H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2004
10/12/2004	US6803326 Porous silicon oxycarbide integrated circuit insulator
10/12/2004	US6803325 Apparatus for improving barrier layer adhesion to HDP-FSG thin films
10/12/2004	US6803312 Semiconductor device and method for fabricating the same
10/12/2004	US6803304 Methods for producing electrode and semiconductor device
10/12/2004	US6803303 Method of fabricating semiconductor component having encapsulated, bonded, interconnect contacts
10/12/2004	US6803302 Method for forming a semiconductor device having a mechanically robust pad interface
10/12/2004	US6803301 Fuse configuration with modified capacitor border layout for a semiconductor storage device
10/12/2004	US6803300 Method of manufacturing a semiconductor device having a ground plane
10/12/2004	US6803291 Method to preserve alignment mark optical integrity
10/12/2004	US6803287 Method for forming a semiconductor device having contact wires of different sectional areas
10/12/2004	US6803286 Method of forming a local interconnect
10/12/2004	US6803271 Method for manufacturing semiconductor integrated circuit device
10/12/2004	US6803265 Liner for semiconductor memories and manufacturing method therefor
10/12/2004	US6803258 Semiconductor device
10/12/2004	US6803257 Printed circuit board with a heat dissipation element, method for manufacturing the printed circuit board, and package comprising the printed circuit board
10/12/2004	US6803256 Cap attach surface modification for improved adhesion
10/12/2004	US6803255 Dual gauge lead frame
10/12/2004	US6803254 Wire bonding method for a semiconductor package
10/12/2004	US6803253 Method for laminating and mounting semiconductor chip
10/12/2004	US6803252 Single and multiple layer packaging of high-speed/high-density ICs
10/12/2004	US6803251 Integrated device package and fabrication methods thereof
10/12/2004	US6803092 Selective deposition of circuit-protective polymers
10/12/2004	US6802985 Method for fabricating metal wirings
10/12/2004	US6802745 Housing for accomodating a power semiconductor module and contact element for use in the housing
10/12/2004	CA2319428C A method for generation of electrical conducting or semiconducting structures in three dimensions and methods for erasure of the same structures
10/12/2004	CA2302751C Endothermic cooling agents
10/07/2004	WO2004086827A2 Thermal apparatus for engaging electronic device
10/07/2004	WO2004086826A2 Esd dissipative structural components
10/07/2004	WO2004086565A1 Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method
10/07/2004	WO2004086502A1 Arrangement composed of an electrical component on a substrate, and method for the production of said arrangement
10/07/2004	WO2004086501A1 Heat radiator
10/07/2004	WO2004086500A2 (opto-)electronic housing provided with an adjustable cellular bottom and heat dissipation by thermoelectric effect (peltier) and method for the production thereof
10/07/2004	WO2004086498A1 Semiconductor device
10/07/2004	WO2004086493A1 Method for manufacturing electronic component-mounted board
10/07/2004	WO2004086492A1 Semiconductor device and method of manufacturing thereof
10/07/2004	WO2004086202A1 A security housing for a circuit
10/07/2004	WO2004085511A1 Resin composition for sealing semiconductor and semiconductor device using the same
10/07/2004	WO2004073047A3 Uv-blocking layer for reducing uv-induced charging of sonos dual-bit flash memory devices in beol processing
10/07/2004	WO2004068560A3 Area array package with non-electrically connected solder balls
10/07/2004	WO2004063980B1 Module for a hybrid card
10/07/2004	WO2004049443A3 Camouflaged circuit structure
10/07/2004	WO2004034240A3 A scalable computer system having surface-mounted capacitive couplers for intercommunication
10/07/2004	WO2000077907A9 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning
10/07/2004	US20040198922 Insulating-film forming material and insulating film using the same
10/07/2004	US20040198855 Insulating-film forming material and insulating film using the same
10/07/2004	US20040198580 comprises borosilicate-based glass containing silicon/aluminum/alkali earth metal oxide; controlled shrinkage while maintaining electrical properties
10/07/2004	US20040198253 Radio frequency monolithic integrated circuit and method for manufacturing the same
10/07/2004	US20040198153 Wafer support system
10/07/2004	US20040198081 Microelectronic spring contact elements
10/07/2004	US20040198068 Method for manufacturing semiconductor device
10/07/2004	US20040198059 Method of forming metal line of semiconductor device
10/07/2004	US20040198050 Method for fabricating a circuit device
10/07/2004	US20040198049 Diamondoid-containing low dielectric constant materials
10/07/2004	US20040198048 Diamondoid-containing field emission devices
10/07/2004	US20040198043 [discrete circuit component having fabrication stage clogged through-holes and process of making the same]
10/07/2004	US20040198040 Sloped via contacts
10/07/2004	US20040198039 Method and arrangement for contacting terminals
10/07/2004	US20040198036 Semiconductor device having a tapered interconnection with insulating material on conductive sidewall thereof within through hole
10/07/2004	US20040198035 Method of damascene process flow
10/07/2004	US20040198034 Localized slots for stress relieve in copper
10/07/2004	US20040198033 Double bumping of flexible substrate for first and second level interconnects
10/07/2004	US20040198023 Methods for forming protective layers on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein
10/07/2004	US20040198022 Method for forming a wafer level chip scale package, and package formed thereby
10/07/2004	US20040198018 Method of manufacturing a semiconductor device
10/07/2004	US20040198017 Method to solve alignment mark blinded issues and technology for application of semiconductor etching at a tiny area
10/07/2004	US20040198012 Method of manufacturing a wire bond-less electronic component for use with an external circuit
10/07/2004	US20040198007 Semiconductor device having a metal silicide layer and method for manufacturing the same
10/07/2004	US20040197991 Dual damascene interconnection with metal-insulator-metal capacitor and method of fabricating the same
10/07/2004	US20040197990 Semiconductor device and method of manufacturing the same
10/07/2004	US20040197979 Reinforced solder bump structure and method for forming a reinforced solder bump
10/07/2004	US20040197978 Housing for semiconductor devices, semiconductor device pin, and method for the manufacturing of pins
10/07/2004	US20040197960 Micro-scale interconnect device with internal heat spreader and method for fabricating same
10/07/2004	US20040197959 Semiconductor device and method of manufacturing the same
10/07/2004	US20040197958 Vapor deposition of benzotriazole (BTA) for protecting copper interconnects
10/07/2004	US20040197957 Integrated sensor packages and methods of making the same
10/07/2004	US20040197956 Memory expansion and chip scale stacking system and method
10/07/2004	US20040197955 Methods for assembly and packaging of flip chip configured dice with interposer
10/07/2004	US20040197954 Chip scale image sensor semiconductor package and method of fabrication
10/07/2004	US20040197952 Methods for assembly and packaging of flip chip configured dice with interposer
10/07/2004	US20040197951 Membrane IC fabrication
10/07/2004	US20040197948 Semiconductor package having thermal interface material (TIM)
10/07/2004	US20040197474 Method for enhancing deposition rate of chemical vapor deposition films
10/07/2004	US20040197433 Film removing apparatus, film removing method and substrate processing system
10/07/2004	US20040197046 Optical communication between face-to-face semiconductor chips
10/07/2004	US20040196711 Integrated semiconductor circuit having a cell array having a multiplicity of memory cells
10/07/2004	US20040196682 Semiconductor unit having two device terminals for every one input/output signal
10/07/2004	US20040196635 Stacked chip package with heat transfer wires
10/07/2004	US20040196634 Metal ball attachment of heat dissipation devices
10/07/2004	US20040196633 Microchannel heat pipe with parallel grooves for recycling coolant
10/07/2004	US20040196632 Heat dissipation module
10/07/2004	US20040196630 [cooling system]
10/07/2004	US20040196629 Processor shroud adaptor for multiple CPU locations
10/07/2004	US20040196609 Protection circuit scheme for electrostatic discharge
10/07/2004	US20040196608 Method and apparatus for protecting wiring and integrated circuit device
10/07/2004	US20040196329 Method for the printing of homogeneous electronic material with a multi-ejector print head
10/07/2004	US20040196130 High density multi-layer microcoil and method for fabricating the same
10/07/2004	US20040196082 Circuit arrangement
10/07/2004	US20040196061 Socket or adapter device for semiconductor devices, method for testing semiconductor devices, and system comprising at least one socket or adapter device
10/07/2004	US20040196057 Socket or adapter device for semiconductor devices, method for testing semiconductor devices, and system comprising at least one socket or adapter device
10/07/2004	US20040196031 Interconnection pattern inspection method, manufacturing method of semiconductor device and inspection apparatus

1 ... 1462 1463 1464 1465 1466 1467 1468 1469 1470 1471 1472 1473 1474 1475 1476 1477 1478 1479 1480 1481 1482 ... 2262