from electrostatic discharge |
| 09/28/2004 | US6797999 Flexible routing channels among vias |
| 09/28/2004 | US6797993 Monolithic IC package |
| 09/28/2004 | US6797989 Package for opto-electrical components |
| 09/28/2004 | US6797981 Test wafer and method for producing the test wafer |
| 09/28/2004 | US6797910 Production apparatus of planer type semiconductor device and fabrication method of planer type semiconductor device |
| 09/28/2004 | US6797891 Flexible interconnect cable with high frequency electrical transmission line |
| 09/28/2004 | US6797890 High frequency module device and method for its preparation |
| 09/28/2004 | US6797887 Glass terminal for high-speed optical communication |
| 09/28/2004 | US6797882 Die package for connection to a substrate |
| 09/28/2004 | US6797881 Cross substrate, method of mounting semiconductor element, and semiconductor device |
| 09/28/2004 | US6797758 Morphing fillers and thermal interface materials |
| 09/28/2004 | US6797750 Flame-retardant epoxy resin composition, molded article thereof, and electronic part |
| 09/28/2004 | US6797640 Method of utilizing hard mask for copper plasma etch |
| 09/28/2004 | US6797619 Method of forming metal wire of semiconductor device |
| 09/28/2004 | US6797616 Circuit boards containing vias and methods for producing same |
| 09/28/2004 | US6797609 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device |
| 09/28/2004 | US6797606 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device |
| 09/28/2004 | US6797603 Semiconductor device and method of production of same |
| 09/28/2004 | US6797600 Method of forming a local interconnect |
| 09/28/2004 | US6797594 Semiconductor device and method of manufacturing the same |
| 09/28/2004 | US6797585 Nonintrusive wafer marking |
| 09/28/2004 | US6797582 Vertical thermal nitride mask (anti-collar) and processing thereof |
| 09/28/2004 | US6797545 Method and apparatus for fabricating electronic device |
| 09/28/2004 | US6797544 Semiconductor device, method of manufacturing the device and method of mounting the device |
| 09/28/2004 | US6797541 Leadless semiconductor product packaging apparatus having a window lid and method for packaging |
| 09/28/2004 | US6797540 Dap isolation process |
| 09/28/2004 | US6797539 Method of manufacturing a semiconductor device |
| 09/28/2004 | US6797537 Method of making stackable layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layers |
| 09/28/2004 | US6797530 Semiconductor device-manufacturing method for manufacturing semiconductor devices with improved heat radiating efficiency and similar in size to semiconductor elements |
| 09/28/2004 | US6797382 Crosslinkable rubber compound, amine resin and a thermally conductive filler |
| 09/28/2004 | US6797367 Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board |
| 09/28/2004 | US6797142 Tin plating |
| 09/28/2004 | US6797093 Sintering an unsintered laminated body formed by laminating together first and second green sheets capable of exhibiting different shrinking behaviors during a sintering process; inhibit the undesired shrinkage |
| 09/28/2004 | US6797085 Improving thermal conductivity by expanding microstructure; heat induction of secondary recrystallization grain growth, lowering to cryogenic temperature and immediately bringing to ambient conditions |
| 09/28/2004 | US6797079 Copper, silver alloy |
| 09/28/2004 | US6796831 Connector |
| 09/28/2004 | US6796373 Heat sink module |
| 09/28/2004 | US6796370 Semiconductor circular and radial flow cooler |
| 09/28/2004 | US6796028 Method of Interconnecting substrates for electrical coupling of microelectronic components |
| 09/28/2004 | US6796025 Method for mounting electronic part and paste material |
| 09/28/2004 | US6796024 Method for making semiconductor device |
| 09/25/2004 | CA2458080A1 Heat sink with visible logo |
| 09/23/2004 | WO2004082349A1 Cooling structure for electronic equipment |
| 09/23/2004 | WO2004082347A2 Solder on a sloped surface |
| 09/23/2004 | WO2004082344A1 A substrate structure, a method and an arrangement for producing such substrate structure |
| 09/23/2004 | WO2004082342A1 A method and device for protection of a component or module |
| 09/23/2004 | WO2004082065A1 Power supply distribution circuit |
| 09/23/2004 | WO2004082023A1 Photodiode array, method for manufacturing same, and radiation detector |
| 09/23/2004 | WO2004082022A2 Method for producing an electronic component or module and a corresponding component or module |
| 09/23/2004 | WO2004082020A1 Via and trench structures for semiconductor substrates bonded to metallic substrates |
| 09/23/2004 | WO2004082019A1 Printed wiring board, method for manufacturing same, lead frame package and optical module |
| 09/23/2004 | WO2004082018A2 Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same |
| 09/23/2004 | WO2004082012A1 Semiconductor device with dummy patterns |
| 09/23/2004 | WO2004081992A2 Semiconductor wafer with non-rectangular shaped dice |
| 09/23/2004 | WO2004081990A2 Coated metal stud bump formed by a coated wire for flip chip |
| 09/23/2004 | WO2004081972A2 Housing body, optoelectronic component with a housing body of this type, and plastic housing material |
| 09/23/2004 | WO2004081952A1 Polymer composite high-dielectric-constant material, multilayer printed circuit board and module board |
| 09/23/2004 | WO2004081139A1 Electronic device containing thermal interface material |
| 09/23/2004 | WO2004081078A1 Resin composition for sealing semiconductor and semiconductor device using the same |
| 09/23/2004 | WO2004080914A1 Heat sink having a high thermal conductivity |
| 09/23/2004 | WO2004080913A1 Method for producing a composite material |
| 09/23/2004 | WO2004066307A3 Stacked memory cell having diffusion barriers |
| 09/23/2004 | WO2004061954A3 Electronic unit integrated into a flexible polymer body |
| 09/23/2004 | WO2004032182A3 Method for making a wire nanostructure in a semiconductor film |
| 09/23/2004 | WO2003092042A3 Clamping assembly for high-voltage solid state devices |
| 09/23/2004 | WO2003081641B1 Support clip |
| 09/23/2004 | US20040185811 Single chip direct conversion transceiver for reducing DC offset and method of manufacturing the same |
| 09/23/2004 | US20040185694 Contact for spiral contactor and spiral contactor |
| 09/23/2004 | US20040185683 Wiring, display device and method of manufacturing the same |
| 09/23/2004 | US20040185668 Method of fabricating semiconductor device using Plasma-Enhanced CVD |
| 09/23/2004 | US20040185667 Method of continuous processing of thin-film batteries and like devices |
| 09/23/2004 | US20040185657 Semiconductor device having landing pad and fabrication method thereof |
| 09/23/2004 | US20040185652 Integrated circuit with modified metal features and method of fabrication therefor |
| 09/23/2004 | US20040185651 [method of forming bumps] |
| 09/23/2004 | US20040185650 Metal bonding method for semiconductor circuit components employing prescribed feeds of metal balls |
| 09/23/2004 | US20040185649 [a wafer bumping process] |
| 09/23/2004 | US20040185637 Method to preserve alignment mark optical integrity |
| 09/23/2004 | US20040185603 Flip-chip system and method of making same |
| 09/23/2004 | US20040185602 No-flow underfill process and material therefor |
| 09/23/2004 | US20040185379 Multilayer circuit component and method for manufacturing the same |
| 09/23/2004 | US20040185310 Battery device with conductive layer, cathode, anode and electrolyte layer for electrical isolation |
| 09/23/2004 | US20040185284 Ultrathin charge dissipation coatings |
| 09/23/2004 | US20040185273 Mixture of polymer and solder, for electronic devices; mixture containing wetting intensifier |
| 09/23/2004 | US20040185248 Heat-dissipative coating |
| 09/23/2004 | US20040185237 Sheet for sealing electrical wiring |
| 09/23/2004 | US20040184272 Substrate for light-emitting diode (LED) mounting including heat dissipation structures, and lighting assembly including same |
| 09/23/2004 | US20040184241 forming a chemical vapor deposited diamond surface on the thermal management solution and growing an array of carbon nanotubes on the surface of the CVDD layer or the circuit die |
| 09/23/2004 | US20040184240 Semiconductor package with heat sink |
| 09/23/2004 | US20040184239 Package for integrated circuit die |
| 09/23/2004 | US20040184238 Fixing structure for dissipation device |
| 09/23/2004 | US20040184237 Heat dissipation device with liquid coolant |
| 09/23/2004 | US20040184236 Central processing unit (CPU) heat sink module |
| 09/23/2004 | US20040184226 Bare die semiconductor dice underfilled and encapsulated with a single dielectric material and method for manufacturing the same |
| 09/23/2004 | US20040184219 Assembly of semiconductor device, interposer and substrate |