H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2004
10/28/2004	US20040212081 Process for fabricating a power hybrid module
10/28/2004	US20040212080 [chip package structure and process for fabricating the same]
10/28/2004	US20040212079 Heat dissipation device having a load centering mechanism
10/28/2004	US20040212078 Package structure and sensor module using the same
10/28/2004	US20040212077 High-frequency module, method of manufacturing thereof and method of molding resin
10/28/2004	US20040212075 Semiconductor device including a wiring board with a three-dimensional wiring pattern
10/28/2004	US20040212074 DC-DC converter implemented in a land grid array package
10/28/2004	US20040212073 DC-DC converter implemented in a land grid array package
10/28/2004	US20040212072 Semiconductor package
10/28/2004	US20040212066 Multi-chips stacked package
10/28/2004	US20040212064 Multi-chips stacked package
10/28/2004	US20040212063 Electronic package having a flexible substrate with ends connected to one another
10/28/2004	US20040212062 Tape stiffener and semiconductor device component assemblies including same
10/28/2004	US20040212061 Electronic circuit device
10/28/2004	US20040212059 Circuit device and method for manufacturing the same
10/28/2004	US20040212057 Semiconductor component having at least two chips which are integrated in a housing and with which contact is made by a common contact chip
10/28/2004	US20040212056 [chip package structure]
10/28/2004	US20040212054 System and method of reducing die attach stress and strain
10/28/2004	US20040212053 Semiconductor package for random access memory integrated circuits
10/28/2004	US20040212052 Coupling spaced bond pads to a contact
10/28/2004	US20040212051 Ball grid array package with patterned stiffener layer
10/28/2004	US20040212050 Film carrier tape for mounting an electronic part, process for producing the same, and screen for solder resist coating
10/28/2004	US20040212049 Semiconductor device and manufacturing method thereof
10/28/2004	US20040212048 Semiconductor structures, and methods of forming rugged semiconductor-containing surfaces
10/28/2004	US20040212047 Edge arrangements for integrated circuit chips
10/28/2004	US20040212040 Semiconductor integrated circuit device and method of manufacturing the same
10/28/2004	US20040212039 Semiconductor device
10/28/2004	US20040212038 Integrated inductor in semiconductor manufacturing
10/28/2004	US20040212034 Semiconductor device, manufacturing method of the same and semiconductor module
10/28/2004	US20040212017 Semiconductor device and ic card
10/28/2004	US20040212016 Semiconductor device and method for evaluating characteristics of the same
10/28/2004	US20040212015 Circuit structure for connecting bonding pad and ESD protection circuit
10/28/2004	US20040212001 Multilayer analog interconnecting line layout for a mixed-signal integrated circuit
10/28/2004	US20040211986 Solid-state imaging device and method for producing the same
10/28/2004	US20040211982 External power ring with multiple tapings to reduce IR drop in integrated circuit
10/28/2004	US20040211963 Integrated circuit with a transitor over an interconnect layer
10/28/2004	US20040211958 Semiconductor device having a conductive layer and a manufacturing method thereof
10/28/2004	US20040211954 Compositive laminate substrate with inorganic substrate and organic substrate
10/28/2004	US20040211673 Electroplating a copper thin film on the copper seed layer by using an aqueous solution of 10 to 40 wt % of copper hexafluorosilicate as an electrolyte for forming a semiconductor integrated circuit having a copper seed layer
10/28/2004	US20040211594 Vertical routing structure
10/28/2004	US20040211592 Wiring board and electro-optical device, method of manufacture thereof, and electronic instrument
10/28/2004	US20040211591 Wiring board, semiconductor device, electronic device, and circuit board for electronic parts
10/28/2004	US20040211583 Surface-mount-type high-frequency module
10/28/2004	US20040211506 shrinkage inhibition of multilayer glass laminates, using films comprising glass, ceramic fillers, binders and solvents; dielectrics
10/28/2004	US20040211189 Personal heat control device and method
10/28/2004	US20040211060 Method of mounting an electronic part
10/28/2004	DE20309856U1 Heat sink for semiconductor components has holders with divergent inner walls and mounting sections with corresponding convergent outer walls
10/28/2004	DE202004009485U1 Casing or encapsulation for electrical or electronic components, especially a light-emitting diode or laser diode comprises a plastic housing made from a polysulfone, polyethersulfone or polyphenylsulfone
10/28/2004	DE202004009484U1 Protective cap for light-emitting diodes and laser diodes is made from a polysulfone, polyethersulfone or polyphenylsulfone
10/28/2004	DE202004009483U1 Protective casing for electrical or electronic components, especially light-emitting diodes, comprises a pressure-stable, translucent, sterilizable plastic
10/28/2004	DE19983428B4 Conductive plug for semiconductor device used in SRAM
10/28/2004	DE10345966A1 Halbleitervorrichtung Semiconductor device
10/28/2004	DE10339216A1 Three-point power converter, has heat sink and multiple different semiconductor devices, arranged so that dissipated energy decreases in propagation direction of cooling medium
10/28/2004	DE10334388B3 Coating method for application of solder material to contact bumps of microchip using magnetization of contact bumps so that magnetic or magnetizable solder material is magnetically adhered
10/28/2004	DE10333800B3 Semiconductor component e.g. bridge circuit, using chip-on-chip technology with end sections of electrical terminal bonding wires as contact region between lower and upper semiconductor elements
10/28/2004	DE10308924B3 Integrierte Halbleiterschaltung mit einer Vielzahl von Speicherzellen A semiconductor integrated circuit having a plurality of memory cells
10/28/2004	DE102004017197A1 Verfahren um eine Halbleitervorrichtung mit Harz einzugiessen, mit Harz eingegossene Halbleitervorrichtung und Druckgießform zum Eingiessen der Halbleitervorrichtung mit Harz Method for a semiconductor device with resin pour, infused with resin semiconductor device and die for pouring the semiconductor device with resin
10/28/2004	DE102004014744A1 Halbleiterbaugruppe, die einen Latch-up-Durchbruch infolge einer negativen Änderung einer Floating-Offsetspannung verhindern kann Semiconductor device that can prevent a latch-up due to breakthrough a negative change in a floating offset voltage
10/28/2004	DE102004012595A1 Interposer, Interposer-Package und diese verwendende Vorrichtung Interposer, interposer package and use this device
10/28/2004	DE102004010905A1 Kapazitiver Halbleitersensor Capacitive semiconductor sensor
10/28/2004	DE10022267B4 Halbleiterbauelement mit räumlich getrennten Halbleiterkörpern A semiconductor device comprising spatially separated semiconductor bodies
10/28/2004	CA2773112A1 Metal base circuit board and its production process
10/28/2004	CA2773085A1 Metal base circuit board and its production process
10/28/2004	CA2773076A1 Metal base circuit board and its production process
10/28/2004	CA2523008A1 Article with layers of composite material of a first non-metallic layer and a second metallic layer applied to the first layer
10/28/2004	CA2458438A1 Electronic package with strengthened conductive pad
10/28/2004	CA2455524A1 Low thermal expansion adhesives and encapsulants for cryogenic and high power density electronic and photonic device assembly and packaging
10/27/2004	EP1471780A2 Socket for connecting an integrated circuit to a printed wiring board
10/27/2004	EP1471604A1 Electronic component module
10/27/2004	EP1471588A1 Semiconductor device having fuel cell and its manufacturing method
10/27/2004	EP1471576A2 Semiconductor device and method for evaluating characteristics of the same
10/27/2004	EP1471575A1 Rf chip carrier having inductors provided therein and method of manufacturing the same
10/27/2004	EP1471574A2 Wiring substrate and electronic parts packaging structure
10/27/2004	EP1471573A1 Multi-layer ceramic substrate, and method and device for producing the same
10/27/2004	EP1471572A1 Embedded copper interconnection structure
10/27/2004	EP1471571A1 Semiconductor device and manufacturing method thereof
10/27/2004	EP1471570A1 Method of mounting an electronic part on a mounting board
10/27/2004	EP1471569A1 Process for cutting electrical connection nodes in IC-frames and fabrication process of an electronic component and of frames therefor
10/27/2004	EP1471566A2 Semiconductor device and method for fabricating the same
10/27/2004	EP1471409A1 Water cooled heat dissipation device
10/27/2004	EP1470743A2 Power module
10/27/2004	EP1470661A2 Encryption, authentication, and key management for multimedia content pre-encryption
10/27/2004	EP1470599A1 Electronic devices containing organic semiconductor materials
10/27/2004	EP1470588A2 Split-gate power module and method for suppressing oscillation therein
10/27/2004	EP1470587A1 A lead frame
10/27/2004	EP1470586A2 Power semiconductor, and method for producing the same
10/27/2004	EP1470585A1 Chip-size package with an integrated passive component
10/27/2004	EP1470584A2 No-flow underfill encapsulant
10/27/2004	EP1470583A1 Chip and wafer integration process using vertical connections
10/27/2004	EP1470581A2 High density area array solder microjoining interconnect structure and fabrication method
10/27/2004	EP1470580A1 Bilayer hdp cvd / pe cvd cap in advanced beol interconnect structures and method thereof
10/27/2004	EP1470181A1 Improved interface adhesive
10/27/2004	EP1470176A1 No flow underfill composition
10/27/2004	EP1404888B1 Metal-ceramic composite material
10/27/2004	EP1153984B1 Resin composition, molded article therefrom, and utilization thereof
10/27/2004	EP0870627B1 Semiconductor device
10/27/2004	EP0845445B1 Photosensitive ceramic green sheet, ceramic package,process for producing the same and its use in preparing a ceramic package with a fired board
10/27/2004	CN2652088Y Circuit board with pin with resin production
10/27/2004	CN2651942Y Liquid circulating heat conductive radiator
10/27/2004	CN2651941Y Heat-conductive board structure

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