H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2004
11/03/2004	CN1542949A Package substrate
11/03/2004	CN1542935A Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
11/03/2004	CN1542934A Method of manufacturing semiconductor device, flexible substrate, and semiconductor device
11/03/2004	CN1542932A Method of manufacturing semiconductor device and electronic device
11/03/2004	CN1542920A Method of forming a conductive line for a semiconductor device using a carbon nanotube and semiconductor device manufactured using the method
11/03/2004	CN1542911A Semiconductor device with guard ring for preventing water from entering circuit region from outside
11/03/2004	CN1542908A Crystal circular/ chip distribution layer protecting method
11/03/2004	CN1542467A Discrete light filter structure of ultralong lines range infrared focal plane detector
11/03/2004	CN1542080A Low thermal expansion adhesives and encapsulants for cryogenic and high power density electronic and photonic device assembly and packaging
11/03/2004	CN1541804A Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction
11/03/2004	CN1174548C Piezoelectric device and its mfg. method
11/03/2004	CN1174488C 显示装置 The display device
11/03/2004	CN1174487C Electronic part
11/03/2004	CN1174486C Semiconductor device and manufacture thereof
11/03/2004	CN1174485C Double-field effect transistor chip and method for fixing the same chip
11/03/2004	CN1174484C Semiconductor package with radiating structure
11/03/2004	CN1174483C Flip-chip semiconductor device and mfg. method thereof
11/03/2004	CN1174481C Method for making burrless castellation via hole for plastic chip carrier and product
11/03/2004	CN1174475C Method for making RF module element with sound wave surface wave unit
11/03/2004	CN1174474C Method for depositing copper on barrier layer
11/03/2004	CN1174279C Wiring base plate, display device, semiconductor chip and electronic machine
11/03/2004	CN1174055C Sealing material composition for cards and process for producing cards therewith
11/03/2004	CN1174045C Method for production of epoxy resin composite used for optical semiconductor sealing
11/02/2004	US6813756 Method of automatic layout design for LSI, mask set and semiconductor integrated circuit manufactured by automatic layout design method, and recording medium storing automatic layout design program
11/02/2004	US6813574 Determines location of metrology mark and compensates for any horizontal shift
11/02/2004	US6813155 Heat sink clip with interchangeable operating body
11/02/2004	US6813154 Reversible heat sink packaging assembly for an integrated circuit
11/02/2004	US6813153 Polymer solder hybrid
11/02/2004	US6813137 Chip shaped electronic device and a method of producing the same
11/02/2004	US6813130 Semiconductor integrated circuit device including protection circuit for preventing circuit breakdown by static electricity
11/02/2004	US6813058 Method and apparatus for personalization of semiconductor
11/02/2004	US6812810 Bridges for microelectromechanical structures
11/02/2004	US6812742 Electronic device
11/02/2004	US6812723 Probe pin for a probe card
11/02/2004	US6812581 Resists wire breakage; protects against temperature related volume changes of epoxy resin
11/02/2004	US6812580 Semiconductor package having optimized wire bond positioning
11/02/2004	US6812579 Semiconductor device
11/02/2004	US6812578 Semiconductor device bonding pad resistant to stress and method of fabricating the same
11/02/2004	US6812577 Semiconductor contact structure having wide lower portion embedded in conductive material
11/02/2004	US6812576 Fanned out interconnect via structure for electronic package substrates
11/02/2004	US6812575 Semiconductor device
11/02/2004	US6812573 Reliability; high packaging density; low cost; miniaturi-zation; thermal stress absorbing low elasticity layer
11/02/2004	US6812572 Bit line landing pad and borderless contact on bit line stud with localized etch stop layer formed in void region, and manufacturing method thereof
11/02/2004	US6812571 Low capacitance wiring layout and method for making same
11/02/2004	US6812570 Organic packages having low tin solder connections
11/02/2004	US6812569 Semiconductor device using bumps, method for fabricating same, and method for forming bumps
11/02/2004	US6812567 Semiconductor package and package stack made thereof
11/02/2004	US6812565 Semiconductor device and a method of manufacturing the same
11/02/2004	US6812563 Microcooling device
11/02/2004	US6812562 Method and apparatus for surface mounted power transistor with heat sink
11/02/2004	US6812561 Thin high-frequency module having integrated circuit chip with little breakage
11/02/2004	US6812559 Power module with improved transient thermal impedance
11/02/2004	US6812558 Wafer scale package and method of assembly
11/02/2004	US6812557 Stacked type semiconductor device
11/02/2004	US6812556 Noncracking; no die pad; centering location; thinner; avoids electrical connection between bonding wires and prevents cut off during resin molding
11/02/2004	US6812555 Memory card substrate with alternating contacts
11/02/2004	US6812554 Semiconductor device and a method of manufacturing the same
11/02/2004	US6812553 Electrically isolated and thermally conductive double-sided pre-packaged component
11/02/2004	US6812552 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
11/02/2004	US6812551 Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens
11/02/2004	US6812550 Wafer pattern variation of integrated circuit fabrication
11/02/2004	US6812549 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
11/02/2004	US6812548 Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
11/02/2004	US6812547 Transposed split of ion cut materials
11/02/2004	US6812544 Integrated circuit having oversized components
11/02/2004	US6812543 Micro device that generates a magnetomotive force in a long direction
11/02/2004	US6812542 Electric fuse whose dielectric breakdown resistance is controlled by injecting impurities into an insulating film of a capacitor structure, and a method for manufacturing the same
11/02/2004	US6812532 Semiconductor device with address programming circuit
11/02/2004	US6812506 Polysilicon linewidth measurement structure with embedded transistor
11/02/2004	US6812494 Semiconductor device
11/02/2004	US6812487 Test key and method for validating the doping concentration of buried layers within a deep trench capacitors
11/02/2004	US6812486 Conductive structure and method of forming the structure
11/02/2004	US6812477 Integrated circuit identification
11/02/2004	US6812412 Multi-layer wiring board and method of producing same
11/02/2004	US6812410 Semiconductor module and method of manufacturing the same
11/02/2004	US6812311 Highly stable packaging substrates
11/02/2004	US6812299 Blend curable at a low and high temperature of an epoxy resin-unsaturated aliphatic acid adduct, a (meth)acrylate, a free radical initiator, a crystallizable epoxy resin, and latent curing agent; smooth undercoatings for circuit boards
11/02/2004	US6812178 For use in electronic materials, precision machine component parts, structural materials
11/02/2004	US6812163 Semiconductor device with porous interlayer insulating film
11/02/2004	US6812160 Methods of forming materials between conductive electrical components, and insulating materials
11/02/2004	US6812147 GCIB processing to improve interconnection vias and improved interconnection via
11/02/2004	US6812143 Process of forming copper structures
11/02/2004	US6812142 Method and interlevel dielectric structure for improved metal step coverage
11/02/2004	US6812141 Recessed metal lines for protective enclosure in integrated circuits
11/02/2004	US6812139 Method for metal fill by treatment of mobility layers
11/02/2004	US6812138 Fill pattern generation for spin-on glass and related self-planarization deposition
11/02/2004	US6812137 Method of forming coaxial integrated circuitry interconnect lines
11/02/2004	US6812136 Method of making a semiconductor device having a multilayer metal film of titanium/titanium nitride/tungsten/tungsten carbide
11/02/2004	US6812133 Fabrication method of semiconductor device
11/02/2004	US6812129 Reticle for creating resist-filled vias in a dual damascene process
11/02/2004	US6812128 Method of manufacturing multilayer structured semiconductor device
11/02/2004	US6812127 Method of forming semiconductor device including silicon oxide with fluorine, embedded wiring layer, via holes, and wiring grooves
11/02/2004	US6812126 Method for fabricating a semiconductor chip interconnect
11/02/2004	US6812125 Substrate for semiconductor packaging
11/02/2004	US6812124 Chip structure with bumps and a process for fabricating the same
11/02/2004	US6812123 Semiconductor devices and methods for manufacturing the same
11/02/2004	US6812122 Method for forming a voltage programming element
11/02/2004	US6812113 Process for achieving intermetallic and/or intrametallic air isolation in an integrated circuit, and integrated circuit obtained
11/02/2004	US6812088 Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer
11/02/2004	US6812078 Method for transferring and stacking of semiconductor devices

1 ... 1453 1454 1455 1456 1457 1458 1459 1460 1461 1462 1463 1464 1465 1466 1467 1468 1469 1470 1471 1472 1473 ... 2262