Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2014
03/04/2014US8664769 Semiconductor device
03/04/2014US8664768 Interposer having a defined through via pattern
03/04/2014US8664767 Conductive routings in integrated circuits using under bump metallization
03/04/2014US8664766 Interconnect structure containing non-damaged dielectric and a via gouging feature
03/04/2014US8664765 Semiconductor device
03/04/2014US8664764 Semiconductor device including a core substrate and a semiconductor element
03/04/2014US8664763 Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus
03/04/2014US8664762 Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package
03/04/2014US8664761 Semiconductor structure and manufacturing method of the same
03/04/2014US8664760 Connector design for packaging integrated circuits
03/04/2014US8664759 Integrated circuit with heat conducting structures for localized thermal control
03/04/2014US8664758 Semiconductor package having reliable electrical connection and assembling method
03/04/2014US8664756 Reconstituted wafer package with high voltage discrete active dice and integrated field plate for high temperature leakage current stability
03/04/2014US8664755 Power module package and method for manufacturing the same
03/04/2014US8664754 High power semiconductor package with multiple conductive clips
03/04/2014US8664753 Semiconductor device with protruding component portion and method of packaging
03/04/2014US8664752 Semiconductor die package and method for making the same
03/04/2014US8664751 Semiconductor package
03/04/2014US8664750 Semiconductor substrate, package and device
03/04/2014US8664749 Component stacking using pre-formed adhesive films
03/04/2014US8664748 Package-level integrated circuit connection without top metal pads or bonding wire
03/04/2014US8664745 Integrated inductor
03/04/2014US8664744 Anti-fuse element without defective opens
03/04/2014US8664726 Electrostatic discharge (ESD) protection device, method of fabricating the device, and electronic apparatus including the device
03/04/2014US8664725 Strain enhanced transistors with adjustable layouts
03/04/2014US8664724 Semiconductor devices having slit well tub
03/04/2014US8664723 Integrated circuit structures having base resistance tuning regions and methods for forming the same
03/04/2014US8664666 Semiconductor device and process for fabricating the same
03/04/2014US8664660 Semiconductor device and manufacturing method thereof
03/04/2014US8664656 Devices and methods for embedding semiconductors in printed circuit boards
03/04/2014US8664112 Methods for forming interconnect structures for integration of multi-layered integrated circuit devices
03/04/2014US8664047 Integrated circuit tampering protection and reverse engineering prevention coatings and methods
03/04/2014US8664046 Manufacturing method thereof and a semiconductor device
03/04/2014US8664044 Method of fabricating land grid array semiconductor package
03/04/2014US8664025 Substrate dicing technique for separating semiconductor dies with reduced area consumption
03/04/2014US8662402 Securities, chip mounting product, and manufacturing method thereof
02/2014
02/27/2014WO2014031823A1 Power device and packaging thereof
02/27/2014WO2014031444A1 Mtp mtj device
02/27/2014WO2014030760A1 Device and method of manufacturing the same
02/27/2014WO2014030659A1 Insulating substrate、multilayer ceramic insulating substrate, joined structure of power semiconductor device and insulating substrate, and power semiconductor module
02/27/2014WO2014030493A1 Sensor device
02/27/2014WO2014030414A1 FILM FORMING APPARATUS, METHOD OF FORMING LOW-PERMITTIVITY FILM, SiCO FILM, AND DAMASCENE INTERCONNECT STRUCTURE
02/27/2014WO2014030355A1 Wiring board
02/27/2014WO2014029930A1 Flip-chip hybridisation of two microelectronic components using a uv anneal
02/27/2014WO2014029417A1 Packing for microelectronic components
02/27/2014WO2014029161A1 Honeycomb panel-type high-power led radiator
02/27/2014WO2014029152A1 Semiconductor structure and manufacturing method thereof
02/27/2014WO2014029151A1 Semiconductor structure and manufacturing method therefor
02/27/2014WO2013181000A3 Fine-pitch flexible wiring
02/27/2014US20140059325 Integrated circuit apparatus, three-dimensional integrated circuit, three-dimensional processor device, and process scheduler, with configuration taking account of heat
02/27/2014US20140057431 Methods and Apparatus of Packaging Semiconductor Devices
02/27/2014US20140057428 Buffer layer for sintering
02/27/2014US20140057392 Copper Post Solder Bumps on Substrates
02/27/2014US20140055795 Space imaging overlay inspection method and array substrate
02/27/2014US20140055217 Die-to-die electrical isolation in a semiconductor package
02/27/2014US20140054803 Compound barrier layer, method for forming the same and package structure using the same
02/27/2014US20140054802 Semiconductor Device and Method of Forming RDL Using UV-Cured Conductive Ink Over Wafer Level Package
02/27/2014US20140054801 Electronic device
02/27/2014US20140054800 Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement
02/27/2014US20140054799 Three-Dimensional Multichip Module
02/27/2014US20140054798 Sensor packages and method of packaging dies of differing sizes
02/27/2014US20140054797 Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
02/27/2014US20140054796 Stacked microelectronic packages having patterened sidewall conductors and methods for the fabrication thereof
02/27/2014US20140054795 Electronic Assembly With Three Dimensional Inkjet Printed Traces
02/27/2014US20140054794 Memory process and memory structure made thereby
02/27/2014US20140054793 Chip on Film (COF) Substrate, COF Package and Display Device Including the Same
02/27/2014US20140054792 Package assembly and method of manufacturing the same
02/27/2014US20140054791 Through silicon via packaging structures and fabrication method
02/27/2014US20140054790 Three-dimensional integrted circuit structure and method of aluminum nitride interposer substrate
02/27/2014US20140054789 Multi-Level Vertical Plug Formation With Stop Layers of Increasing Thicknesses
02/27/2014US20140054787 Methods of forming a stack of electrodes and three-dimensional semiconductor devices fabricated thereby
02/27/2014US20140054786 Chip package and method for forming the same
02/27/2014US20140054785 Chip package structure and method for manufacturing same
02/27/2014US20140054784 Integrated Circuit Connector Access Region and Method for Making
02/27/2014US20140054783 Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
02/27/2014US20140054782 Method for fabricating semiconductor device and semiconductor device
02/27/2014US20140054781 Copper Ball Bond Features and Structure
02/27/2014US20140054780 Method for Manufacturing an Electronic Module and an Electronic Module
02/27/2014US20140054779 Semiconductor Having a High Aspect Ratio Via
02/27/2014US20140054778 Semiconductor device having a copper plug
02/27/2014US20140054777 Semiconductor device with copper wirebond sites and methods of making same
02/27/2014US20140054776 Methods, devices, and materials for metallization
02/27/2014US20140054775 Semiconductor devices including metal-silicon-nitride patterns and methods of forming the same
02/27/2014US20140054774 Semiconductor device and method of manufacturing the same
02/27/2014US20140054773 Electronic component built-in substrate and method of manufacturing the same
02/27/2014US20140054772 Semiconductor packages including through electrodes and methods of manufacturing the same
02/27/2014US20140054771 Method for Self-Assembly of Substrates and Devices Obtained Thereof
02/27/2014US20140054770 Terminal structure, and semiconductor element and module substrate comprising the same
02/27/2014US20140054769 Terminal structure, and semiconductor element and module substrate comprising the same
02/27/2014US20140054768 Terminal structure and semiconductor device
02/27/2014US20140054767 Terminal structure and semiconductor device
02/27/2014US20140054766 Lead-free solder bump bonding structure
02/27/2014US20140054765 Driving chip and method of manufacturing the same
02/27/2014US20140054764 Semiconductor package and method of manufacturing the same
02/27/2014US20140054763 Thin wafer handling and known good die test method
02/27/2014US20140054762 Semiconductor module cooler
02/27/2014US20140054761 On-Chip Heat Spreader
02/27/2014US20140054760 Package-on-package semiconductor device
02/27/2014US20140054759 Method of manufacturing semiconductor device
02/27/2014US20140054758 Stacked dual chip package having leveling projections
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