H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2004
11/04/2004	US20040217384 Insulative cap for laser fusing
11/04/2004	US20040217380 Semiconductor device, electronic device, electronic apparatus, method for manufacturing a semiconductor device, and method for manufacturing an electronic device
11/04/2004	US20040217369 Light emitting device
11/04/2004	US20040217363 Integrated circuit device packaging structure and packaging method
11/04/2004	US20040217349 Integrated circuit with a test circuit
11/04/2004	US20040217342 Anisotropically conductive connector, production process thereof and application product thereof
11/04/2004	US20040217305 Method of repairing an integrated electronic circuit, comprising the formation of an electrical isolation
11/04/2004	US20040217003 Controlled, accurate electrophoretic deposition of dielectric material; miniature coaxial cables; immunity to interference, facilitating high speed operation
11/04/2004	US20040216918 Two-layer electrical substrate for optical devices
11/04/2004	US20040216864 CTE matched application specific heat sink assembly
11/04/2004	US20040216641 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
11/04/2004	US20040216504 Bond tool for notching a lead in semiconductor package
11/04/2004	US20040216306 Heat sink, manufacturing method thereof, and electronic apparatus having the heat sink
11/04/2004	DE20310237U1 Cooling device for computer, uses looped hose piece for circulation of cooling water arranged in external housing stack
11/04/2004	DE19747609B4 Dünnfilmmehrschichtsubstrat und daraus hergestellte elektronische Vorrichtung Thin-film multilayer substrate and derived electronic device
11/04/2004	DE19640006B4 Verfahren zum Herstellen eines elektronischen Bauelements A method for fabricating an electronic device
11/04/2004	DE19638380B4 Verwendung einer Glasmasse mit einer niedrigen Dielektrizitätskonstante für Hochfrequenzstromkreise Using a glass composition having a low dielectric constant for high frequency circuits
11/04/2004	DE10333544A1 Wärmeabführeinrichtung und Gehäuse für diese Heat rejection and housing for this
11/04/2004	DE10329206B3 Integrated circuit with several output drivers has respective supply terminals and respective supply line segments for supplying each output driver group
11/04/2004	DE10317462A1 Fuel cell device with electronic circuit comprising power devices, has cooling element including fluid line for cooling-fluid
11/04/2004	DE10317259A1 Heat sink for cooling semiconductor device, separated from housing of electronic circuitry, e.g. in explosive atmosphere, has heat sink attached to metal block attached to outer wall of housing
11/04/2004	DE10317210A1 Elektrische Einrichtung mit einem Halbleitersubstrat und Anschlussmitteln dafür An electrical device comprising a semiconductor substrate and connecting means for
11/04/2004	DE10316357A1 Verfahren zur Überwachung von Leistungshalbleiterbauelementen The method for monitoring power semiconductor components
11/04/2004	DE10315303A1 Semiconductor device system e.g. DRAM, has two semiconductor devices e.g. in stacked arrangement, and powered from power supply provided in first device
11/04/2004	DE10314503A1 Verbesserte integrierte Halbleiterstruktur für Zuverlässigkeitsprüfungen von Dielektrika Improved integrated semiconductor structure for reliability testing of dielectrics
11/04/2004	DE10314172A1 Anordnung aus einem elektrischen Bauelement auf einem Substrat und Verfahren zum Herstellen der Anordnung Arrangement of an electrical component on a substrate and method of manufacturing the arrangement
11/04/2004	DE10297300T5 Mehrere Halbleiterbauteile in einem monolithischen Flip-Chip A plurality of semiconductor devices in a monolithic flip-chip
11/04/2004	DE10297225T5 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zur Herstellung von Halbleiterbauelementen und nach derartigen Verfahren hergestellte Halbleiterbauelemente Die attach adhesives for semiconductor applications, to processes for the production of semiconductor components and manufactured by such a method, semiconductor devices
11/04/2004	DE102004002030A1 Verbundmaterial und Verfahren zu dessen Herstellung Composite material and process for its preparation
11/04/2004	DE10041829B4 Kühlvorrichtung Cooler
11/03/2004	EP1473982A2 Cooling device
11/03/2004	EP1473979A1 High-frequency layered part and manufacturing method thereof
11/03/2004	EP1473977A2 Electronic package with strengthened conductive pad
11/03/2004	EP1473777A2 Solid-state imaging device and method for producing the same
11/03/2004	EP1473776A2 Solid-state imaging device and method for producing the same
11/03/2004	EP1473775A2 Method for producing solid-state imaging device
11/03/2004	EP1473770A1 Low dielectric constant interconnect insulator having fullerene additive
11/03/2004	EP1473769A2 Low thermal expansion adhesives and encapsulants for cryogenic and high power density electronic and photonic device assembly and packaging
11/03/2004	EP1473767A2 Method of forming conductive line for semiconductor device using carbon nanotube and semiconductor device manufactured using the method
11/03/2004	EP1473763A1 Manufacturing method of a lead frame for power semiconductor electronic devices, separating the leads and downsetting the die pad in one step
11/03/2004	EP1473761A1 Method for depositing metal films
11/03/2004	EP1473109A1 Solder film manufacturing method, heat sink furnished with solder film, and semiconductor device and heat sink junction
11/03/2004	EP1472919A2 Heat-sink with large fins-to-air contact area
11/03/2004	EP1472916A1 Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
11/03/2004	EP1472915A2 Circuit carrier and production thereof
11/03/2004	EP1472904A2 Material and method for improved heat dissipation and mechanical hardness for magnetic recording transducers and other electronic devices
11/03/2004	EP1472734A2 Rf amplifier
11/03/2004	EP1472733A1 Receptacle for a programmable, electronic processing device
11/03/2004	EP1472732A1 Device for connecting an ic terminal to a reference potential
11/03/2004	EP1472731A1 Discrete semiconductor component
11/03/2004	EP1472730A1 Space-saving packaging of electronic circuits
11/03/2004	EP1472729A1 Heat sink for semiconductor components or similar devices, method for producing the same and tool for carrying out said method
11/03/2004	EP1472728A2 Thermal management materials having a phase change dispersion
11/03/2004	EP1472726A1 Wire bond-less electronic component for use with an external circuit and method of manufacture
11/03/2004	EP1472724A2 Semiconductor device and method of manufacturing the same
11/03/2004	EP1472699A2 Circuit system with a printed board comprising a programmable memory element
11/03/2004	EP1472588A2 Device and method for disabling electronic devices
11/03/2004	EP1472499A1 Small scale chip cooler assembly
11/03/2004	EP1149519B1 Method of applying a phase change thermal interface material
11/03/2004	CN2653696Y Grating protector of MOS power tube
11/03/2004	CN2653695Y Heat radiator
11/03/2004	CN2653694Y Base for image sensing chip package
11/03/2004	CN2653693Y 芯片封装结构 Chip package structure
11/03/2004	CN2653581Y Cluster type heat radiator
11/03/2004	CN2653579Y Heat radiation seat structure
11/03/2004	CN2653578Y Heat radiation seat
11/03/2004	CN2653577Y Heat radiator buckle
11/03/2004	CN2653575Y Double layer heat radiator
11/03/2004	CN1543757A Parallel plane substrate
11/03/2004	CN1543689A Structure and method for fabrication of a leadless chip carrier with embedded antenna
11/03/2004	CN1543675A Microelectronic package having a bumpless laminated interconnection layer
11/03/2004	CN1543674A Leadless chip carrier with embedded inductor
11/03/2004	CN1543664A Silicone resins and porous materials produced therefrom
11/03/2004	CN1543486A Resin containing dielectric filler for formation of built-in capactor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler
11/03/2004	CN1543304A Housing structure of electronic device and heat radiation method therefor
11/03/2004	CN1543298A Multilayer ceramic device
11/03/2004	CN1543297A Wiring plate and circuit module
11/03/2004	CN1543291A Electronic component built-in module and method of manufacturing the same
11/03/2004	CN1543039A AC generator for vehicles
11/03/2004	CN1542985A Semiconductor device having a photon absorption layer to prevent plasma damage
11/03/2004	CN1542983A Method for producing solid-state imaging device
11/03/2004	CN1542982A Solid-state imaging device and method for producing the same
11/03/2004	CN1542979A Solid-state imaging device and method for producing the same
11/03/2004	CN1542969A 半导体器件 Semiconductor devices
11/03/2004	CN1542968A Semiconductor device and method for fabricating the same
11/03/2004	CN1542967A 半导体器件 Semiconductor devices
11/03/2004	CN1542963A Semiconductor device and method of manufacturing the same, electronic device, electronic instrument
11/03/2004	CN1542962A Electrostatic discharge protection mechanism and LCD display panel using the same
11/03/2004	CN1542961A Electrostatic discharge protective circuit having uniform conducting design
11/03/2004	CN1542960A Semiconductor device and design method thereof
11/03/2004	CN1542959A Semiconductor device and method for manufacturing thereof
11/03/2004	CN1542958A Semiconductor device, and production method for manufacturing such semiconductor device
11/03/2004	CN1542957A Semiconductor device
11/03/2004	CN1542956A High performance cooling device with heat spreader
11/03/2004	CN1542955A Heat sink with visible logo
11/03/2004	CN1542954A 半导体装置 Semiconductor device
11/03/2004	CN1542953A CTE matched application specific heat sink assembly
11/03/2004	CN1542952A Application specific apparatus for dissipating heat from multiple electronic components
11/03/2004	CN1542951A Semiconductor chip module and heat radiating assembly thereof
11/03/2004	CN1542950A Heat sink

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