Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2004
10/14/2004US20040203193 Semiconductor device substrate, semiconductor device, and manufacturing method thereof
10/14/2004US20040203192 Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers
10/14/2004US20040203191 Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate
10/14/2004US20040203190 Stacked packages
10/14/2004US20040203188 Method and apparatus for forming thin microelectronic dies
10/14/2004US20040203187 Method for manufacturing semiconductor wafer
10/14/2004US20040203186 Metal wiring method for an undercut
10/14/2004US20040203184 Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates
10/14/2004US20040202864 Granular epoxy resin, production method thereof, and granular epoxy resin package
10/14/2004US20040202847 Wiring structure having a slit dummy
10/14/2004US20040202560 Circuit board adapted to fan and fan structure
10/14/2004US20040202535 Eccentric heat dispensing fans
10/14/2004US20040202534 Fan control apparatus and fan control method
10/14/2004US20040201966 Heat conducting body with a thermo-chromic dye coated thereon
10/14/2004US20040201964 Snap-in heat sink for semiconductor mounting
10/14/2004US20040201963 Heat dissipation unit with direct contact heat pipe
10/14/2004US20040201961 Heat-dissipating device and a housing thereof
10/14/2004US20040201958 System and method for cooling an electronic device
10/14/2004US20040201941 Direct application voltage variable material, components thereof and devices employing same
10/14/2004US20040201398 Conductive material for integrated circuit fabrication
10/14/2004US20040201397 Method and apparatus for die testing on wafer
10/14/2004US20040201396 Floating interposer
10/14/2004US20040201136 Material separation to form segmented product
10/14/2004US20040201113 Conductive contamination reliability solution for assembling substrates
10/14/2004US20040201111 Interposer substrates with multisegment interconnect slots, semiconductor die packages including same, semiconductor dice for use therewith and methods of fabrication
10/14/2004US20040201109 Semiconductor devices, manufacturing methods therefore, circuit substrates and electronic devices
10/14/2004US20040201108 Semiconductor device and method for manufacturing the same
10/14/2004US20040201106 Semiconductor chip; copper pads; solder connectors; integrated circuits; prevent damage
10/14/2004US20040201105 Wiring board and method for producing same
10/14/2004US20040201104 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation
10/14/2004US20040201102 Semiconductor device
10/14/2004US20040201101 Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures
10/14/2004US20040201100 Integrated optical receiver
10/14/2004US20040201098 Architecture for mask programmable devices
10/14/2004US20040201097 Semiconductor device and method for manufacturing the same
10/14/2004US20040201096 Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
10/14/2004US20040201095 Through-via vertical interconnects, through-via heat sinks and associated fabrication methods
10/14/2004US20040201094 Semiconductor device
10/14/2004US20040201093 Evaluating pattern for measuring and erosion of a semiconductor wafer polished by a chemical mechanical polishing
10/14/2004US20040201092 Semiconductor device
10/14/2004US20040201091 Stacked module systems and methods
10/14/2004US20040201090 Electronic device with cavity and a method for producing the same
10/14/2004US20040201089 Semiconductor devices and manufacturing methods therefore
10/14/2004US20040201087 Stack package made of chip scale packages
10/14/2004US20040201086 Flip chip in leaded molded package with two dies
10/14/2004US20040201085 Multi-chip circuit module and method for producing the same
10/14/2004US20040201082 Resin sealing-type semiconductor device and method for manufacturing the same
10/14/2004US20040201081 Lead frame structure with aperture or groove for flip chip in a leaded molded package
10/14/2004US20040201080 Leadless leadframe electronic package and IR transceiver incorporating same
10/14/2004US20040201078 Field plate structure for high voltage devices
10/14/2004US20040201075 Semiconductor die configured for use with interposer substrates having reinforced interconnect slots
10/14/2004US20040201074 Layered microelectronic contact and method for fabricating same
10/14/2004US20040201062 Semiconductor device
10/14/2004US20040201051 Integrated semiconductor circuit having a multiplicity of memory cells
10/14/2004US20040201034 Semiconductor device
10/14/2004US20040201016 Interconnect structure
10/14/2004US20040200886 Tin antimony solder for MOSFET with TiNiAg back metal
10/14/2004US20040200885 Methods for assembling semiconductor devices in stacked arrangements by positioning spacers therebetween
10/14/2004US20040200879 Thermal interface material and solder preforms
10/14/2004US20040200726 Reducing space between wire bonding pads by preventing nickel plating layer and gold plating layer from protruding at the lower portion of a copper pattern by filling the spaces between the copper patterns with a and applying plating layers on the exposed surface of the copper; semiconductor packages
10/14/2004US20040200638 Bonding pads for a printed circuit board
10/14/2004US20040200609 Heat sink with multiple micro bosses
10/14/2004US20040200608 Plate fins with vanes for redirecting airflow
10/14/2004US20040200601 Heat sink assembly
10/14/2004US20040200600 Cpu radiator holding mechanism
10/14/2004US20040200577 Terminal electrode forming method in chip-style electronic component and apparatus therefor
10/14/2004US20040200229 Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator
10/14/2004US20040200067 Method of machining glass substrate and method of fabricating high-frequency circuit
10/14/2004US20040200063 Interposer substrates with multi-segment interconnect slots, semiconductor die packages including same, semiconductor dice for use therewith and methods of fabrication
10/14/2004US20040200062 Leadframeless package structure and method
10/14/2004US20040200061 Conductive pattern and method of making
10/14/2004US20040200045 Retaining apparatus
10/14/2004DE10358768A1 Metal line formation method in semiconductor device, involves performing etching process to form metal fuse with one side connected to metal line and other side to substrate and isolating metal line and metal fuse electrically
10/14/2004DE10352436A1 Druckkontakt-Halbleitervorrichtung The pressure contact type semiconductor device
10/14/2004DE10314346A1 Fan-less cooling system for computer processor or power circuitry, has metal base plate of higher thermal conductivity than aluminum plate fixed to it, and heat pipe
10/14/2004DE10313832A1 Baueinheit und Verfahren zur Herstellung einer Baueinheit Assembly and method for making a structural unit
10/14/2004DE10311965A1 Flip-Chip Anordnung auf einem Substratträger Flip-chip mounting on a substrate support
10/14/2004DE10308095B3 Elektronisches Bauteil mit mindestens einem Halbleiterchip auf einem Schaltungsträger und Verfahren zur Herstellung desselben The same electronic component having at least a semiconductor chip on a circuit carrier and methods for preparing
10/14/2004DE102004009014A1 Fluidantriebseinheit und Wärmetransportsystem Fluid drive unit and heat transport system
10/14/2004DE102004001027A1 Wärmeableitungsvorrichtung und Verfahren zu deren Herstellung Heat dissipation device and process for their preparation
10/14/2004CA2520992A1 Method for manufacturing an electronic module and an electronic module
10/14/2004CA2464280A1 Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
10/14/2004CA2464153A1 Low cost lighting circuits manufactured from conductive loaded resin-based materials
10/13/2004EP1467607A1 Power switch module and inverter with such a module
10/13/2004EP1467407A1 Power semiconductor module
10/13/2004EP1466707A2 A method of removing selected portions of material from a base material
10/13/2004EP1466365A2 Method of manufacturing an integrated circuit, integrated circuit obtained in accordance with said method, wafer provided with an integrated circuit obtained in accordance with the method, and system comprising an integrated circuit obtained by means of the method
10/13/2004EP1466364A1 Electronic component and panel and method for the production thereof
10/13/2004EP1466363A1 Semiconductor device with co-packaged die
10/13/2004EP1466360A1 Feedthrough contacts and method for producing the same
10/13/2004EP1466359A2 Use of conductive electrolessly deposided etch stop layers, liner layers and via plugs in interconnect structures
10/13/2004EP1466358A2 Copper interconnect doped with carbon and silicon
10/13/2004EP1466357A1 Surface mounted package with die bottom spaced from support board
10/13/2004EP1466355A2 Organic compositions
10/13/2004EP1466354A2 Dielectric films for narrow gap-fill applications
10/13/2004EP1466352A1 Method of forming copper interconnections for semiconductor integrated circuits on a substrate
10/13/2004EP1390980B1 Semiconductor structure comprising an electrostatic discharge (esd) protection device
10/13/2004EP1005642B1 Method and device for determining a parameter for a metallization bath
10/13/2004EP0996979B1 Housing for at least one semiconductor body
10/13/2004CN2648605Y Water-cooled plate type electronic power semiconductor device assembly
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