H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2004
10/07/2004	US20040195704 Alignment marks and manufacturing method for the same
10/07/2004	US20040195703 Method for accommodating small minimum die in wire bonded area array packages
10/07/2004	US20040195702 Wiring tape for semiconductor device including a buffer layer having interconnected foams
10/07/2004	US20040195701 Electronic package and method
10/07/2004	US20040195700 Multi-chip package combining wire-bonding and flip-chip configuration
10/07/2004	US20040195699 Semiconductor package with recess for die
10/07/2004	US20040195698 Semiconductor device having a contact window and fabrication method thereof
10/07/2004	US20040195697 Method of packaging circuit device and packaged device
10/07/2004	US20040195696 Integrated circuit die having a copper contact and method therefor
10/07/2004	US20040195694 BEOL decoupling capacitor
10/07/2004	US20040195692 Integrated circuit
10/07/2004	US20040195691 Circuit module and method for manufacturing the same
10/07/2004	US20040195690 Computerized standard cell library for designing integrated circuits (ICs) with high metal layer intra cell signal wiring, and ICs including same
10/07/2004	US20040195687 Semiconductor device and method for producing the same
10/07/2004	US20040195686 Semiconductor device and method of manufacturing the same
10/07/2004	US20040195685 System and method for venting pressure from an integrated circuit package sealed with a lid
10/07/2004	US20040195684 At least one opening may be formed through the RF component at least to the semiconductor substrate
10/07/2004	US20040195683 Compact electronic device and package used therefor
10/07/2004	US20040195682 Semiconductor device
10/07/2004	US20040195681 Multi-chip package
10/07/2004	US20040195680 Arrangement comprising at least two different electronic semiconductor circuits
10/07/2004	US20040195679 Wedgebond Pads Having A Nonplanar Surface Structure
10/07/2004	US20040195678 Thermoconductive composition
10/07/2004	US20040195677 Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices
10/07/2004	US20040195675 Power circuitry with a thermionic cooling system
10/07/2004	US20040195671 Semiconductor device
10/07/2004	US20040195670 Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics
10/07/2004	US20040195669 Integrated circuit packaging apparatus and method
10/07/2004	US20040195668 Semiconductor device, electronic device, electronic equipment, method of manufacturing semiconductor device, and method of manufacturing electronic device
10/07/2004	US20040195666 Stacked module systems and methods
10/07/2004	US20040195664 Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD device
10/07/2004	US20040195663 Metal support (leadframe) for the bonding of electrical or optoelectronic components
10/07/2004	US20040195662 Semiconductor package having non-ceramic based window frame
10/07/2004	US20040195661 Semiconductor package and lead frame therefor
10/07/2004	US20040195660 Composition for forming porous film, porous film and method for forming the same, interlayer insulator film, and semiconductor device
10/07/2004	US20040195659 Hydrogenated oxidized silicon carbon material
10/07/2004	US20040195652 Semiconductor device having inductor
10/07/2004	US20040195651 Center-tap transformers in integrated circuits
10/07/2004	US20040195649 Semiconductor device
10/07/2004	US20040195648 Semiconductor device
10/07/2004	US20040195647 Magnetic layer processing
10/07/2004	US20040195642 Internally reinforced bond pads
10/07/2004	US20040195635 Semiconductor device and method for manufacturing the same
10/07/2004	US20040195630 ESD protection device and method of making the same
10/07/2004	US20040195617 Nonvolatile semiconductor memory device and nonvolatile semiconductor memory system
10/07/2004	US20040195613 Semiconductor memory device capable of preventing oxidation of plug and method for fabricating the same
10/07/2004	US20040195607 Method of reducing erosion of a nitride gate cap layer during reactive ion etch of nitride liner layer for bit line contact of DRAM device
10/07/2004	US20040195606 Semiconductor manufacturing process and apparatus for modifying in-film stress of thin films, and product formed thereby
10/07/2004	US20040195601 Semiconductor memory device having ferroelectric capacitor and method of manufacturing the same
10/07/2004	US20040195591 Digital and RF system and method therefor
10/07/2004	US20040195584 Test insert with electrostatic discharge structures and associated methods
10/07/2004	US20040195582 Semiconductor device with guard ring for preventing water from entering circuit region from outside
10/07/2004	US20040195580 Optical cap for semiconductor device
10/07/2004	US20040195567 Thin film capacitor and electronic circuit component
10/07/2004	US20040195548 Forming an aqueous solution containing soluble precursors of a sulfur-containing phosphor; generating an aerosol of droplets from above solution, heating droplets to form a particulate intermediate compound capable of being post-treated to form said sulfur-containing phosphor powder
10/07/2004	US20040195208 Method and apparatus for performing hydrogen optical emission endpoint detection for photoresist strip and residue removal
10/07/2004	US20040195001 Tamper-responding encapsulated enclosure having flexible protective mesh structure
10/07/2004	US20040194999 Wiring board, method for manufacturing a wiring board and electronic equipment
10/07/2004	US20040194993 Compact circuit module
10/07/2004	US20040194927 Fan holder
10/07/2004	US20040194926 Heat sink assembly
10/07/2004	US20040194925 Heat sink with combined fins
10/07/2004	US20040194924 Heat sink
10/07/2004	US20040194923 Heat sink assembly for facilitating air flow
10/07/2004	US20040194922 Heat dissipation device with interlocking fins
10/07/2004	US20040194915 Thermal pouch interface
10/07/2004	US20040194910 Liquid/coolant system including boiling sensor
10/07/2004	US20040194861 Containing copper based alloys; inexpensive, flat, efficient heat dissipation, reliable joints
10/07/2004	US20040194856 Powder containing soft and hard ferromagnetic crystalline phases; heat treatment, rapid cooling; uniformity, performance
10/07/2004	US20040194803 Cleaning of an electronic device
10/07/2004	US20040194529 Method and tooling for z-axis offset of lead frames
10/07/2004	US20040194492 Hotspot coldplate spray cooling system
10/07/2004	US20040194305 Method of manufacture of ceramic composite wiring structures for semiconductor devices
10/07/2004	US20040194294 Methods for manufacturing resistors using a sacrificial layer
10/07/2004	DE10338504A1 Dummy-wafer for an oven process especially an oven process for layer separation where the front or rear side has an enhanced profile useful for layer separation in semiconductor technology
10/07/2004	DE10335071A1 Verfahren zur Integrierung einer Ausrichtmarkierung und Grabenvorrichtung A method for integrating an alignment device and grave
10/07/2004	DE102004013077A1 Photodetektor und Verfahren zur Herstellung des Photodetektors Photodetector and method of making the photodetector
10/07/2004	DE102004013056A1 Verfahren zur Herstellung eines Halbleiterbauelements und zugehörige Leiterplatte A process for producing a semiconductor device and associated circuit board
10/06/2004	EP1465471A2 Wiring board, method for manufacturing a wiring board and electronic equipment
10/06/2004	EP1465263A2 Cap for optical semiconductor device
10/06/2004	EP1465255A2 Integrated circuit
10/06/2004	EP1465254A1 Semiconductor chip with identification number generation unit
10/06/2004	EP1465253A2 Semiconductor package and lead frame therefor
10/06/2004	EP1465252A1 System and method for direct convective cooling of an exposed integrated circuit die surface
10/06/2004	EP1465251A2 Method for producing metal/ceramic bonded substrate
10/06/2004	EP1465250A1 Insulated power semiconductor module with reduced partial discharge and manufacturing method
10/06/2004	EP1465249A2 System and method for venting pressure from an integrated circuit package sealed with a lid
10/06/2004	EP1465246A2 Method for producing electrical through hole interconnects and devices made thereof
10/06/2004	EP1465245A2 Vapor Deposition of Benzotriazole (BTA) for protecting Copper Interconnects
10/06/2004	EP1465244A2 Integrated circuit package with exposed die surfaces and auxiliary attachment
10/06/2004	EP1465243A2 Dummy copper deprocessing
10/06/2004	EP1465241A2 Apparatus and method for cleaning an electronic device
10/06/2004	EP1464731A1 Plating apparatus, plating method, and method for manufacturing semiconductor device
10/06/2004	EP1464726A2 CVD method for forming a porous low dielectric constant SiOCH film
10/06/2004	EP1464671A1 Elastomer formed product
10/06/2004	EP1464410A1 Low dielectric materials and methods for making same
10/06/2004	EP1464083A2 Method for making a microcircuit card
10/06/2004	EP1464081A2 Chip module
10/06/2004	EP1463770A1 Organic composition
10/06/2004	EP1258181B1 Device for accommodating electric or electronic components

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