H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2004
11/04/2004	WO2004095543A2 Laser trimming with phase shifters
11/04/2004	WO2004095524A2 Semiconductor alignment aid
11/04/2004	WO2004095517A2 Passivation layer for group iii-v semiconductor devices
11/04/2004	WO2004095514A2 Circuit device with at least partial packaging and method for forming
11/04/2004	WO2004095510A2 Multilayered cap barrier in microelectronic, interconnect structures
11/04/2004	WO2004094529A1 Acrylic-based thermally conductive composition and thermally conductive sheet
11/04/2004	WO2004094097A1 Phase change lead-free super plastic solders
11/04/2004	WO2004079399A3 Integrated thermal sensor for optoelectronic modules
11/04/2004	WO2004075265A3 Methods for selectively bumping integrated circuit substrates and related structures
11/04/2004	WO2004057662A3 Electronic device and method of manufacturing same
11/04/2004	WO2004053944A3 Fast localization of electrical failures on an integrated circuit system and method
11/04/2004	WO2004015764A3 Vertical system integration
11/04/2004	US20040220806 Audio signal processing apparatus
11/04/2004	US20040219888 Duplexer using surface acoustic wave filters and electronic device equipped with the same
11/04/2004	US20040219795 Method to improve breakdown voltage by H2 plasma treat
11/04/2004	US20040219788 Copper alloys for interconnections having improved electromigration characteristics and methods of making same
11/04/2004	US20040219783 Copper dual damascene interconnect technology
11/04/2004	US20040219782 Semiconductor device and method of manufacturing same
11/04/2004	US20040219781 Semiconductor device and method of fabricating the same
11/04/2004	US20040219780 Manufacturing method of semiconductor device
11/04/2004	US20040219779 Method and structure to improve reliability of copper interconnects
11/04/2004	US20040219775 Lead free bump and method of forming the same
11/04/2004	US20040219774 Method for forming conductive bump and device formed with such a conductive bump
11/04/2004	US20040219773 Method of forming a conductive line for a semiconductor device using a carbon nanotube and semiconductor device manufactured using the method
11/04/2004	US20040219770 Laser trimming problem suppressing semiconductor device manufacturing apparatus and method
11/04/2004	US20040219768 Mask for forming polysilicon and a method for fabricating thin film transistor using the same
11/04/2004	US20040219766 Method and apparatus for preparing a plurality of dice in wafers
11/04/2004	US20040219765 Method of forming a multi-layer semiconductor structure incorporating a processing handle member
11/04/2004	US20040219764 Vacuum package fabrication of integrated circuit components
11/04/2004	US20040219763 Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices
11/04/2004	US20040219759 Semiconductor apparatus having contacts of multiple heights and method of making same
11/04/2004	US20040219720 Metal fuse for semiconductor devices
11/04/2004	US20040219719 Device having resin package and method of producing the same
11/04/2004	US20040219718 Structure and method of direct chip attach
11/04/2004	US20040219717 Method of manufacturing chip size package semiconductor device without intermediate substrate
11/04/2004	US20040219716 Microelectronic assemblies having low profile connections
11/04/2004	US20040219715 Bump formed on semiconductor device chip and method for manufacturing the bump
11/04/2004	US20040219714 Non-contact data carrier and method of fabricating the same
11/04/2004	US20040219713 Elimination of RDL using tape base flip chip on flex for die stacking
11/04/2004	US20040219712 Semiconductor package and method of fabricating same
11/04/2004	US20040219380 Gas barrier laminate film and production method therefor as well as substrate and image display device utilizing the film
11/04/2004	US20040219372 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
11/04/2004	US20040219369 Diffusion barrier layers and methods comprising same for depositing metal films by CVD or ALD processes
11/04/2004	US20040219245 Method of manipulating a sheet of thermoplastic material
11/04/2004	US20040218373 Plated terminations
11/04/2004	US20040218372 LSI package provided with interface module and method of mounting the same
11/04/2004	US20040218365 IC socket assembly
11/04/2004	US20040218364 Application specific heatsink assembly
11/04/2004	US20040218363 Application specific heat-dissipating apparatus that provides electrical isolation for components
11/04/2004	US20040218360 Heat-dispersing fan module of electronic apparatus
11/04/2004	US20040218354 Heat sink and package surface design
11/04/2004	US20040218335 Protection structure for protection from electrostatic discharge and integrated circuit
11/04/2004	US20040218322 ESD protection circuits for mixed-voltage buffers
11/04/2004	US20040217840 Method for making high-performance RF integrated circuits
11/04/2004	US20040217776 Semiconductor integrated circuit including first and second switching transistors having operation states corresponding to operation states of first and second logic circuits
11/04/2004	US20040217701 Organic EL device and liquid crystal display
11/04/2004	US20040217489 Containing an epoxy resin, a phenolic resin, an inorganic filler and a curing accelerator as main components, and further containing a silane coupling agent in 0.01 wt; for encapsulating a semiconductor chip; improved flowability
11/04/2004	US20040217488 Ribbon bonding
11/04/2004	US20040217487 Test structure for detecting bonding-induced cracks
11/04/2004	US20040217486 Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly
11/04/2004	US20040217485 Stacked flip chip package
11/04/2004	US20040217483 Semiconductor device and method for fabricating the semiconductor device
11/04/2004	US20040217481 Structures and methods to enhance copper metallization
11/04/2004	US20040217480 Semiconductor device including dual damascene interocnnections
11/04/2004	US20040217479 Semiconductor device and design method thereof
11/04/2004	US20040217477 RF seal ring structure
11/04/2004	US20040217474 Semiconductor device
11/04/2004	US20040217473 Wafer level package, wafer level packaging procedure for making wafer level package
11/04/2004	US20040217472 Low cost chip carrier with integrated antenna, heat sink, or EMI shielding functions manufactured from conductive loaded resin-based materials
11/04/2004	US20040217471 Component and assemblies with ends offset downwardly
11/04/2004	US20040217470 Circuit substrates, semiconductor devices, semiconductor manufacturing apparatuses, methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devices
11/04/2004	US20040217469 Package structure with increased capacitance and method
11/04/2004	US20040217468 Semiconductor chip, semiconductor device, method of manufacturing the same, circuit board, and electronic equipment
11/04/2004	US20040217467 Apparatus to compensate for stress between heat spreader and thermal interface material
11/04/2004	US20040217466 Function module and its manufacturing method
11/04/2004	US20040217465 Power semiconductor module
11/04/2004	US20040217464 Optical assemblies for transmitting and manipulating optical beams
11/04/2004	US20040217463 Circuit board
11/04/2004	US20040217461 Microelectronic adaptors, assemblies and methods
11/04/2004	US20040217460 Bumpless semiconductor device
11/04/2004	US20040217459 Ball grid array interposer, packages and methods
11/04/2004	US20040217458 Packaged IC using insulated wire
11/04/2004	US20040217456 Circuit substrates, semiconductor devices, semiconductor manufacturing apparatus methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devices
11/04/2004	US20040217455 Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor
11/04/2004	US20040217454 Optical semiconductor package with incorporated lens and shielding
11/04/2004	US20040217453 Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device
11/04/2004	US20040217452 Semiconductor chip arrangement and a method for its production
11/04/2004	US20040217451 Semiconductor packaging structure
11/04/2004	US20040217450 Leadframe-based non-leaded semiconductor package and method of fabricating the same
11/04/2004	US20040217449 Electronic component packaging
11/04/2004	US20040217448 Semiconductor device
11/04/2004	US20040217446 Method and apparatus for preparing a plurality of dice in wafers
11/04/2004	US20040217443 Semiconductor device with inductive component and method of making
11/04/2004	US20040217442 Semiconductor device
11/04/2004	US20040217441 Area efficient stacking of antifuses in semiconductor device
11/04/2004	US20040217440 Method of forming an inductor with continuous metal deposition
11/04/2004	US20040217439 Fuse and method for forming
11/04/2004	US20040217424 Semiconductor device structure facilitating electrostatic discharge protection and manufacturing method thereof
11/04/2004	US20040217389 Apparatus and method for molding a semiconductor die package with enhanced thermal conductivity
11/04/2004	US20040217386 Semiconductor device capable of adjusting operation timing using antifuse

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