H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2004
10/13/2004	CN2648604Y Fin type radiating device
10/13/2004	CN2648603Y Radiator
10/13/2004	CN2648602Y Assembling radiator structure
10/13/2004	CN2648601Y Improvement of radiating fin joining structure
10/13/2004	CN2648600Y Structure of radiating fin combination
10/13/2004	CN2648599Y Radiating fin for semiconductor packaged element
10/13/2004	CN2648598Y CPU radiator base
10/13/2004	CN2648597Y Plate type electronic power semiconductor device assembly
10/13/2004	CN2648499Y Radiated wing fin
10/13/2004	CN2648498Y Radiated model group
10/13/2004	CN2648497Y Radiating structure used expanded inserting case wind plate forming model group
10/13/2004	CN2648496Y Radiator for chip of computer
10/13/2004	CN2648495Y Case with radiating device of chip for computer
10/13/2004	CN1537332A 半导体器件 Semiconductor devices
10/13/2004	CN1537331A Circuit module and method for mfg. the same
10/13/2004	CN1537315A Material deposition from liquefied gas solution
10/13/2004	CN1537137A Flame retardant molding compositions
10/13/2004	CN1536950A Wiring board, wiring board mfg. method and electronic equipment
10/13/2004	CN1536765A Compact electronic device and its package
10/13/2004	CN1536673A 半导体集成电路器件 The semiconductor integrated circuit device
10/13/2004	CN1536662A 集成电路 IC
10/13/2004	CN1536661A Semiconductor device
10/13/2004	CN1536660A Semiconductor device and its mfg. method
10/13/2004	CN1536658A Semiconductor device and its mfg. method
10/13/2004	CN1536657A Method for making thermal superconducting radiating module
10/13/2004	CN1536656A Die casting or casting formed radiating end structure
10/13/2004	CN1536655A Combined heat-conducting module
10/13/2004	CN1536654A Method for making thermal superconducting block, sheet and cover body
10/13/2004	CN1536653A Heat conduction composite chip and its mfg. method
10/13/2004	CN1536652A Structure for enlarging radiating module area by using heat-conducting element
10/13/2004	CN1536651A Heat-conducting block capable of transferring heat quantity for long distance
10/13/2004	CN1536644A Method for forming metal wire of semiconductor device
10/13/2004	CN1536643A Making method for multilayer semiconductor integrated circuit structure, and its circuit structure
10/13/2004	CN1536634A Semiconductor chip manufacturing method
10/13/2004	CN1536633A Resin sealed semiconductor, resin sealing method and forming die
10/13/2004	CN1536632A Manufacturing method for mounting substrate and method for making circuit device
10/13/2004	CN1536631A Electrically-connecting pad electroplated metal layer structrure of semiconductor package base plate and its making metod
10/13/2004	CN1536614A Cleaning of electronic device
10/13/2004	CN1536613A Substrate element and soft substrate
10/13/2004	CN1536464A Radiator for protable computer
10/13/2004	CN1536462A Heat-radiating module
10/13/2004	CN1536314A Method for making plate-type heat-radiating module
10/13/2004	CN1536023A Porous membrane shaping composition, preparation method of porous membrane, porous membrane intercalation insulating film and semiconductor device
10/13/2004	CN1535780A Compression casting or casting forming method of thermal superconducting heat-conducting block, plate and cover body
10/13/2004	CN1171312C Multiwafer integrated circuit package structure
10/13/2004	CN1171311C 半导体封装件 The semiconductor package
10/13/2004	CN1171310C 球栅阵列半导体封装 A ball grid array semiconductor package
10/13/2004	CN1171309C Semiconductor lead frame with multilayer plated layer and its producing method
10/13/2004	CN1171308C Package of image inductor
10/13/2004	CN1171307C Semiconductor apparatus and base plate
10/13/2004	CN1171306C Semiconductor package with exposed wafer seat
10/13/2004	CN1171305C Device for controlling clearance of heat radiation surface
10/13/2004	CN1171301C Method for generating electrical conducting or semiconducting structures method for erasing same structures and electric field generator/modulator
10/13/2004	CN1171299C Semiconductor device and manufacture thereof, substrate, electronic device
10/13/2004	CN1171298C 半导体器件 Semiconductor devices
10/13/2004	CN1171290C Porous insulating material and method for making same
10/13/2004	CN1171284C Manufacture of grid electrode conductor layer cavity fuse
10/13/2004	CN1170885C Thermosetting resin composition
10/13/2004	CN1170817C 前列腺素e类似物 E prostaglandin analogs
10/13/2004	CN1170650C Soldering tin blow device and tin-soldering method thereof
10/12/2004	US6804276 Semiconductor laser device which removes influences from returning light of three beams and a method of manufacturing the same
10/12/2004	US6804275 Heat sink and semiconductor laser apparatus and semiconductor laser stack apparatus using the same
10/12/2004	US6804159 Semiconductor device having fuse and its manufacture method
10/12/2004	US6804118 Thermal dissipation assembly for electronic components
10/12/2004	US6804105 Enriched macromolecular materials having temperature-independent high electrical conductivity and methods of making same
10/12/2004	US6804103 Electronic component and method for manufacturing the same
10/12/2004	US6803849 Solid state inducting device
10/12/2004	US6803829 Integrated VCO having an improved tuning range over process and temperature variations
10/12/2004	US6803669 Integrated circuits having self-aligned metal contact structures
10/12/2004	US6803668 Process-robust alignment mark structure for semiconductor wafers
10/12/2004	US6803667 Prevents short-circuiting; heat and stress resistance
10/12/2004	US6803666 Semiconductor chip mounting substrate and semiconductor device using the same
10/12/2004	US6803665 Off-chip inductor
10/12/2004	US6803664 Semiconductor package
10/12/2004	US6803663 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
10/12/2004	US6803662 Low dielectric constant material reinforcement for improved electromigration reliability
10/12/2004	US6803661 Polysilicon processing using an anti-reflective dual layer hardmask for 193 nm lithography
10/12/2004	US6803660 Patterning layers comprised of spin-on ceramic films
10/12/2004	US6803659 Semiconductor device and an electronic device
10/12/2004	US6803657 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components
10/12/2004	US6803656 Semiconductor device including combed bond pad opening
10/12/2004	US6803655 Semiconductor integrated circuit device with EMI prevention structure
10/12/2004	US6803654 Heat-radiating device of chip
10/12/2004	US6803653 Apparatus for suppressing packaged semiconductor chip curvature while minimizing thermal impedance and maximizing speed/reliability
10/12/2004	US6803652 Heat dissipation device having a load centering mechanism
10/12/2004	US6803651 Optoelectronic semiconductor package device
10/12/2004	US6803650 Semiconductor die package having mesh power and ground planes
10/12/2004	US6803649 Electronic assembly
10/12/2004	US6803648 Integrated circuit packages with interconnects on top and bottom surfaces
10/12/2004	US6803647 Mounting structure of semiconductor device and mounting method thereof
10/12/2004	US6803646 Semiconductor device having first chip secured within resin layer and second chip secured on resin layer
10/12/2004	US6803645 Semiconductor package including flip chip
10/12/2004	US6803633 Electrostatic discharge protection structures having high holding current for latch-up immunity
10/12/2004	US6803632 Semiconductor circuit having an input protection circuit
10/12/2004	US6803613 Semiconductor device and manufacturing method of the same
10/12/2004	US6803612 Integrated circuit having electrical connecting elements
10/12/2004	US6803520 High speed to-package external interface
10/12/2004	US6803329 Method for low temperature liquid-phase deposition and method for cleaning liquid-phase deposition apparatus
10/12/2004	US6803328 Print thermally conductive interface assembly
10/12/2004	US6803327 Cost effective polymide process to solve passivation extrusion or damage and SOG delminates

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