| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/30/2004 | WO2004084600A1 Semiconductor module and cooling device |
| 09/30/2004 | WO2004084599A1 Heat radiation device for a thin electronic appliance |
| 09/30/2004 | WO2004084598A1 Structural unit and method for the production of a structural unit |
| 09/30/2004 | WO2004084317A2 An optical sub-assembly for a transceiver |
| 09/30/2004 | WO2004084304A1 Semiconductor device |
| 09/30/2004 | WO2004084303A2 Flip-chip arrangment on a substrate carrier |
| 09/30/2004 | WO2004084302A1 Electronic devices |
| 09/30/2004 | WO2004084301A1 Split fin heat sink |
| 09/30/2004 | WO2004084300A1 Electrical connections in substrates |
| 09/30/2004 | WO2004084294A1 Method of manufacturing a semiconductor device, semiconductor device obtained by means of said method, and device for carrying outsuch a method |
| 09/30/2004 | WO2004084286A1 Film forming mehtod and film forming apparatus for semiconductor device |
| 09/30/2004 | WO2004084285A1 Film forming method and film forming apparatus for semiconductor device |
| 09/30/2004 | WO2004084284A1 Film forming method and apparatus |
| 09/30/2004 | WO2004084269A2 Low dielectric materials and methods of producing same |
| 09/30/2004 | WO2004083760A2 Multi-level microchannel heat exchangers |
| 09/30/2004 | WO2004083759A2 Apparatus and method of forming channels in a heat-exchanging device |
| 09/30/2004 | WO2004083742A2 Boiling temperature design in pumped microchannel cooling loops |
| 09/30/2004 | WO2004083492A1 Lead frame plating apparatus |
| 09/30/2004 | WO2004059708A3 Structure and method for bonding to copper interconnect structures |
| 09/30/2004 | WO2004003713A3 Cooling unit for cooling heat generating component |
| 09/30/2004 | US20040192810 Liquid epoxy resin composition and semiconductor device |
| 09/30/2004 | US20040192104 Apparatus and methods for cooling a processor socket |
| 09/30/2004 | US20040192101 Electronic device having removable processor assembly and method of operating same |
| 09/30/2004 | US20040192080 Electrical contact |
| 09/30/2004 | US20040192052 Viscous protective overlayers for planarization of integrated circuits |
| 09/30/2004 | US20040192045 Apparatus and methods for maskless pattern generation |
| 09/30/2004 | US20040192033 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
| 09/30/2004 | US20040192032 Semiconductor device and manufacturing method thereof |
| 09/30/2004 | US20040192029 Systems and methods for electrically isolating portions of wafers |
| 09/30/2004 | US20040192028 Method of fabricating integrated circuitry |
| 09/30/2004 | US20040192025 Semiconductor device and method of fabricating same |
| 09/30/2004 | US20040192024 Semiconductor device and method of manufacturing the same, semiconductor wafer, circuit board and electronic instrument |
| 09/30/2004 | US20040192022 Semiconductor configuration with UV protection |
| 09/30/2004 | US20040192021 Method of producing adhesion-barrier layer for integrated circuits |
| 09/30/2004 | US20040192020 Aluminum-beryllium alloys for air bridges |
| 09/30/2004 | US20040192019 Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method |
| 09/30/2004 | US20040192008 Semiconductor device including interconnection and capacitor, and method of manufacturing the same |
| 09/30/2004 | US20040192007 Method for fabricating metallic bit-line contacts |
| 09/30/2004 | US20040191989 UV-blocking layer for reducing UV-induced charging of SONOS dual-bit flash memory devices in BEOL processing |
| 09/30/2004 | US20040191964 Packaged microelectronic component assemblies |
| 09/30/2004 | US20040191962 Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices |
| 09/30/2004 | US20040191958 Method for connecting an integrated circuit to a substrate and corresponding arrangement |
| 09/30/2004 | US20040191957 Wafer scale package and method of assembly |
| 09/30/2004 | US20040191956 Print mask and method of manufacturing electronic components using the same |
| 09/30/2004 | US20040191955 Wafer-level chip scale package and method for fabricating and using the same |
| 09/30/2004 | US20040191954 Wire bonding for thin semiconductor package |
| 09/30/2004 | US20040191569 Magnetic component |
| 09/30/2004 | US20040191558 Heat spreader module and method of manufacturing same |
| 09/30/2004 | US20040191534 Stress-reducing structure for electronic devices |
| 09/30/2004 | US20040191532 comprising metal-oxide-containing layer, which is a ferroelectric or a paraelectsic which is covered by a hydrogen barrier layer, characterized in that the hydrogen barrier provides improved protection of a hydrogen-sensitive dielectric against hydrogen contamination |
| 09/30/2004 | US20040191497 Wiring member and method of manufacturing the same |
| 09/30/2004 | US20040191490 Circuit board, process for producing the same and a power module employing the same |
| 09/30/2004 | US20040190328 Semiconductor memory integrated circuit |
| 09/30/2004 | US20040190305 LED light with active cooling |
| 09/30/2004 | US20040190263 Thermal interface apparatus, systems, and methods |
| 09/30/2004 | US20040190262 Heat sink clip with rotating cam |
| 09/30/2004 | US20040190261 Cooler with blower between two heatsinks |
| 09/30/2004 | US20040190260 Heat sink with heat dissipating fins and method of manufacturing heat sink |
| 09/30/2004 | US20040190259 Integrated heat spreader with downset edge, and method of making same |
| 09/30/2004 | US20040190258 Heat sink clip and method |
| 09/30/2004 | US20040190257 Heat dissipating device for central processor |
| 09/30/2004 | US20040190256 Heat sink with visible logo |
| 09/30/2004 | US20040190254 Electronic assembly with fluid cooling and associated methods |
| 09/30/2004 | US20040190253 Channeled heat sink and chassis with integrated heat rejector for two-phase cooling |
| 09/30/2004 | US20040190252 Micro-channel heat exchangers and spreaders |
| 09/30/2004 | US20040190251 Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink |
| 09/30/2004 | US20040190250 Electronic component cooling apparatus |
| 09/30/2004 | US20040190248 High efficiency heat sink/air cooler system for heat-generating components |
| 09/30/2004 | US20040190245 Radial heat sink with skived-shaped fin and methods of making same |
| 09/30/2004 | US20040190220 Capacitor having copper electrodes and diffusion barrier layers |
| 09/30/2004 | US20040190208 Electrostatic discharge protection and methods thereof |
| 09/30/2004 | US20040189854 Module for optical device, and manufacturing method therefor |
| 09/30/2004 | US20040189353 Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage |
| 09/30/2004 | US20040189333 Carrier for receiving and electrically contacting individually separated dies |
| 09/30/2004 | US20040189195 Devices including, methods using, and compositions of reflowable getters |
| 09/30/2004 | US20040188864 Packaged device and method of packaging |
| 09/30/2004 | US20040188863 Substrate for semiconductor package and method of making same |
| 09/30/2004 | US20040188862 Low stress flip-chip package for low-K silicon technology |
| 09/30/2004 | US20040188860 Chip scale package and method for marking the same |
| 09/30/2004 | US20040188858 Semiconductor device and method of wire bonding for semiconductor device |
| 09/30/2004 | US20040188857 Semiconductor device |
| 09/30/2004 | US20040188856 [flip-chip die and flip-chip package substrate] |
| 09/30/2004 | US20040188853 Semiconductor device |
| 09/30/2004 | US20040188852 Semiconductor device |
| 09/30/2004 | US20040188851 Semiconductor device and method for manufacturing same |
| 09/30/2004 | US20040188850 Method of forming a robust copper interconnect by dilute metal doping |
| 09/30/2004 | US20040188849 Semiconductor device and pattern generating method |
| 09/30/2004 | US20040188848 Semiconductor device |
| 09/30/2004 | US20040188847 Glass sealed electrodes; diodes; electrode has a nickel-iron alloy overcoated with copper and copper oxide |
| 09/30/2004 | US20040188845 Semiconductor device having multilayer interconnection structure and method for manufacturing the device |
| 09/30/2004 | US20040188844 Semiconductor device and pattern generating method |
| 09/30/2004 | US20040188843 Semiconductor device having a guard ring |
| 09/30/2004 | US20040188842 Interconnect structure |
| 09/30/2004 | US20040188841 Extended length metal line for improved ESD performance |
| 09/30/2004 | US20040188839 Semiconductor device and method of manufacturing the same |
| 09/30/2004 | US20040188838 Semiconductor device for fingerprint recognition |
| 09/30/2004 | US20040188837 Wafer level package, multi-package stack, and method of manufacturing the same |
| 09/30/2004 | US20040188836 Copper ring solder mask defined ball grid array pad |
| 09/30/2004 | US20040188835 Semiconductor device having wiring layer |
| 09/30/2004 | US20040188833 Electronic component of a high frequency current suppression type and bonding wire for the same |