H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2004
10/06/2004	CN2646869Y A heat radiating structure
10/06/2004	CN2646868Y Pin joint mechanism for CPU thermal fan
10/06/2004	CN2646763Y Heat radiating fin set
10/06/2004	CN1535480A Semiconductor structure comprising electrostatic discharge (ESD) protection device
10/06/2004	CN1535479A Direct build-up layer on encapsulated die package
10/06/2004	CN1535478A Method and structure for buried circuits and devices
10/06/2004	CN1535477A Dual-damascene interconnects without etch stop layer by alternating ILDS
10/06/2004	CN1535436A System and method for product yield prediction
10/06/2004	CN1535331A Apparatus for plating treatment
10/06/2004	CN1535186A Ultra-rrequency of increasing resolution ratio in microdeposition controlling system
10/06/2004	CN1535185A Ultra-frequency in microdeposition control system for increasing resolution
10/06/2004	CN1535103A Wiring board
10/06/2004	CN1535085A Display device and mfg. method thereof
10/06/2004	CN1534778A Inlay metal inner connecting structure possessong double protective layer
10/06/2004	CN1534777A Semiconductor device with protective ring
10/06/2004	CN1534776A Semiconductor package and its lead wire frame
10/06/2004	CN1534775A Radiator with radiating fins and mfg. method thereof
10/06/2004	CN1534774A Assembling of heat radiation fin
10/06/2004	CN1534773A Manufacturing method of heat radiation fin
10/06/2004	CN1534772A Semiconductor device and mfg. method thereof
10/06/2004	CN1534771A Semiconductor device, 3-D mounted semiconductor device mfg. method, circuitboard and electronic apparatus
10/06/2004	CN1534770A Semiconductor device, circuit substrate and electronic apparatus
10/06/2004	CN1534766A 半导体器件 Semiconductor devices
10/06/2004	CN1534747A Device and method for mfg. leal wire frame formed by pressure and formed lead wire frame
10/06/2004	CN1534746A Printing mask and method for mfg. electronic element with mask
10/06/2004	CN1534739A Semiconductor device and mfg. method thereof
10/06/2004	CN1534735A Rectangular nitride semiconductor substrate capable of identifying outside and inside
10/06/2004	CN1534733A 半导体器件 Semiconductor devices
10/06/2004	CN1534677A Semiconductor device and data writing method therefor
10/06/2004	CN1534387A Photoetching mark structure, photoetching projection device and method of proceeding base plate aligning
10/06/2004	CN1534322A Module for optical apparatus and its mfg. method
10/06/2004	CN1534271A Device detection
10/06/2004	CN1534074A Epoxy resin composition solid device packed by same and method
10/06/2004	CN1533999A Low temperature sintered 99 aluminium oxide ceramic and its production method and use
10/06/2004	CN1533741A Semiconductor device for fingerprint identification
10/06/2004	CN1170365C Surface mounted electric element
10/06/2004	CN1170321C Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
10/06/2004	CN1170316C Semiconductor device and making method thereof
10/06/2004	CN1170315C Semiconductor chip package and method for fabricating the same
10/06/2004	CN1170314C Polymer-ceramic composite electronic substrate
10/06/2004	CN1170313C Multi-layer substrate of IC and arrangement method of holes on dielectric layers
10/06/2004	CN1170166C Method for controlling IC handler and control system using same
10/06/2004	CN1169903C Heat conducting electronic pouring sealant
10/06/2004	CN1169902C Binding composition for bonding semiconductor chips
10/06/2004	CN1169878C Flame-retardant epoxy resin composition and liminate made with same
10/05/2004	US6801462 Device and method for detecting alignment of deep trench capacitors and word lines in DRAM devices
10/05/2004	US6801438 Electrical circuit and method of formation
10/05/2004	US6801431 Integrated power delivery and cooling system for high power microprocessors
10/05/2004	US6801326 Method and apparatus for monitoring a chemical mechanical planarization process applied to metal-based patterned objects
10/05/2004	US6801313 Grooved pattern surrounding mark pattern formed by engraving protects against deformation by thermal expansion or contraction
10/05/2004	US6800950 Microstructure array, mold for forming a microstructure array, and method of fabricating the same
10/05/2004	US6800949 Embedded chip enclosure with solder-free interconnect
10/05/2004	US6800948 Ball grid array package
10/05/2004	US6800947 Flexible tape electronics packaging
10/05/2004	US6800946 Selective underfill for flip chips and flip-chip assemblies
10/05/2004	US6800945 Multi-chip semiconductor device with specific chip arrangement
10/05/2004	US6800944 Power/ground ring substrate for integrated circuits
10/05/2004	US6800943 Solid image pickup device
10/05/2004	US6800941 Integrated chip package structure using ceramic substrate and method of manufacturing the same
10/05/2004	US6800940 Low k dielectric composite layer for integrated circuit structure which provides void-free low k dielectric material between metal lines while mitigating via poisoning
10/05/2004	US6800939 Apparatus and method for providing low-loss transmission lines in interconnected mesh plane systems
10/05/2004	US6800938 Semiconductor device having amorphous barrier layer for copper metallurgy
10/05/2004	US6800936 High-frequency module device
10/05/2004	US6800933 Integrated circuit cooling device
10/05/2004	US6800932 Package for semiconductor die containing symmetrical lead and heat sink
10/05/2004	US6800931 Heat-dissipating device of a semiconductor device and fabrication method for same
10/05/2004	US6800930 Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies
10/05/2004	US6800929 Semiconductor device
10/05/2004	US6800928 Porous integrated circuit dielectric with decreased surface porosity
10/05/2004	US6800923 Multilayer analog interconnecting line layout for a mixed-signal integrated circuit
10/05/2004	US6800920 RF passive circuit and RF amplifier with via-holes
10/05/2004	US6800919 Semiconductor device having a redundancy function
10/05/2004	US6800918 EMI and noise shielding for multi-metal layer high frequency integrated circuit processes
10/05/2004	US6800906 Electrostatic discharge protection circuit
10/05/2004	US6800886 Semiconductor device and method for fabricating the same
10/05/2004	US6800883 CMOS basic cell and method for fabricating semiconductor integrated circuit using the same
10/05/2004	US6800816 Wiring circuit board having bumps and method of producing same
10/05/2004	US6800815 Materials and structure for a high reliability bga connection between LTCC and PB boards
10/05/2004	US6800804 Epoxy resin composition used for encapsulating semiconductor and semiconductor device using the composition
10/05/2004	US6800576 Aluminum nitride sintered bodies and members for semiconductor-producing apparatuses
10/05/2004	US6800555 Wire bonding process for copper-metallized integrated circuits
10/05/2004	US6800554 Copper alloys for interconnections having improved electromigration characteristics and methods of making same
10/05/2004	US6800552 Deposition of transition metal carbides
10/05/2004	US6800549 Method of fabricating semiconductor device including forming contact hole with anisotropic and isotropic etching and forming discontinuous barrier layer
10/05/2004	US6800547 Integrated circuit dielectric and method
10/05/2004	US6800537 Methods of making anisotropic conductive elements for use in microelectronic packaging
10/05/2004	US6800534 Method of forming embedded MIM capacitor and zigzag inductor scheme
10/05/2004	US6800533 Integrated vertical spiral inductor on semiconductor material
10/05/2004	US6800521 Process for the formation of RuSixOy-containing barrier layers for high-k dielectrics
10/05/2004	US6800516 Electrostatic discharge device protection structure
10/05/2004	US6800508 Semiconductor device, its manufacturing method and electrodeposition frame
10/05/2004	US6800507 Semiconductor device and a method of manufacturing the same
10/05/2004	US6800506 Method of making a bumped terminal in a laminated structure for a semiconductor chip assembly
10/05/2004	US6800505 Semiconductor device including edge bond pads and related methods
10/05/2004	US6800494 Method and apparatus for controlling copper barrier/seed deposition processes
10/05/2004	US6800373 Comprises at least one silicone resin, at least one epoxy resin, at least one anhydride curing agent, at least one siloxane surfactant, and at least one ancillary curing catalyst
10/05/2004	US6800189 Does not peel on bending
10/05/2004	US6799977 Socket having foam metal contacts
10/05/2004	US6799628 Heat exchanger having silicon nitride substrate for mounting high power electronic components
10/05/2004	US6799428 Heat exchanger

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