| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/30/2004 | US20040188831 Semiconductor package with heat spreader |
| 09/30/2004 | US20040188829 Package with integrated wick layer and method for heat removal |
| 09/30/2004 | US20040188828 Heat-conducting multilayer substrate and power module substrate |
| 09/30/2004 | US20040188827 Semiconductor device and method of assembling the same |
| 09/30/2004 | US20040188826 Interposer with signal and power supply through vias |
| 09/30/2004 | US20040188825 Package structure with increased capacitance and method |
| 09/30/2004 | US20040188824 Semiconductor interconnect having laser machined contacts |
| 09/30/2004 | US20040188823 Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules |
| 09/30/2004 | US20040188822 Semiconductor chip, semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 09/30/2004 | US20040188821 Wafer scale package and method of assembly |
| 09/30/2004 | US20040188820 Packaged microelectronic devices and methods for assembling microelectronic devices |
| 09/30/2004 | US20040188819 Wafer level methods for fabricating multi-dice chip scale semiconductor components |
| 09/30/2004 | US20040188818 Multi-chips module package |
| 09/30/2004 | US20040188817 Apparatus and method to minimize thermal impedance using copper on die backside |
| 09/30/2004 | US20040188815 Circuit substrate and electronic equipment |
| 09/30/2004 | US20040188814 Heat sink with preattached thermal interface material and method of making same |
| 09/30/2004 | US20040188813 Integrated circuit package with reduced stress on die and associated methods |
| 09/30/2004 | US20040188812 Semiconductor package having angulated interconnect surfaces |
| 09/30/2004 | US20040188811 Circuit package apparatus, systems, and methods |
| 09/30/2004 | US20040188810 Aluminum leadframes for semiconductor devices and method of fabrication |
| 09/30/2004 | US20040188804 Obverse/reverse discriminative rectangular nitride semiconductor wafer |
| 09/30/2004 | US20040188800 Edge intensive antifuse and method for making the same |
| 09/30/2004 | US20040188795 Semiconductor integrated circuit device |
| 09/30/2004 | US20040188785 Trilayered beam MEMS device and related methods |
| 09/30/2004 | US20040188782 Semiconductor device having multiple substrates |
| 09/30/2004 | US20040188764 Whole chip ESD protection |
| 09/30/2004 | US20040188763 Semiconductor device |
| 09/30/2004 | US20040188758 Semiconductor device |
| 09/30/2004 | US20040188748 Method of manufacturing a capacitor with copper electrodes and diffusion barriers |
| 09/30/2004 | US20040188747 Semiconductor device having capacitors and method of manufacturing the same |
| 09/30/2004 | US20040188746 Semiconductor device and fabrication method thereof |
| 09/30/2004 | US20040188745 Semiconductor device test patterns and related methods for precisely measuring leakage currents in semiconductor cell transistors |
| 09/30/2004 | US20040188709 Semiconductor alignment aid |
| 09/30/2004 | US20040188699 Semiconductor device and method of manufacture thereof |
| 09/30/2004 | US20040188679 Metal line layout of an integrated circuit |
| 09/30/2004 | US20040188678 Integrated semiconductor structure for reliability tests of dielectrics |
| 09/30/2004 | US20040188676 Epoxy resin composition and semiconductor apparatus |
| 09/30/2004 | US20040188593 Photosensor control unit |
| 09/30/2004 | US20040188503 Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same |
| 09/30/2004 | US20040188498 Electrically conductive wire |
| 09/30/2004 | US20040188399 Energy-efficient, laser-based method and system for processing target material |
| 09/30/2004 | US20040188378 Bumping process |
| 09/30/2004 | US20040188139 Wiring circuit board having bumps and method of producing same |
| 09/30/2004 | US20040188136 Method of production of multilayer circuit board with built-in semiconductor chip |
| 09/30/2004 | US20040188135 Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board |
| 09/30/2004 | US20040188123 Microelectronic component assemblies having exposed contacts |
| 09/30/2004 | US20040188080 Heat collector with mounting plate |
| 09/30/2004 | US20040188079 Heat-dissipation module for chip |
| 09/30/2004 | US20040188069 Electronic apparatus having a circulating path of liquid coolant |
| 09/30/2004 | US20040188066 Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange |
| 09/30/2004 | US20040188065 Decoupled spring-loaded mounting apparatus and method of manufacturing thereof |
| 09/30/2004 | US20040188064 Channeled flat plate fin heat exchange system, device and method |
| 09/30/2004 | US20040188063 Heat dissipating device |
| 09/30/2004 | US20040187984 of copper and molybdenum, and aluminum, gold, silver, titanium, nickel, cobalt or silicon; improved corrosion resistance |
| 09/30/2004 | US20040187976 Phase change lead-free super plastic solders |
| 09/30/2004 | US20040187975 Metal filling method and memeber with filled metal sections |
| 09/30/2004 | US20040187551 Device and method for fabricating lead frame by press forming, and resultant lead frame |
| 09/30/2004 | US20040187544 Method and apparatus for removing a carrier part from a carrier with a single operation, and a product removed from a carrier |
| 09/30/2004 | US20040187309 Methods of forming pluralities of microelectronic lids |
| 09/30/2004 | US20040187308 Method for fixing an electrical element and a module with an electrical element fixed thus |
| 09/30/2004 | US20040187307 Heat sink |
| 09/30/2004 | DE4447597B4 Semiconductor device with improved wiring structure |
| 09/30/2004 | DE29724849U1 Lichtabstrahlendes optisches Bauelement mit einer wellenlängenkonvertierenden Vergußmasse Light emitting device having an optical wavelength-converting casting composition |
| 09/30/2004 | DE19736754B4 Integriertes Gasentladungsbauelement zum Überspannungsschutz Integrated gas discharge device for overvoltage protection |
| 09/30/2004 | DE10358298A1 Modifizieren eines Halbleiterbauelements, um eine Überwachung elektrischer Parameter bereitzustellen Modifying a semiconductor device to provide a monitoring electrical parameters |
| 09/30/2004 | DE10310844A1 Gehäusekörper, optoelektronisches Bauelement mit einem solchen Gehäusekörper und Kunststoffgehäusematerial Housing body, optoelectronic component having such a housing body and plastic housing material |
| 09/30/2004 | DE10310842A1 Elektronisches Bauteil mit Halbleiterchip und Kunststoffgehäuse und Verfahren zur Herstellung desselben The same electronic device having the semiconductor chip and the plastic housing and methods for preparing |
| 09/30/2004 | DE10310617A1 Elektronisches Bauteil mit Hohlraum und ein Verfahren zur Herstellung desselben An electronic part having the cavity and a method of manufacturing the same |
| 09/30/2004 | DE10310554A1 Semiconductor component, especially an LDMOS transistor for use as a large signal amplifier in a base station, has separate planar and non-planar metalizing planes connected via a through contact |
| 09/30/2004 | DE10309677A1 Thin-film solder for connecting micro-electromechanical components, comprises mixture of gold and bismuth, e.g. in eutectic mixture |
| 09/30/2004 | DE10309302A1 Leistungshalbleitermodul mit Sensorikbauteil Power semiconductor module with sensor component |
| 09/30/2004 | CA2519893A1 Electrical connections in substrates |
| 09/29/2004 | EP1463388A2 Circuit board, process for producing the same and a power module employing the same |
| 09/29/2004 | EP1463129A2 Organic EL device and liquid crystal display with Peltier element |
| 09/29/2004 | EP1463116A2 Method for fabricating self-assembling microstructures |
| 09/29/2004 | EP1463115A2 Rectangular Nitride Compound Semiconductor Wafer with Obverse/Reverse Discriminative Marks |
| 09/29/2004 | EP1463114A1 Electronic assembly for removing heat from a flip chip |
| 09/29/2004 | EP1463113A1 Ceramic heat sink with micro-pores structure |
| 09/29/2004 | EP1463112A2 Heat sink with visible logo |
| 09/29/2004 | EP1463111A2 Multilayer circuit board with semiconductor chip |
| 09/29/2004 | EP1463109A2 Wiring layer fill structures |
| 09/29/2004 | EP1463104A2 Overmolded electronic package including circuit-carrying substrate |
| 09/29/2004 | EP1463098A2 Method of forming a laminated structure of polysilicon and tungsten silicide |
| 09/29/2004 | EP1462914A2 Support for a flash memory |
| 09/29/2004 | EP1462839A1 Module for optical image capturing device comprising objective lens and image sensor |
| 09/29/2004 | EP1461831A2 Device and method for package warp compensation in an integrated heat spreader |
| 09/29/2004 | EP1461830A2 Semiconductor power device metal structure and method of formation |
| 09/29/2004 | EP1461829A2 Dual cure b-stageable underfill for wafer level |
| 09/29/2004 | EP1461824A2 Metal-to-metal antifuse employing carbon-containing antifuse material |
| 09/29/2004 | EP1461816A2 Mems device having contact and standoff bumps and related methods |
| 09/29/2004 | EP1461815A1 Material deposition from a liquefied gas solution |
| 09/29/2004 | EP1461624A1 Method and apparatus for detecting bearing failure |
| 09/29/2004 | EP1461398A1 Use of paraffin-containing powders as phase-change materials (pcm) in polymer composites in cooling devices |
| 09/29/2004 | EP1461386A1 Electroconductive resin composition |
| 09/29/2004 | EP1193759B1 Ic device and its production method, and information carrier mounted with ic device |
| 09/29/2004 | EP1092339A4 Molded housing with integral heatsink |
| 09/29/2004 | EP0969964B1 A thermal control device |
| 09/29/2004 | EP0853337B1 Method for manufacturing semiconductor device |
| 09/29/2004 | CN2645239Y Digital photo shooting module packaging arrangement and process thereof |
| 09/29/2004 | CN2645238Y Digital image shooting module packaging arrangement and process thereof |