H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2004
11/09/2004	US6815833 Flip chip package
11/09/2004	US6815832 Semiconductor device having opposed and connected semiconductor chips with lateral deviation confirming electrodes
11/09/2004	US6815831 Flip-chip device with multi-layered underfill having graded coefficient of thermal expansion
11/09/2004	US6815829 Semiconductor device with compact package
11/09/2004	US6815827 Electrical connection between two faces of a substrate and manufacturing process
11/09/2004	US6815826 Alignment for buried structures formed by surface transformation of empty spaces in solid state materials
11/09/2004	US6815825 Semiconductor devices having gradual slope contacts
11/09/2004	US6815824 Semiconductor device and method of manufacturing the same
11/09/2004	US6815823 Copper metal structure for the reduction of intra-metal capacitance
11/09/2004	US6815821 Method of fabricating seal-ring structure with ESD protection
11/09/2004	US6815820 Method for forming a semiconductor interconnect with multiple thickness
11/09/2004	US6815818 Having improved adhesion between layers of electroconductive materials during chemical mechanical polishing
11/09/2004	US6815815 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
11/09/2004	US6815814 Thermoelectric module
11/09/2004	US6815813 Self-contained heat sink and a method for fabricating same
11/09/2004	US6815812 Direct alignment of contacts
11/09/2004	US6815811 Semiconductor integrated circuit with dummy patterns
11/09/2004	US6815810 High-frequency semiconductor device
11/09/2004	US6815809 Portable electronic device
11/09/2004	US6815808 Hollow airtight semiconductor device package
11/09/2004	US6815807 Method of fabricating a redundant pinout configuration for signal enhancement in an IC package
11/09/2004	US6815806 Asymmetric partially-etched leads for finer pitch semiconductor chip package
11/09/2004	US6815804 High permeability composite films to reduce noise in high speed interconnects
11/09/2004	US6815803 Multiple chip semiconductor arrangement having electrical components in separating regions
11/09/2004	US6815799 Semiconductor integrated circuit device
11/09/2004	US6815797 Silicide bridged anti-fuse
11/09/2004	US6815796 Composite module and process of producing same
11/09/2004	US6815789 Semiconductor electronic device and method of manufacturing thereof
11/09/2004	US6815776 Multi-finger type electrostatic discharge protection circuit
11/09/2004	US6815771 Silicon on insulator device and layout method of the same
11/09/2004	US6815752 Semiconductor memory device for increasing access speed thereof
11/09/2004	US6815747 Semiconductor device comprising capacitor
11/09/2004	US6815746 Semiconductor device and method of manufacturing the same
11/09/2004	US6815742 System with meshed power and signal buses on cell array
11/09/2004	US6815740 Gate feed structure for reduced size field effect transistors
11/09/2004	US6815720 Substrate having buried structure, display device including the substrate, method of making the substrate and method for fabricating the display device
11/09/2004	US6815714 Conductive structure in a semiconductor material
11/09/2004	US6815713 Process via mismatch detecting device
11/09/2004	US6815712 Method for selecting components for a matched set from a wafer-interposer assembly
11/09/2004	US6815643 Semiconductor device with temperature regulation
11/09/2004	US6815621 Chip scale package, printed circuit board, and method of designing a printed circuit board
11/09/2004	US6815619 Circuit board
11/09/2004	US6815613 Electronic component with external connection elements
11/09/2004	US6815486 Silicone-organic block copolymer, and a thermally conductive filler.
11/09/2004	US6815366 Method for etching organic insulating film and method for fabricating semiconductor device
11/09/2004	US6815354 Method and structure for thru-mask contact electrodeposition
11/09/2004	US6815346 Unique feature design enabling structural integrity for advanced low k semiconductor chips
11/09/2004	US6815345 Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing
11/09/2004	US6815342 Low resistance metal interconnect lines and a process for fabricating them
11/09/2004	US6815341 Method for fabricating metal interconnect in a carbon-containing silicon oxide film
11/09/2004	US6815338 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation
11/09/2004	US6815334 Method for forming multi-layer metal line of semiconductor device
11/09/2004	US6815332 Method for forming integrated dielectric layers
11/09/2004	US6815330 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
11/09/2004	US6815329 Multilayer interconnect structure containing air gaps and method for making
11/09/2004	US6815328 Method of manufacturing an integrated semiconductor device having a plurality of connection levels
11/09/2004	US6815327 Mask repattern process
11/09/2004	US6815325 Semiconductor device and test method for manufacturing same
11/09/2004	US6815324 Reliable metal bumps on top of I/O pads after removal of test probe marks
11/09/2004	US6815319 Damascene resistor and method for measuring the width of same
11/09/2004	US6815318 Manufacturing method of semiconductor device
11/09/2004	US6815314 Hermetic chip and method of manufacture
11/09/2004	US6815313 Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same
11/09/2004	US6815308 Use of a dual-tone resist to form photomasks including alignment mark protection, intermediate semiconductor device structures and bulk semiconductor device substrates
11/09/2004	US6815276 Segmented power MOSFET of safe operation
11/09/2004	US6815265 Method of fabricating a semiconductor device with a passivation film
11/09/2004	US6815264 Antifuses
11/09/2004	US6815263 Component assembly and method for producing the same
11/09/2004	US6815262 Apparatus and method for attaching an integrated circuit sensor to a substrate
11/09/2004	US6815260 Method of making semiconductor device
11/09/2004	US6815258 Flip-chip package with underfill having low density filler
11/09/2004	US6815257 Chip scale package and method of fabricating the same
11/09/2004	US6815256 Silicon building blocks in integrated circuit packaging
11/09/2004	US6815255 Semiconductor device and manufacturing method thereof
11/09/2004	US6815254 Semiconductor package with multiple sides having package contacts
11/09/2004	US6815253 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
11/09/2004	US6815251 High density modularity for IC's
11/09/2004	US6815249 Surface-mount device and method for manufacturing the surface-mount device
11/09/2004	US6815237 Testing apparatus and method for determining an etch bias associated with a semiconductor-processing step
11/09/2004	US6815234 Reducing stress in integrated circuits
11/09/2004	US6815230 Control signal transmitting method with package power pin and related integrated circuit package structure
11/09/2004	US6815222 Method for protecting capacitive elements during production of a semiconductor device
11/09/2004	US6815220 Magnetic layer processing
11/09/2004	US6815084 Discontinuous high-modulus fiber metal matrix composite for thermal management applications
11/09/2004	US6815073 Use of a conductor paste containing a silver particle having a specific surface area of 0.3 m2/g to 3.0 m2/g and no glass to enhance the reliability of the electrical connection of a silver-based conductor film
11/09/2004	US6815046 Method of producing ceramic multilayer substrate
11/09/2004	US6814893 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure
11/09/2004	US6814795 Rapidly solidifies without forced drying; silver or aluminum and glass particles dispersed in thermoplastic polymer system; photovoltaic cells
11/04/2004	WO2004095897A2 Electrical contact
11/04/2004	WO2004095742A2 Communication device and communication apparatus
11/04/2004	WO2004095593A1 Led light assembly with active cooling
11/04/2004	WO2004095583A2 Radiation-hardened transistor fabricated by modified cmos process
11/04/2004	WO2004095578A1 Semiconductor device and production method therefor
11/04/2004	WO2004095576A1 Semiconductor device
11/04/2004	WO2004095575A2 Electronic assembly with fluid cooling and associated methods
11/04/2004	WO2004095574A1 Thermal interface apparatus, systems, and methods
11/04/2004	WO2004095573A1 Wafer scale package and method of assembly
11/04/2004	WO2004095570A2 Test structure for electrically verifying the depths of trench-etchings in an soi wafer, and associated working methods
11/04/2004	WO2004095567A1 Monitoring the reduction in thickness as material is removed from a wafer composite and test structure for monitoring removal of material
11/04/2004	WO2004095557A1 Semiconductor device

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