H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2004
11/02/2004	US6812069 Method for improving semiconductor process wafer CMP uniformity while avoiding fracture
11/02/2004	US6812068 Semiconductor device encapsulators, methods of encapsulating semiconductor devices and methods of forming electronic packages
11/02/2004	US6812066 Semiconductor device having an interconnecting post formed on an interposer within a sealing resin
11/02/2004	US6812063 Semiconductor package and fabricating method thereof
11/02/2004	US6812062 Molded wafer scale cap
11/02/2004	US6812048 Method for manufacturing a wafer-interposer assembly
11/02/2004	US6812046 Method and apparatus for electronically aligning capacitively coupled chip pads
11/02/2004	US6811738 Manufacturing method of an electronic device package
11/02/2004	US6811725 Mixture of silicone anf head conductive fillers; electronic interface
11/02/2004	US6811674 Palladium plating solution
11/02/2004	US6811672 Method for forming plating film and electronic component having plating film formed theron by same method
11/02/2004	US6811635 Multilayer ceramic substrate, method for manufacturing the same, and electronic device
11/02/2004	US6811634 Shrinkage inhibition, dimemsional accuracy
11/02/2004	US6811406 Microelectronic spring with additional protruding member
11/02/2004	US6810679 Cooling apparatus and squid microscope using same
11/02/2004	US6810580 System for forming conductor wire on a substrate board
11/02/2004	CA2170133C Heat radiating board and method for cooling by using the same
11/01/2004	CA2463645A1 Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction
10/2004
10/28/2004	WO2004093506A2 Electomagnetic interference shielding for a printed circuit board
10/28/2004	WO2004093505A2 Emi shielding for electronic component packaging
10/28/2004	WO2004093254A1 Anisotropic conductive connector and circuit-device electrical-inspection device
10/28/2004	WO2004093252A2 Electrical connector and method for making
10/28/2004	WO2004093195A1 Method for manufacturing backside-illuminated optical sensor
10/28/2004	WO2004093191A1 Semiconductor device
10/28/2004	WO2004093190A2 Multichip module comprising a plurality of semiconductor chips and printed circuit board comprising a plurality of components
10/28/2004	WO2004093189A1 Helical microelectronic contact and method for fabricating same
10/28/2004	WO2004093188A1 Integrated circuit die i/o cells
10/28/2004	WO2004093187A1 Electronic component package, electronic component package assembly and printed board unit
10/28/2004	WO2004093186A1 Metal-base circuit board and its manufacturing method
10/28/2004	WO2004093185A2 Electrical interconnect structures for integrated circuits and methods of manufacturing the same
10/28/2004	WO2004093184A1 Semiconductor device and method of manufacturing the device
10/28/2004	WO2004093183A1 Film carrier and semiconductor device using the same
10/28/2004	WO2004093164A2 Layered microelectronic contact and method for fabricating same
10/28/2004	WO2004093140A2 Electronic component and method of manufacturing same
10/28/2004	WO2004093135A2 Low profile small outline leadless semiconductor device package
10/28/2004	WO2004093128A2 Lead frame structure with aperture or groove for flip chip in a leaded molded package
10/28/2004	WO2004093100A2 Method for producing soldering globules on an electrical component
10/28/2004	WO2004092829A2 Masking arrangement and method for producing integrated circuit arrangements
10/28/2004	WO2004092256A1 Object with a stratified composite material
10/28/2004	WO2004092093A1 Low temperature sintering ceramic composition for high frequency, method of fabricating the same and electronic component
10/28/2004	WO2004091948A2 Power circuitry with a thermionic cooling system
10/28/2004	WO2004032236A3 Method and apparatus to fabricate an on-chip decoupling capacitor
10/28/2004	WO2004032186A3 Thermal enhanced package for block mold assembly
10/28/2004	WO2004001846A3 Method and structures for reduced parasitic capacitance in integrated circuit metallizations
10/28/2004	US20040216071 Routing structure for transceiver core
10/28/2004	US20040214440 Methods of forming patterns for semiconductor constructions; and molds configured to pattern masses associated with semiconductor constructions
10/28/2004	US20040214425 Atomic layer deposited tantalum nitride layer to improve adhesion between a copper structure and overlying materials
10/28/2004	US20040214424 Localized slots for stress relieve in copper
10/28/2004	US20040214422 Semiconductor devices, and manufacturing methods, circuit substrates and electronic equipments for the same
10/28/2004	US20040214419 Semiconductor device and method for manufacturing same
10/28/2004	US20040214410 Vertical interconnection structure and methods
10/28/2004	US20040214409 Method and apparatus for manufacturing known good semiconductor die
10/28/2004	US20040214401 Passivation layer for group III-V semiconductor devices
10/28/2004	US20040214377 Low thermal expansion adhesives and encapsulants for cryogenic and high power density electronic and photonic device assembly and packaging
10/28/2004	US20040214376 Leadframe inductors
10/28/2004	US20040214375 Method of manufacturing semiconductor device, flexible substrate, and semiconductor device
10/28/2004	US20040214374 Board for manufacturing a BGA and method of manufacturing semiconductor device using thereof
10/28/2004	US20040214373 Packaged microelectronic devices and methods for packaging microelectronic devices
10/28/2004	US20040214372 Method for fabricating image sensor semiconductor package
10/28/2004	US20040214370 Method for efficient capillary underfill
10/28/2004	US20040214369 Method for producing solid-state imaging device
10/28/2004	US20040214363 ZnSe based light emitting device with In layer
10/28/2004	US20040214357 Method and apparatus for optically aligning integrated circuit devices
10/28/2004	US20040214356 Method of measuring a gate channel length of a metal-oxide semiconductor transistor
10/28/2004	US20040214003 Curable epoxidized phenolic resins containing biphenylene groups, an inorganic filler, a curing accelerator, a silane coupler, and and a dihydroxyaromatic compound; low viscosity for improved flowability without deterioration of curing; fireproofing; heat resistance (soldering); anticracking agents
10/28/2004	US20040213975 Discontinuous high-modulus fiber metal matrix composite for thermal management applications
10/28/2004	US20040213973 Film adhesive for sealing, film laminate for sealing and sealing method
10/28/2004	US20040213692 Adding iron-based alloy power having a certain value in thermal expansion coefficient into a matrix powder of pure copper phase powder and/or a precipitation hardening copper alloy powder; mixing the powders together; compacting the obtained powder mixture into a green compact and sintering
10/28/2004	US20040213525 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology
10/28/2004	US20040212971 Printed circuit board
10/28/2004	US20040212970 [chip package structure]
10/28/2004	US20040212969 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
10/28/2004	US20040212965 Electronic circuit apparatus and method of manufacturing the same
10/28/2004	US20040212964 Stack up assembly
10/28/2004	US20040212963 Heatsink assembly
10/28/2004	US20040212962 Lateral airflow fan-sink for electronic devices
10/28/2004	US20040212961 Stack up assembly
10/28/2004	US20040212717 Solid-state imaging device and method for producing the same
10/28/2004	US20040212544 Circuit chip connector and method of connecting a circuit chip
10/28/2004	US20040212417 Large gain range, high linearity, low noise MOS VGA
10/28/2004	US20040212415 Sense amplifying latch with low swing feedback
10/28/2004	US20040212402 Semiconductor integrated circuit having a function determination circuit
10/28/2004	US20040212391 Method for universal wafer carrier for wafer level die burn-in
10/28/2004	US20040212103 Techniques for pin arrangements in circuit chips
10/28/2004	US20040212102 Apparatus for conducting heat in a flip-chip assembly
10/28/2004	US20040212100 Semiconductor device and manufacturing method, circuit board and electronic device thereof
10/28/2004	US20040212099 Semiconductor components having stacked dice and methods of fabrication
10/28/2004	US20040212097 Flip chip package
10/28/2004	US20040212096 Multi-chips stacked package
10/28/2004	US20040212094 Useful for the assembly of passive components and organic substrates with conventional ceramic packages
10/28/2004	US20040212093 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby
10/28/2004	US20040212091 Semiconductor device substrate
10/28/2004	US20040212089 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped
10/28/2004	US20040212088 Multi-chip package substrate for flip-chip and wire bonding
10/28/2004	US20040212087 Wiring substrate and electronic parts packaging structure
10/28/2004	US20040212086 Semiconductor apparatus and production method thereof
10/28/2004	US20040212085 Thick film circuit board, method of producing the same and integrated circuit device
10/28/2004	US20040212084 Thick film millimeter wave transceiver module
10/28/2004	US20040212083 Method to prevent die attach adhesive contamination in stacked chips
10/28/2004	US20040212082 Method to prevent die attach adhesive contamination in stacked chips

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