Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2004
10/21/2004US20040207075 Heat radiation structure of semiconductor device, and manufacturing method thereof
10/21/2004US20040207073 Electronic apparatus
10/21/2004US20040207072 Ceramic substrate for a semiconductor producing/examining device
10/21/2004US20040207071 Package for electronic parts, lid thereof, material for the lid and method for producing the lid material
10/21/2004US20040207070 High power semiconductor module
10/21/2004US20040207069 Tape carrier for TAB and method for producing the same
10/21/2004US20040207068 Circuit device with at least partial packaging and method for forming
10/21/2004US20040207067 Package substrate for improving electrical performance
10/21/2004US20040207066 Lead on chip package and leadframe thereof
10/21/2004US20040207064 Cavity ball grid array apparatus having improved inductance characteristics
10/21/2004US20040207061 Multi-chip electronic package and cooling system
10/21/2004US20040207060 Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit
10/21/2004US20040207059 Package structure with a cavity
10/21/2004US20040207058 Side braze packages
10/21/2004US20040207057 Semiconductor device, semiconductor device manufacturing method, and semiconductor device test method
10/21/2004US20040207056 Conductor substrate, semiconductor device and production method thereof
10/21/2004US20040207055 Lead frame, semiconductor chip package, method for manufacturing semiconductor device, and semiconductor device
10/21/2004US20040207054 Semiconductor component for electrical coupling to a substrate, and method of manufacturing same
10/21/2004US20040207053 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module
10/21/2004US20040207052 Substrate based unmolded package
10/21/2004US20040207049 Electronic component and semiconductor wafer, and method for producing the same
10/21/2004US20040207044 Laser trimming with phase shifters
10/21/2004US20040207043 Semiconductor device having capacitor formed in multilayer wiring structure
10/21/2004US20040207042 Structure and method for embedding capacitors in z-connected multi-chip modules
10/21/2004US20040207041 Capacitor arrangement and method for producing such a capacitor arrangement
10/21/2004US20040207020 CMOS silicon-control-rectifier (SCR) structure for electrostatic discharge (ESD) protection
10/21/2004US20040207014 Semiconductor device and fabricating method thereof
10/21/2004US20040206984 Semiconductor device
10/21/2004US20040206983 MOS trasistor having a mesh-type gate electrode
10/21/2004US20040206954 Wafer-level package, a method of manufacturing thereof and a method of manufacturing semiconductor devices from such a wafer-level package
10/21/2004US20040206801 Electronic devices including metallurgy structures for wire and solder bonding
10/21/2004US20040206622 Apparatus for plating treatment
10/21/2004US20040206576 Scaffolding member and production method
10/21/2004US20040206535 Thin metal package and manufacturing method thereof
10/21/2004US20040206534 Power electronics component
10/21/2004US20040206478 Variable-wedge thermal-interface device
10/21/2004US20040206477 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
10/21/2004US20040206476 Vertically mountable heat sink with solderable tab
10/21/2004US20040206475 Heat sink assembly having combined fins
10/21/2004US20040206313 Drive arrangement for a motor vehicle
10/21/2004US20040205961 Electronic component mounting apparatus and electronic component mounting method
10/21/2004DE19801488B4 Verfahren zum Zusammenbau eines Halbleiterbausteins A method of assembling a semiconductor device
10/21/2004DE10316967A1 Main board for a computer has an optimum-fitted processor for cooling the processor with heat-conductor tubes as well as a multilayered cooling system
10/21/2004DE10315225A1 Heat-exchanger e.g. for cooling electronic components, especially microprocessors, has projections extending into cavity for circulating heat-exchanging medium
10/21/2004DE10314221A1 Power semiconductor module, has ridge around side surfaces to allow releasably clamping to carrier, e.g. in form of heat sink
10/21/2004DE10314150A1 Detecting environmental or process parameters in process-wafer manufacturing environment for semiconductor integrated circuit manufacture, by exposing wafer comprising sensors to manufacturing environment
10/21/2004DE102004014917A1 Halbleitervorrichtung und Verfahren eines Drahtkontaktierens für eine Halbleitervorrichtung A semiconductor device and method of a wire for contacting a semiconductor device
10/21/2004DE102004014911A1 Halbleitermodul Semiconductor module
10/21/2004DE102004014709A1 Halbleiteranordnung Semiconductor device
10/21/2004DE102004014444A1 Halbleiteranordnung mit mehreren Substraten A semiconductor device having a plurality of substrates
10/21/2004DE102004013150A1 Hochtemperaturleitfähiges Material mit hoher thermischer Leitfähigkeit und ein Verfahren zur Herstellung desselben High temperature conductive material having high thermal conductivity and a method of manufacturing the same
10/20/2004EP1469707A2 Lighting circuits manufactured from conductive loaded resin-based materials
10/20/2004EP1469514A2 Conductor substrate, semiconductor device and production method thereof
10/20/2004EP1469513A2 Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
10/20/2004EP1469512A1 Module device
10/20/2004EP1469022A1 Solid silane coupling agent composition, process for producing the same, and resin composition containing the same
10/20/2004EP1468776A2 Microelectronics spring contact elements
10/20/2004EP1468594A2 High density 3-d integrated circuit package
10/20/2004EP1468455A1 Cooled photodetector
10/20/2004EP1468449A2 Multi-chip module semiconductor devices
10/20/2004EP1468448A2 Package for a non-volatile memory device including integrated passive devices and method for making the same
10/20/2004EP1468446A1 Method for production of dielectric layers using polyfunctional carbosilanes
10/20/2004EP1468443A1 Apparatus incorporating small-feature-size and large-feature-size components and method for making same
10/20/2004EP1468433A1 Coil on a semiconductor substrate and method for production thereof
10/20/2004EP1467856A1 Improved thermal interface material
10/20/2004EP1374654A4 Heat sink
10/20/2004EP0485627B1 Lead frame and semiconductor package using it
10/20/2004CN2650335Y Water-cooled radiating device
10/20/2004CN2650334Y Radiating device
10/20/2004CN2650333Y Heat tube
10/20/2004CN2650332Y Stacked finned radiator
10/20/2004CN2650331Y Circulating current channel heat-transfer heat exchange device
10/20/2004CN2650330Y Semiconductor device with improved radiating capacity
10/20/2004CN2650329Y Semiconductor packaging
10/20/2004CN2650328Y Semiconductor device with reinforced metal and colloid contact surface
10/20/2004CN2650327Y Semiconductor device with anti-moisture capacity
10/20/2004CN2650210Y Computer radiating device
10/20/2004CN2650209Y Heat-tube radiating device
10/20/2004CN2650208Y Radiating device
10/20/2004CN2650207Y Miniature refrigerating device for computer chip radiation
10/20/2004CN1539256A Welded leadframe
10/20/2004CN1539167A EMI shielding for electronic packages
10/20/2004CN1539166A Electronic assembly inculding die having integrated circuit and layer of diamond and methods for producing the same
10/20/2004CN1539165A Semiconductor device and production method thereof
10/20/2004CN1539164A Boron-doped titanium nitride layer for high aspect artio semiconductor devices
10/20/2004CN1539163A Semiconductor component with at least one semiconductor chip on base chip serving as substrate and method for production thereof
10/20/2004CN1539161A Process and apparatus for treating a workpiece such as a semiconductor wafer
10/20/2004CN1539150A Planar inductive component and planar transformer
10/20/2004CN1538944A Metod of producing metal-containing single-phase composition
10/20/2004CN1538908A High solid HBV slurry, paste, spherical powder, and method of making and using them
10/20/2004CN1538804A Fancircuit board and fan using said fan circuit board
10/20/2004CN1538739A Photoelectric acquisition sensor
10/20/2004CN1538520A Semiconductor packing and manufacturing method
10/20/2004CN1538519A Semiconductor device with circuit protection for protecting circuit
10/20/2004CN1538518A Conductive substrate, semiconductor device and manufacturing method thereof
10/20/2004CN1538514A 半导体装置 Semiconductor device
10/20/2004CN1538506A Multi-lager semiconductor chip structure
10/20/2004CN1538500A Semiconductor device and its manufacturing method and testing method of semiconductor device
10/20/2004CN1537877A Granular epoxy, its producing method and granular epoxy resin package
10/20/2004CN1172438C Electronic component having cirucit arrangement packed and mfg. method thereof
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