| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 10/26/2004 | US6808959 Semiconductor device having reinforced coupling between solder balls and substrate |
| 10/26/2004 | US6808948 Test structures to define COP electrical effects |
| 10/26/2004 | US6808947 Substrate mapping |
| 10/26/2004 | US6808945 Method and system for testing tunnel oxide on a memory-related structure |
| 10/26/2004 | US6808944 Structure and method for monitoring a semiconductor process, and method of making such a structure |
| 10/26/2004 | US6808798 Semiconductor chips are mounted on a heat conductive resin substrate which polybenzazole fibers are oriented in a thick direction and/or in a direction of a surface of a resin substrate. |
| 10/26/2004 | US6808578 Method for producing ceramic substrate |
| 10/26/2004 | US6808321 Optical communication module |
| 10/26/2004 | US6808117 Method and apparatus for calibrating marking position in chip scale marker |
| 10/26/2004 | US6808014 Cooling device of electronic apparatus |
| 10/26/2004 | US6808013 Heat dissipation device with working liquid received in circulatory route |
| 10/26/2004 | US6808012 CPU radiator holding mechanism |
| 10/26/2004 | US6807730 Pad structure of semiconductor package |
| 10/26/2004 | CA2364448C Electronic tag assembly and method therefor |
| 10/21/2004 | WO2004091269A2 Method for production of (opto)electronic housings with a ceramic base for thermal regulation and dissipation by means of a thermoelectric (peltier) effect |
| 10/21/2004 | WO2004091268A1 Multilayer printed wiring board |
| 10/21/2004 | WO2004091266A1 Circuit board and process for producing the same |
| 10/21/2004 | WO2004090982A1 Battery-mounted integrated circuit device |
| 10/21/2004 | WO2004090981A1 Electronic packaging structure with integrated distributed decoupling capacitors |
| 10/21/2004 | WO2004090980A2 Overlay metrology mark |
| 10/21/2004 | WO2004090979A2 Overlay metrology mark |
| 10/21/2004 | WO2004090978A2 Overlay metrology mark |
| 10/21/2004 | WO2004090977A1 Encapsulated power semiconductor assembly |
| 10/21/2004 | WO2004090976A2 Optical communication between face-to-face semiconductor chips |
| 10/21/2004 | WO2004090975A1 Method of manufacturing semiconductor devices |
| 10/21/2004 | WO2004090959A1 Method of heat treatment and heat treatment apparatus |
| 10/21/2004 | WO2004090944A2 Pcm/aligned fiber composite thermal interface |
| 10/21/2004 | WO2004090942A2 Thermally conductive adhesive composition and process for device attachment |
| 10/21/2004 | WO2004090941A2 Integrated circuit die having a copper contact and method therefor |
| 10/21/2004 | WO2004090940A2 Esd protection device and method making the same |
| 10/21/2004 | WO2004090938A2 Thermal interconnect and interface systems, methods of production and uses thereof |
| 10/21/2004 | WO2004090737A2 Sense amplifying latch with low swing feedback |
| 10/21/2004 | WO2004090033A1 Epoxy resin molding material for sealing use and semiconductor device |
| 10/21/2004 | WO2004089996A1 Modified cycloolefin copolymer, process for producing the same, and use of the polymer |
| 10/21/2004 | WO2004079791A3 Interconnect structure having improved stress migration reliability |
| 10/21/2004 | WO2004073062A3 Method of manufacturing a reinforced semiconductor wafer |
| 10/21/2004 | WO2004062094A3 Sealed and pressurized liquid cooling system for microprocessor |
| 10/21/2004 | WO2004057671A3 Method for forming patterns aligned on either side of a thin film |
| 10/21/2004 | WO2004038302A3 Method and apparatus for removeably coupling a heat rejection device with a heat producing device |
| 10/21/2004 | WO2004012107A3 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices |
| 10/21/2004 | US20040210862 Automated wiring pattern layout method |
| 10/21/2004 | US20040210859 Electrical line end shortening quantification |
| 10/21/2004 | US20040210008 Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition |
| 10/21/2004 | US20040209578 EMI shield for reducing clock jitter of a transceiver |
| 10/21/2004 | US20040209518 Low impedance inter-digital capacitor and method of using |
| 10/21/2004 | US20040209512 Indicia-equipped actuator assembly |
| 10/21/2004 | US20040209462 Method of manufacturing semiconductor device |
| 10/21/2004 | US20040209459 Semiconductor device and method of manufacturing the same |
| 10/21/2004 | US20040209456 Surface barriers for copper and silver interconnects produced by a damascene process |
| 10/21/2004 | US20040209454 Method of fabricating local interconnection using selective epitaxial growth |
| 10/21/2004 | US20040209453 Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof |
| 10/21/2004 | US20040209452 Solder terminal and fabricating method thereof |
| 10/21/2004 | US20040209451 Solder deposition method and solder bump forming method |
| 10/21/2004 | US20040209406 Methods of selectively bumping integrated circuit substrates and related structures |
| 10/21/2004 | US20040209404 Semiconductor fuses, methods of using and making the same, and semiconductor devices containing the same |
| 10/21/2004 | US20040209403 One-component hot setting epoxy resin composition and semiconductor mounting underfill material |
| 10/21/2004 | US20040209401 Arrangement structure applying to sawing a package panel |
| 10/21/2004 | US20040209400 Process and apparatus for packaging a tape substrate |
| 10/21/2004 | US20040209399 Electronic parts packaging structure and method of manufacturing the same |
| 10/21/2004 | US20040209398 Semiconductor package, method of manufacturing the same, and semiconductor device |
| 10/21/2004 | US20040209397 Semiconductor package for improved recognition and mounting |
| 10/21/2004 | US20040209396 Electronic unit integrated into a flexible polymer body |
| 10/21/2004 | US20040209387 Method for making a package structure with a cavity |
| 10/21/2004 | US20040209001 spray wheel configured to accommodate device-holding fixtures having a standard geometric shapes such as a rectangular or square shaped fixture; thermal spray process for tamper resistant layers on electronics |
| 10/21/2004 | US20040208032 Microminiature power converter |
| 10/21/2004 | US20040207987 Heat spreader module |
| 10/21/2004 | US20040207986 Heat sink hold-down with fan-module attach location |
| 10/21/2004 | US20040207985 Variable-gap thermal-interface device |
| 10/21/2004 | US20040207984 Heat sink assembly with combined parallel fins |
| 10/21/2004 | US20040207982 Air-directing unit |
| 10/21/2004 | US20040207968 Power switching module and inverter equipped therewith |
| 10/21/2004 | US20040207965 Semiconductor circuit with protective circuit |
| 10/21/2004 | US20040207502 Inductor device and electronic circuit device that can achieve further integration while maintaining a high inductance |
| 10/21/2004 | US20040207467 Power amplifier module for wireless communication devices |
| 10/21/2004 | US20040207455 Semiconductor integrated circuit |
| 10/21/2004 | US20040207432 Electronic circuit device |
| 10/21/2004 | US20040207414 Methodologies for efficient inspection of test structures using electron beam scanning and step and repeat systems |
| 10/21/2004 | US20040207406 Self-timed reliability and yield vehicle array |
| 10/21/2004 | US20040207383 Test structure and related methods for evaluating stress-induced voiding |
| 10/21/2004 | US20040207097 Alignment or overlay marks for semiconductor processing |
| 10/21/2004 | US20040207096 having reduced self and mutual capacitance of bonded wires, made by coating the wires with a foamed polymer effectively having a very low dielectric constant |
| 10/21/2004 | US20040207095 Semiconductor integrated circuit device with a metallization structure |
| 10/21/2004 | US20040207094 Package substrate and a flip chip mounted semiconductor device |
| 10/21/2004 | US20040207093 Method of fabricating an alloy cap layer over CU wires to improve electromigration performance of CU interconnects |
| 10/21/2004 | US20040207092 Copper to aluminum interlayer interconnect using stud and via liner |
| 10/21/2004 | US20040207091 Integrated circuits with multiple low dielectric-constant inter-metal dielectrics |
| 10/21/2004 | US20040207090 Low capacitance wiring layout and method for making same |
| 10/21/2004 | US20040207089 Semiconductor device, method of manufacturing three-dimensional stacking type semiconductor device, circuit board, and electronic instrument |
| 10/21/2004 | US20040207088 Semiconductor device and method for manufacturing the same |
| 10/21/2004 | US20040207087 Substrate having a planarization layer and method of manufacture therefor, substrate for electro-optical device, electro-optical device, and electronic apparatus |
| 10/21/2004 | US20040207085 Semiconductor device and method of manufacturing the same |
| 10/21/2004 | US20040207084 Multilayered cap barrier in microelectronic interconnect structures |
| 10/21/2004 | US20040207083 Low dielectric constant layers |
| 10/21/2004 | US20040207082 Semiconductor package and production method |
| 10/21/2004 | US20040207081 Semiconductor component having thinned substrate, backside pin contacts and circuit side contacts |
| 10/21/2004 | US20040207080 Circuit board for mounting a semiconductor chip and manufacturing method thereof |
| 10/21/2004 | US20040207079 Input protection circuit preventing electrostatic discharge damage of semiconductor integrated circuit |
| 10/21/2004 | US20040207078 Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling |
| 10/21/2004 | US20040207077 Circuit device with at least partial packaging and method for forming |
| 10/21/2004 | US20040207076 Soldered heat sink anchor and method of use |