| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 10/27/2004 | CN2651940Y Radiating structure |
| 10/27/2004 | CN2651939Y Radiator of superconductive electronic element |
| 10/27/2004 | CN2651938Y Composite zone structure improvement of semiconductor memory placode |
| 10/27/2004 | CN2651818Y Radiator |
| 10/27/2004 | CN1541444A Electronic device and method of testing and of mfg. |
| 10/27/2004 | CN1541415A Design of lithography alignment and overlay measurement marks on CMP finished damascene surface |
| 10/27/2004 | CN1541414A Electronic assembly with llaterally connected capacitors and mfg. method |
| 10/27/2004 | CN1541413A Integrated circuit arrangement consisting of flat substrate |
| 10/27/2004 | CN1541412A Method for producing semiconductor modules and module produced according to said method |
| 10/27/2004 | CN1541410A Bump formation method and bump forming appts appts. to semiconductor wafer |
| 10/27/2004 | CN1541403A Low-K metal proelectrolyte semiconductor structure |
| 10/27/2004 | CN1541396A Integrated transformer |
| 10/27/2004 | CN1541231A Solid silane coupling agent compsn., method for mfg. the same, and resin compsn. contg the same |
| 10/27/2004 | CN1541056A Switching power source for high frequency heater |
| 10/27/2004 | CN1541055A Rectifier module of using heat pipe for heat dispersion |
| 10/27/2004 | CN1541054A Electronic assembly and its mfg. method |
| 10/27/2004 | CN1541053A Encapsulation structure of distribution substrate and electronic element |
| 10/27/2004 | CN1541052A Method of assembling electronic parts |
| 10/27/2004 | CN1540763A System of integrating circuit on insulation layer and method for integrating system on insulation layer |
| 10/27/2004 | CN1540761A 半导体存储器件 The semiconductor memory device |
| 10/27/2004 | CN1540755A Semiconductor integrated circuit device and electronic card using smae |
| 10/27/2004 | CN1540754A 半导体器件 Semiconductor devices |
| 10/27/2004 | CN1540753A Core of heat exchanger in shaped plate pterate type |
| 10/27/2004 | CN1540752A Phase change converting heat-conducting glue material |
| 10/27/2004 | CN1540751A Method for combining heat-conducting tube with heat-conducting base |
| 10/27/2004 | CN1540750A Surface-mounting high frequency modular |
| 10/27/2004 | CN1540749A Thin flm bearing belt of mounting electronic parts, its prodn. method and printing screen for coating welding resistance agent |
| 10/27/2004 | CN1540744A Technqiue and structure for improveing adhesive capacity between layer of stopping etch and metl layer |
| 10/27/2004 | CN1540732A Semiconductor module and its mfg. method |
| 10/27/2004 | CN1540692A 镀覆接线端 Plated terminals |
| 10/27/2004 | CN1540477A Heat sink and structure of fan frame |
| 10/27/2004 | CN1540421A Semiconductor device its mfg. method, electronic device and its mfg. method |
| 10/27/2004 | CN1540420A Electronic device and its mfg. method |
| 10/27/2004 | CN1540396A Method and devoce for arranging conductive metal wire on display faceplate possessing point discharge |
| 10/27/2004 | CN1173613C Process for preparing contact electrode of high-temp superconductor filter |
| 10/27/2004 | CN1173594C Electronic circuit unit |
| 10/27/2004 | CN1173415C Semiconductor device and substrate for semiconductor device |
| 10/27/2004 | CN1173401C Method for preparing non-electroplating more than two layers of metal convex blocks |
| 10/27/2004 | CN1173400C Mfg. of producing plate-shape body and semiconductor device |
| 10/27/2004 | CN1173399C Semiconductor packaging part with glue overflow preventer |
| 10/27/2004 | CN1173396C Method for forming integrated circuit device and integrated circuit device by formed said method |
| 10/27/2004 | CN1173279C Design and methodology for manufacturing data processing systems having multiple processors |
| 10/27/2004 | CN1172872C Glass ceramics composition and electronic parts and multilayered LC multiple component using same |
| 10/27/2004 | CN1172871C Glass-ceramic composition for ceramic-type electromic element, ceramic-type electronic element and process for preparing malti-layer ceramic-type electronic element |
| 10/26/2004 | US6810512 Integrated circuit with layout matched high speed lines |
| 10/26/2004 | US6810511 Method of designing active region pattern with shift dummy pattern |
| 10/26/2004 | US6809982 Defective cell remedy method capable of automatically cutting capacitor fuses within the fabrication process |
| 10/26/2004 | US6809935 Thermally compliant PCB substrate for the application of chip scale packages |
| 10/26/2004 | US6809931 Heat sink apparatus that provides electrical isolation for integrally shielded circuit |
| 10/26/2004 | US6809930 Cooling a microchip on a circuit board |
| 10/26/2004 | US6809929 Heat sink assembly with retaining device |
| 10/26/2004 | US6809928 Sealed and pressurized liquid cooling system for microprocessor |
| 10/26/2004 | US6809927 Liquid circulation cooling system for electronic apparatus |
| 10/26/2004 | US6809926 Heat sink assembly with embedded fan |
| 10/26/2004 | US6809824 Alignment process for integrated circuit structures on semiconductor substrate using scatterometry measurements of latent images in spaced apart test fields on substrate |
| 10/26/2004 | US6809540 Integrated circuit test structure |
| 10/26/2004 | US6809538 Active cooling to reduce leakage power |
| 10/26/2004 | US6809524 Testing of conducting paths using a high speed I/O test package |
| 10/26/2004 | US6809424 Method for making electronic devices including silicon and LTCC and devices produced thereby |
| 10/26/2004 | US6809423 Electronic module |
| 10/26/2004 | US6809421 Multichip semiconductor device, chip therefor and method of formation thereof |
| 10/26/2004 | US6809420 Characterization of induced shift on an overlay target using post-etch artifact wafers |
| 10/26/2004 | US6809419 Semiconductor device |
| 10/26/2004 | US6809418 Integrated circuit package structure |
| 10/26/2004 | US6809417 Power circuitry with a thermionic cooling system |
| 10/26/2004 | US6809413 Microelectronic device package with an integral window mounted in a recessed lip |
| 10/26/2004 | US6809411 Low-inductance semiconductor components |
| 10/26/2004 | US6809410 Power semiconductor module |
| 10/26/2004 | US6809409 Lead frame and semiconductor device made using the lead frame |
| 10/26/2004 | US6809408 Semiconductor package with die pad having recessed portion |
| 10/26/2004 | US6809407 Through-hole passing through the board to ventilate at least a part of the region between the board and the semiconductor chip when moisture is released from voids during heat of operation |
| 10/26/2004 | US6809406 COF tape carrier, semiconductor element, COF semiconductor device, and method for manufacturing of COF semiconductor device |
| 10/26/2004 | US6809405 Increase of the number of pins used in a resin- encapsulated semiconductor device |
| 10/26/2004 | US6809403 Fault tolerant electrical circuit and method |
| 10/26/2004 | US6809398 Metal-to-metal antifuse structure and fabrication method |
| 10/26/2004 | US6809397 Fuse boxes with guard rings for integrated circuits and integrated circuits including the same |
| 10/26/2004 | US6809390 Semiconductor chip mounting substrate, electrooptical device, liquid-crystal device, electroluminescent device, and electronic equipment |
| 10/26/2004 | US6809389 Fill pattern generation for spin-on glass and related self-planarization deposition |
| 10/26/2004 | US6809384 Method and apparatus for protecting wiring and integrated circuit device |
| 10/26/2004 | US6809378 Structure for temporarily isolating a die from a common conductor to facilitate wafer level testing |
| 10/26/2004 | US6809367 Device for interconnecting, in three dimensions, electronic components |
| 10/26/2004 | US6809352 Palladium silicide (PdSi) schottky electrode for gallium nitride semiconductor devices |
| 10/26/2004 | US6809348 Semiconductor device and method for manufacturing the same |
| 10/26/2004 | US6809334 Semiconductor integrated circuit device, and method of manufacturing the same |
| 10/26/2004 | US6809332 Electronic device and defect repair method thereof |
| 10/26/2004 | US6809268 Printed wiring substrate and method for fabricating the same |
| 10/26/2004 | US6809262 Flip chip package carrier |
| 10/26/2004 | US6809261 Physically compact device package |
| 10/26/2004 | US6809162 A curable blends comprising a cyclic polymer of epoxy resin, curing agent hexahydro-4-methylphthalic anhydride, boron compound halogen-free catalyst; use for packaging a chip, light emitting diode; resist to heat, oxidation, radiation |
| 10/26/2004 | US6809155 Unsaturated compounds containing silane, electron donor and electron acceptor functionality |
| 10/26/2004 | US6809039 Method for forming a silicide layer |
| 10/26/2004 | US6809031 Method for manufacturing a reclaimable test pattern wafer for CMP applications |
| 10/26/2004 | US6809030 Method and structure for controlling the interface roughness of cobalt disilicide |
| 10/26/2004 | US6809029 Semiconductor production device and production method for semiconductor device |
| 10/26/2004 | US6809025 Method of making a void-free aluminum film |
| 10/26/2004 | US6809021 Wiring line and manufacture process thereof and semiconductor device and manufacturing process thereof |
| 10/26/2004 | US6809020 Method for forming bump, semiconductor device and method for making the same, circuit board, and electronic device |
| 10/26/2004 | US6809002 Method of manufacturing an alignment mark |
| 10/26/2004 | US6808962 Semiconductor device and method for fabricating the semiconductor device |
| 10/26/2004 | US6808961 Locking of mold compound to conductive substrate panels |