Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2004
09/29/2004CN2645236Y Gate circuit transistor water cooling radiator corrosion-proof protection device
09/29/2004CN2645235Y Heat abstractor
09/29/2004CN2645234Y Radiating fin connection arrangement
09/29/2004CN2645233Y Modified CPU radiator heat conductive tube arrangement
09/29/2004CN2645124Y Heating radiator with improved bottom plate structure
09/29/2004CN2645121Y Heat abstractor fixing device
09/29/2004CN1533685A Method for shielding an electric circuit on printed circuit board and a corresponding combination of a printed circuit board and shield
09/29/2004CN1533605A Solder-free PCB assembly
09/29/2004CN1533604A Semiconductor device and its producing method, circuit board and electronic instrment
09/29/2004CN1533603A Semiconductor device and its producing method, circuit board and electronic instrument
09/29/2004CN1533600A Data carrier with an integrated component
09/29/2004CN1533227A Medium board, base board with medium board and structure part and method for producing medium board
09/29/2004CN1532955A Thermoelectric generator
09/29/2004CN1532943A Silicon carbide semiconductor device and its producting method
09/29/2004CN1532940A Light detector and method for producing light detector
09/29/2004CN1532938A Semiconductor device and its producing method
09/29/2004CN1532935A Integrated circuit device, clock configuraton system, clock comfiguration method and clock configuration program
09/29/2004CN1532931A Semiconductor device and producing method, semiconductor package, electronic device and producing method, electronic instrment
09/29/2004CN1532929A Static discharge protective circuit and method for double carrier complementary metal oxide semiconductor
09/29/2004CN1532928A Semiconductor structure and its producing method
09/29/2004CN1532927A Semiconductor device with multilayer inter link structure and method for producing said device
09/29/2004CN1532926A Wiring part and its producing method
09/29/2004CN1532925A Lead frame and electronic part using lead frame
09/29/2004CN1532924A Wafer grade package, multiple package overlapping and its producing method
09/29/2004CN1532923A Method and device for jet spray conductive heat
09/29/2004CN1532922A Semiconductor package part with radiation fin
09/29/2004CN1532921A Semiconductor package part with radiation fin
09/29/2004CN1532920A High heat radiation platic package and its producing method
09/29/2004CN1532914A Integrated circuit protective layer and its producing method
09/29/2004CN1532908A Semiconductor wafer, semiconductor device and its producing method, circuit base baord and electronic machine
09/29/2004CN1532907A Semiconductor wafer, semiconductor device and its producing method, circuit base board and electronic machine
09/29/2004CN1532906A Semiconductor device and its producing method, circuit base board and electronic machine
09/29/2004CN1532905A Method for producing electronic part, electronic part, mounting method for electronic part and electronic device
09/29/2004CN1532904A Method for producing semiconductor device, semiconductr device and electronic device
09/29/2004CN1532901A Electronic device with empty chamby and its producing method
09/29/2004CN1532896A Meethod for producing semiconductor device
09/29/2004CN1532617A Liquid crystal display device and its producing method
09/29/2004CN1532613A Organic electroluminescen device and liquid crystal display device
09/29/2004CN1532600A Base board and its producing method, base board for photoelectric device photoelectric device and electronic device
09/29/2004CN1532592A Semiconductor device, photoelectric device and electronic device
09/29/2004CN1532054A Functional material fixing method and functional material fixing device
09/29/2004CN1532053A Device and its producing method, photoelectric device and electronic machine
09/29/2004CN1169236C Method of mfg. semiconductor device
09/29/2004CN1169235C Electronic component, in particular OFW component using acoustical surface acoustic waves
09/29/2004CN1169222C Electric capacitor structure and method for making same
09/29/2004CN1169220C Electronic part with laminated assembly and manufacturing method thereof
09/29/2004CN1169219C Static discharge protective semiconductor device
09/29/2004CN1169218C Silicon controlled rectifier circuit of high triggered current
09/29/2004CN1169217C Static discharging protector
09/29/2004CN1169216C 半导体集成电路器件 The semiconductor integrated circuit device
09/29/2004CN1169215C Semiconductor device and method for manufacture thereof
09/29/2004CN1169214C Radiator holder
09/29/2004CN1169213C Heat sink with high-density radiating fin and its assembly process
09/29/2004CN1169212C Assembled frame for water cooling semi-conductor device
09/29/2004CN1169209C Method of making aluminum contact
09/29/2004CN1169204C Design method, masks integrated circuit and its producing method and storage medium
09/29/2004CN1169203C Method for forming end face electrode
09/29/2004CN1169202C Golden wires for connecting semiconductor and method for connecting semiconductor device
09/29/2004CN1169201C IC-mounted structure, liquid crystal device and electronic device
09/29/2004CN1169005C Optical semiconductor seal package and optical semiconductor module
09/28/2004US6798679 Semiconductor memory module
09/28/2004US6798667 Solder ball collapse control apparatus and method thereof
09/28/2004US6798665 Module and method of manufacturing the module
09/28/2004US6798663 Heat sink hold-down with fan-module attach location
09/28/2004US6798661 Chassis conducted cooling thermal dissipation apparatus for servers
09/28/2004US6798659 CPU cooling structure
09/28/2004US6798645 Protecting resin-encapsulated components
09/28/2004US6798313 Monolithic microwave integrated circuit with bondwire and landing zone bias
09/28/2004US6798295 Single package multi-chip RF power amplifier
09/28/2004US6798234 Apparatus for protecting an integrated circuit formed in a substrate and method for protecting the circuit against reverse engineering
09/28/2004US6798230 Structure and method for increasing accuracy in predicting hot carrier injection (HCI) degradation in semiconductor devices
09/28/2004US6798121 Module with built-in electronic elements and method of manufacture thereof
09/28/2004US6798078 Power control device with semiconductor chips mounted on a substrate
09/28/2004US6798077 Semiconductor device with staggered octagonal electrodes and increased wiring width
09/28/2004US6798076 Method and apparatus for encoding information in an IC package
09/28/2004US6798075 Grid array packaged integrated circuit
09/28/2004US6798074 Method of attaching a die to a substrate
09/28/2004US6798073 Chip structure and process for forming the same
09/28/2004US6798072 Flip chip assembly structure for semiconductor device and method of assembling therefor
09/28/2004US6798071 Semiconductor integrated circuit device
09/28/2004US6798070 Electronic device assembly and a method of connecting electronic devices constituting the same
09/28/2004US6798069 Integrated circuit having adaptable core and input/output regions with multi-layer pad trace conductors
09/28/2004US6798067 Switching metal line configurations in metal layer structures
09/28/2004US6798066 Heat dissipation from IC interconnects
09/28/2004US6798064 Electronic component and method of manufacture
09/28/2004US6798063 Low profile ball grid array package
09/28/2004US6798062 Semiconductor device having radiation structure
09/28/2004US6798061 Multiple semiconductor chip (multi-chip) module for use in power applications
09/28/2004US6798060 Power device and direct aluminum bonded substrate thereof
09/28/2004US6798058 Semiconductor device, mounting and method of manufacturing mounting substrate, circuit board, and electronic instrument
09/28/2004US6798057 Thin stacked ball-grid array package
09/28/2004US6798055 Die support structure
09/28/2004US6798053 IC chip package
09/28/2004US6798052 Fexible electronic device
09/28/2004US6798050 Semiconductor device having semiconductor element with copper pad mounted on wiring substrate and method for fabricating the same
09/28/2004US6798049 Semiconductor package and method for fabricating the same
09/28/2004US6798048 2-Metal layer TAB tape and both-sided CSP•BGA tape
09/28/2004US6798047 Pre-molded leadframe
09/28/2004US6798046 Semiconductor package including ring structure connected to leads with vertically downset inner ends
09/28/2004US6798045 Lead frame, circuit board with lead frame, and method for producing the lead frame