Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2014
03/06/2014DE102012215651A1 Verbindungselement zur elektrisch leitenden Verbindung einer ersten Leistungselektronikeinrichtung mit einer zweiten Leistungselektronikeinrichtung Connecting element for electrically conductive connection to a first power electronic device to a second power electronic device
03/06/2014DE102012215606A1 Layered structure for semiconductor component, has diffusion barrier arranged between protective layer and substrate and indirectly bordered on protective layer, where part of structure is arranged between barrier and component layer
03/06/2014DE102012215484A1 Cooling device for cooling electronic component e.g. power semiconductor, has sonotrode element that is arranged closer to first open end of resonance tube than second open end
03/06/2014DE102012215285A1 Gehäuse, elektronische Baugruppe, Verfahren zum Herstellen eines Gehäuses und Verfahren zum Herstellen einer elektronischen Baugruppe Housing, electronic module, method for manufacturing a casing and method for manufacturing an electronic module,
03/06/2014DE102012215233A1 Semiconductor device equipped in sensor module e.g. differential pressure sensor integrated in diesel particulate filter, has separate metallization portions which are formed on contact surface of doped contact region
03/06/2014DE102012108105A1 Schutzschaltung und Verfahren zum Schutz einer Schaltung Protection circuit and method for protecting a circuit
03/05/2014EP2704537A1 Wiring substrate, multi-piece wiring substrate, and method for manufacturing same
03/05/2014EP2704194A1 Semiconductor power module and method for manufacturing the same
03/05/2014EP2704193A1 Semiconductor device and manufacturing method thereof
03/05/2014EP2704192A2 Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture
03/05/2014EP2704191A1 Cooler for semiconductor module, and semiconductor module
03/05/2014EP2704190A1 Modular cooling system
03/05/2014EP2704189A1 Semiconductor device
03/05/2014EP2704187A1 Method for producing electrical through hole interconnects and corresponding devices
03/05/2014EP2704185A1 Method for producing electronic component module and electronic component module
03/05/2014EP2703763A1 Evaporator with integrated pre-heater for power electronics cooling
03/05/2014EP2702083A1 Resin compositions comprising modified epoxy resins with sorbic acid
03/05/2014CN203466224U Voltage reduction and heat dissipation-integrated silicon chain module
03/05/2014CN203466187U Thermoelectric module
03/05/2014CN203466186U Three-dimensional interconnection structure
03/05/2014CN203466185U Novel IC molding structure
03/05/2014CN203466184U Liquid cooling insulation type radiator
03/05/2014CN203466183U Explosion-proof structure-based insulated heat pipe radiator
03/05/2014CN203466182U Ceramic cooling fin having advantages of good heat conduction performance and light weight
03/05/2014CN203466181U Cooling device and cooling fan
03/05/2014CN203466180U Eyelet honeycomb plate electronic-chip heat radiator
03/05/2014CN203466179U Stack structure for chip heating through electric heating sheet conduction
03/05/2014CN203466178U Semiconductor packaging structure capable of being vitrified
03/05/2014CN203466177U Semiconductor packaging structure of magnetic conduction type
03/05/2014CN203466176U Novel packaging structure of IC
03/05/2014CN203466175U Boron-free oxidized dumet wire
03/05/2014CN203466174U Chip-grade filter encapsulation structure
03/05/2014CN103621194A Electronic device
03/05/2014CN103620778A Flip-chip, face-up and face-down centerbond memory wirebond assemblies
03/05/2014CN103620775A Stacked chip-on-board module with edge connector
03/05/2014CN103620774A Flip-chip, face-up and face-down wirebond combination package
03/05/2014CN103620773A Multiple die face-down stacking for two or more die
03/05/2014CN103620772A Multi-chip module with stacked face-down connected dies
03/05/2014CN103620770A Stress-aware design for integrated circuits
03/05/2014CN103620768A Lead frame and power module
03/05/2014CN103620767A Secondary device integration into coreless microelectronic device packages
03/05/2014CN103620766A In situ-built pin-grid arrays for coreless substrates, and methods of making same
03/05/2014CN103620765A Heat sink for cooling of power semiconductor modules
03/05/2014CN103620764A Semiconductor unit with submount for semiconductor device
03/05/2014CN103620763A Power semiconductor module and method of manufacturing same
03/05/2014CN103620762A Semiconductor device
03/05/2014CN103620746A Method for producing semiconductor device and semiconductor device
03/05/2014CN103620302A Active cooling device with electro-statically moving electrode and method of active cooling with electro-statically moving electrode
03/05/2014CN103619779A Brazing filler metal, brazing filler metal paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module
03/05/2014CN103617992A Lead frame capacitor and capacitive coupling isolator circuit
03/05/2014CN103617991A Semiconductor encapsulation electromagnetic shielding structure and manufacturing method
03/05/2014CN103617990A Double-row plastic package lead frame
03/05/2014CN103617989A Thickened plastic-package lead frame
03/05/2014CN103617988A Plastic packaging lead frame pin of thick-thin material
03/05/2014CN103617987A Plastic encapsulated lead frame for low-power electric appliances
03/05/2014CN103617986A Plastic-packaged lead frame capable of performing heat dissipation rapidly
03/05/2014CN103617985A Plastic package lead frame with bent heads
03/05/2014CN103617984A Plastic package lead frame
03/05/2014CN103617983A Low-power plastic packaged lead frame
03/05/2014CN103617982A Plastic package lead frame with pits
03/05/2014CN103617981A Plastic package lead frame with opened heads
03/05/2014CN103617980A Plastic package lead frame with sawtooth indentations
03/05/2014CN103617979A Plastic package lead frame convenient to package
03/05/2014CN103617978A Small-power device-used lead frame
03/05/2014CN103617977A High-power molding-encapsulated lead frame
03/05/2014CN103617976A Flat plate lead frame
03/05/2014CN103617975A Wire forging-facilitating lead frame
03/05/2014CN103617974A Positioning and mounting-facilitating lead frame
03/05/2014CN103617973A Lead frame used in high temperature
03/05/2014CN103617972A High-power device-used lead frame
03/05/2014CN103617971A Injection molding-facilitating lead frame
03/05/2014CN103617970A Paired chip-loadable lead frame
03/05/2014CN103617969A Heat sink welded with gold and tin alloy thin film and manufacturing method of heat sink
03/05/2014CN103617968A Packaging device of APD focal plane
03/05/2014CN103617967A Power electronic module made of novel insulating materials
03/05/2014CN103617966A Monolithic integrated circuit chip heating method
03/05/2014CN103617965A Flat integrated circuit package structure provided with lead outside
03/05/2014CN103617964A Copper-nickel alloy encapsulated pin grid array type integrated circuit
03/05/2014CN103617849A Integrated water-cooled radiator based on damping resistors
03/05/2014CN102569224B Circuit carrier with high heat dissipation performance and related circuit modules
03/05/2014CN102446905B Field-effect component electrostatic protector
03/05/2014CN102446904B DIP (dual in-line package) component electrostatic protector
03/05/2014CN102347319B Package-on-package structures with reduced bump bridging
03/05/2014CN102194878B Termination structure with multiple embedded potential spreading capacitive structures for trench MOSFET and method
03/05/2014CN102024712B Packaging structure and method for manufacturing same
03/05/2014CN101840896B Flip-chip high-heat-radiation spheroidal array encapsulation structure
03/05/2014CN101685829B Vehicle, display device and manufacturing method for semiconductor device
03/04/2014US8666469 Analyte monitoring device and methods of use
03/04/2014US8665595 Method and apparatus for cooling a circuit component
03/04/2014US8664846 Solid state lighting device including green shifted red component
03/04/2014US8664780 Semiconductor package having plural semiconductor chips and method of forming the same
03/04/2014US8664779 Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus
03/04/2014US8664778 Method of flip-chip hybridization for the forming of tight cavities and systems obtained by such a method
03/04/2014US8664777 Routing layer for mitigating stress in a semiconductor die
03/04/2014US8664776 Interconnection tape providing a serial electrode pad connection in a semiconductor device
03/04/2014US8664775 Semiconductor device
03/04/2014US8664774 Bondwire configuration for reduced crosstalk
03/04/2014US8664773 Mounting structure of semiconductor package component and manufacturing method therefor
03/04/2014US8664772 Interface substrate with interposer
03/04/2014US8664771 Apparatuses and methods to enhance passivation and ILD reliability
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