Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2004
10/20/2004CN1172372C Inductro for integrated cirucit
10/20/2004CN1172370C Semiconductor device and manufacturing method for semiconductor device
10/20/2004CN1172369C Semiconductor package with heat radiator
10/20/2004CN1172368C Semiconductor device
10/20/2004CN1172367C Combined part of metal base
10/20/2004CN1172226C Electronic equipment, expanding equipment for extending function of the electronic equipment
10/19/2004US6807503 Wafer-like object has capability to sense, sample, analyze, memorize and/or communicate its status and/or experience by way of sensors; first is temperature sensor and second is pressure, chemical, surface tension or surface stress sensor
10/19/2004US6807345 Systems and methods for removing heat from opto-electronic components
10/19/2004US6807079 Device having a state dependent upon the state of particles dispersed in a carrier
10/19/2004US6807078 Semiconductor input/output circuit arrangement
10/19/2004US6807064 Electronic component with at least one semiconductor chip and method for producing the electronic component
10/19/2004US6807063 High-frequency integrated circuit module
10/19/2004US6807061 Stack up assembly
10/19/2004US6807059 Stud welded pin fin heat sink
10/19/2004US6807058 Heat sink and combinations
10/19/2004US6807057 Apparatus and method for cooling an electronic device
10/19/2004US6807041 Electronic triggering for heating elements
10/19/2004US6806933 Array substrate with multi-layer electrode line
10/19/2004US6806793 MLC frequency selective circuit structures
10/19/2004US6806658 Method for making an LED
10/19/2004US6806582 PAD arrangement in semiconductor memory device and method of driving semiconductor device
10/19/2004US6806579 Robust via structure and method
10/19/2004US6806578 Copper pad structure
10/19/2004US6806577 Fill pattern generation for spin-on glass and related self-planarization deposition
10/19/2004US6806576 Passivation integrity improvements
10/19/2004US6806575 Subresolution features for a semiconductor device
10/19/2004US6806574 Semiconductor device capable of reducing electromigration occurring in multilevel interconnections of a high-speed integrated circuit that has a small-sized feature according to submicron design rules
10/19/2004US6806570 Thermal compliant semiconductor chip wiring structure for chip scale packaging
10/19/2004US6806569 Multi-frequency power delivery system
10/19/2004US6806568 Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methods
10/19/2004US6806567 Chip on board with heat sink attachment and assembly
10/19/2004US6806565 Chip carrier for accommodating a multi-media card chip
10/19/2004US6806564 Semiconductor apparatus with decoupling capacitor
10/19/2004US6806563 Composite capacitor and stiffener for chip carrier
10/19/2004US6806562 Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the two
10/19/2004US6806560 Semiconductor device and method for fabricating same
10/19/2004US6806556 Semiconductor wafer, method of manufacturing semiconductor wafer having bumps, semiconductor chip having bumps and method of manufacturing the same, semiconductor device, circuit board, and electronic equipment
10/19/2004US6806551 Fuse construction for integrated circuit structure having low dielectric constant dielectric material
10/19/2004US6806518 Semiconductor memory devices having dummy active regions
10/19/2004US6806506 Semiconductor device having leads provided with interrupter for molten resin
10/19/2004US6806501 Integrated circuit having SiC layer
10/19/2004US6806428 Module component and method of manufacturing the same
10/19/2004US6806344 Poly-o-hydroxamide, polybenzoxazole, and electronic component including a dielectric having a barrier effect against copper diffusion, and processes for preparing poly-o-hydroxyamides, polybenzoxazoles, and electronic components
10/19/2004US6806208 Semiconductor device structured to prevent oxide damage during HDP CVD
10/19/2004US6806207 Method of depositing low K films
10/19/2004US6806192 Method of barrier-less integration with copper alloy
10/19/2004US6806188 Semiconductor device capable of preventing ring defect and method of manufacturing the same
10/19/2004US6806187 Electrical contact for high dielectric constant capacitors and method for fabricating the same
10/19/2004US6806181 Method of fabricating an air bridge
10/19/2004US6806176 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument
10/19/2004US6806168 Healing of micro-cracks in an on-chip dielectric
10/19/2004US6806162 Method for composing a dielectric layer within an interconnect structure of a multilayer semiconductor device
10/19/2004US6806161 Process for preparing insulating material having low dielectric constant
10/19/2004US6806122 Ball grid array module
10/19/2004US6806121 Interconnect structure for an integrated circuit and corresponding fabrication method
10/19/2004US6806119 Method of balanced coefficient of thermal expansion for flip chip ball grid array
10/19/2004US6806107 Electrical fuse element test structure and method
10/19/2004US6806106 Bond wire tuning of RF power transistors and amplifiers
10/19/2004US6806103 Method for fabricating semiconductor devices that uses efficient plasmas
10/19/2004US6806101 Ferroelectric capacitor plasma charging monitor
10/19/2004US6806033 Photoimaged dielectric, its manufacture and use in electronics
10/19/2004US6806028 Reacting metal hydroxides present on the surface of the powdered base metal with a polyvalent alcohol having at least 4 hydroxyl groups; organic binder having acidic groups to form a microgel; photosensitive organic component
10/19/2004US6805998 Method and apparatus for integrated-battery devices
10/19/2004US6805974 Coupling electroconductive pads
10/19/2004US6805958 Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same
10/19/2004US6805829 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows
10/19/2004US6805595 Contact for PGA and PGA socket
10/19/2004US6805541 Seals body onto semiconductor chip mounted on carrier; mask set with apertures; drive, squeegee causes movement of fluidizing resin to be extruded
10/19/2004US6804966 Thermal dissipation assembly employing thermoelectric module with multiple arrays of thermoelectric elements of different densities
10/14/2004WO2004089048A1 Method for manufacturing an electronic module and an electronic module
10/14/2004WO2004088795A1 Anisotropic electrically conductive film and method of producing the same
10/14/2004WO2004088761A1 Light-emitting panel
10/14/2004WO2004088748A1 Insulated power semiconductor module with reduced partial discharge and manufacturing method
10/14/2004WO2004088747A1 Semiconductor device
10/14/2004WO2004088745A1 Semiconductor device
10/14/2004WO2004088738A1 Laminate
10/14/2004WO2004088736A1 Internally reinforced bond pads
10/14/2004WO2004088727A2 Multi-chip ball grid array package and method of manufacture
10/14/2004WO2004088492A1 A radiation body and a device cooling a heating element using the radiation body
10/14/2004WO2004073013A3 Electronic component comprising a semiconductor chip and method for producing said component
10/14/2004WO2004070837B1 Support system for an organic light-emitting diode
10/14/2004WO2004065042A3 Electrochemical displacement-deposition method for making composite metal powders
10/14/2004WO2004057749A3 Flexible inverter power module for motor drives
10/14/2004WO2004049407A3 Plate through mask for generating alignment marks of mim capacitors
10/14/2004WO2004037712A8 Method for producing a packaged integrated circuit with a microcavity
10/14/2004WO2004032234A3 Semiconductor device power interconnect striping
10/14/2004WO2004012261A3 A power/ground configuration for low impedance integrated circuit
10/14/2004WO2003073500A8 A substrate for a semiconductor device
10/14/2004WO2003073474A8 Modular semiconductor die package and method of manufacturing thereof
10/14/2004US20040204307 Mixing two double oxides each containing tungsten or molyb-denum combined with alkali metal earth for one and zirconium or hafnium for other; precision, performance; high frequency circuits
10/14/2004US20040203262 Helical microelectronic contact and method for fabricating same
10/14/2004US20040203249 Dummy copper deprocessing
10/14/2004US20040203244 Electronic component and fabricating method
10/14/2004US20040203241 Chemical-mechanical planarization slurries and powders and methods for using same
10/14/2004US20040203235 Formation method for metal element, production method for semiconductor device, production method for electronic device, semiconductor device, electronic device, and electronic equipment
10/14/2004US20040203226 Semiconductor device with reduced interconnection capacity
10/14/2004US20040203224 Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby
10/14/2004US20040203221 Electronic device manufacturing method
10/14/2004US20040203206 Flip chip with novel power and ground arrangement
10/14/2004US20040203194 Method of resin-sealing a semiconductor device, resin-sealed semiconductor device, and forming die for resin-sealing the semiconductor device
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