H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2004
11/11/2004	US20040222517 Two piece heat sink and device package
11/11/2004	US20040222515 Double-sided cooling isolated packaged power semiconductor device
11/11/2004	US20040222514 Semiconductor die package having mesh power and ground planes
11/11/2004	US20040222513 Semiconductor device and method for manufacturing the same
11/11/2004	US20040222511 Method and apparatus for electromagnetic shielding of a circuit element
11/11/2004	US20040222510 Semiconductor device, semiconductor pack age, electronic device, electronic apparatus, and manufacturing methods of semiconductor device and electronic device
11/11/2004	US20040222508 Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device
11/11/2004	US20040222506 Integrated circuit package configuration incorporating shielded circuit element structure
11/11/2004	US20040222504 Wafer level packaging
11/11/2004	US20040222503 Multi-chip package with electrical interconnection
11/11/2004	US20040222501 Chemical vapor deposition epitaxial growth
11/11/2004	US20040222494 Electrical component structure
11/11/2004	US20040222491 Integrated fuse with regions of different doping within the fuse neck
11/11/2004	US20040222487 Semiconductor device having a shielding layer
11/11/2004	US20040222478 Redistribution layer shielding of a circuit element
11/11/2004	US20040222469 Semiconductor device
11/11/2004	US20040222450 MRAM architecture with a bit line located underneath the magnetic tunneling junction device
11/11/2004	US20040222446 Ion sensitive field effect transistor and fabrication
11/11/2004	US20040222445 Modified contact for programmable devices
11/11/2004	US20040222440 Chip scale package with flip chip interconnect
11/11/2004	US20040222438 Semiconductor memory device and manufacturing process for the same
11/11/2004	US20040222416 Polished semiconductor wafer and process for producing it
11/11/2004	US20040222408 Circuit-connecting material and circuit terminal connected structure and connecting method
11/11/2004	US20040222187 Photoetching; adjustment mask; radiation
11/11/2004	US20040222014 Microelectronic security coatings
11/11/2004	US20040221877 Process and apparatus for treating a workpiece with gases
11/11/2004	US20040221603 Method and system for cooling high power density devices
11/11/2004	DE4423558B4 Halbleiterbauelement mit einer leitfähigen Schicht, MOS-Feldeffekttransistor mit einer leitfähigen Schicht und Verfahren zu deren Herstellung A semiconductor device with a conductive layer, the MOS field effect transistor with a conductive layer and processes for their preparation
11/11/2004	DE202004014100U1 Rectifier chip terminal has chip fixed by solder point, packaging encapsulation filling; terminal is plugged into bore connecting journals on circuit substrate and chip is sealed with packaging glass
11/11/2004	DE19923467B4 Halbleitermodul mit mehreren Halbleiterchips und leitender Verbindung mittels flexibler Bänder zwischen den Halbleiterchips A semiconductor module having a plurality of semiconductor chip and conductively connected by means of flexible bands between the semiconductor chips
11/11/2004	DE10340511B3 Production batch control method for monitoring production process quality during semiconductor element manufacture uses rotation cycle for obtaining test semiconductor discs from successive production runs
11/11/2004	DE10317893A1 Maskierungsanordnung und Verfahren zum Herstellen von integrierten Schaltungsanordnungen Masking arrangement and method for producing integrated circuit arrangements
11/11/2004	DE10317748A1 Test structure for testing the depth of trench etchings in SOI wafers has a row of connected islands after etching insulating trenches, in which each island is surrounded by a trench which has a different width from island to island
11/11/2004	DE10317596A1 Verfahren zur Erzeugung von Lotkugeln auf einem elektrischen Bauelement A process for the production of solder balls on an electrical component
11/11/2004	DE10315532A1 Current sensing integrated circuit has two magnetic field sensor chips arranged on opposing sides of framework and an evaluation unit all contained within sensor housing
11/11/2004	DE10314601A1 Halbleiterschaltung mit einer Schutzschaltung A semiconductor circuit with a protection circuit
11/11/2004	DE10307815B3 Integriertes elektronisches Bauelement mit gezielt erzeugten Nanoröhren in vertikalen Strukturen und dessen Herstellungsverfahren An integrated electronic device with selectively produced nanotubes in vertical structures and its manufacturing method
11/11/2004	DE10297447T5 Diffusionsbarriere Diffusion barrier
11/11/2004	DE10251446B4 Kühlanordnung für lichtbündelnde Photovoltaik-Anlagen Light condensing cooling arrangement for photovoltaic systems
11/11/2004	DE102004010649A1 Gestapeltes Halbleiterpaket Stacked semiconductor package
11/11/2004	DE10153192B4 Teststrukturbereich für eine Mehrlagenverdrahtung von integrierten Schaltungen und Verfahren zum Herstellen eines solchen Teststrukturbereichs Test structure region for a multi-layer wiring of integrated circuits and methods for manufacturing such a test structure region
11/11/2004	CA2563997A1 An encased thermal management device and method of making such a device
11/10/2004	EP1475960A2 Solid-state imaging device, camera module, and camera-module manufacturing method
11/10/2004	EP1475861A1 Apparatus for electrical connection between substrates
11/10/2004	EP1475846A2 Light emitting diode based light source with cooling liquid arrangement, and projection-type display apparatus
11/10/2004	EP1475834A2 High density interconnect structure for use on software defined radio
11/10/2004	EP1475833A1 Integrated circuit comprising at least one metallisation level
11/10/2004	EP1475832A1 Pressure-contactable power semiconductor module
11/10/2004	EP1475831A2 Method of producing TAB tape carrier
11/10/2004	EP1474959A1 Method for embedding a component in a base and forming a contact
11/10/2004	EP1474829A1 Thin films, structures having thin films, and methods of forming thin films
11/10/2004	EP1474828A2 Housing for a power semiconductor module which is resistant to high voltages
11/10/2004	EP1278796B1 Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom
11/10/2004	EP1153430B1 Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits
11/10/2004	EP0847595B1 Cooling element for electronic components
11/10/2004	CN2655425Y Heat radiating structure of electronic element
11/10/2004	CN2655424Y Plate-heat pipe
11/10/2004	CN2655423Y Heat-pipe type cooling plate of high-heat flow uniform temp. radiating
11/10/2004	CN2655422Y Improvement of radiating fin jointing structure
11/10/2004	CN2655421Y 组合式散热器 Combined radiator
11/10/2004	CN2655420Y Radiator
11/10/2004	CN2655419Y Radiator, semiconductor bearer using same and package for semiconductor
11/10/2004	CN2655328Y Heat radiating and structure reinforced computer host board
11/10/2004	CN2655327Y Radiating structure for central processor
11/10/2004	CN2655326Y Radiator
11/10/2004	CN1545828A Power delivery connector for integrated circuits utilizing integrated capacitors
11/10/2004	CN1545739A Semiconductor device using semiconductor chip
11/10/2004	CN1545731A Current conducting and heat conducting interface
11/10/2004	CN1545730A Semiconductor device using semiconductor chip
11/10/2004	CN1545728A Semiconductor device, method for manufacturing the same, and plating solution
11/10/2004	CN1545727A Semiconductor device, its manufacturing method, and radio communication device
11/10/2004	CN1545726A Copper vias in low-K technology
11/10/2004	CN1545373A 信号传输结构 Signal transmission structure
11/10/2004	CN1545002A Cooling system for electronic apparatus
11/10/2004	CN1545001A Cooling system for electronic apparatus
11/10/2004	CN1175490C Output buffer and electrostatic protection apparatus
11/10/2004	CN1175489C Wiring pad with edge-reinforcing structure
11/10/2004	CN1175488C Semiconductor package and mfg. method thereof
11/10/2004	CN1175481C Wire for semiconductor and manufacturing method thereof
11/10/2004	CN1175479C Ball-array package method for integrated circuits
11/10/2004	CN1175336C Cooling device provided with radiator
11/10/2004	CN1175335C Cooling unit for cooling heating circuit assembly and electronic apparatus including said cooling unit
11/10/2004	CN1175037C Phenol curing agent for epoxy resin and epoxy resin composition using said curing agent
11/10/2004	CN1175033C Composite of powdered fillers and polymer bond and process for preparing them
11/09/2004	US6816999 Method of extracting interconnection capacitance of semiconductor integrated chip and recording medium for recording the same
11/09/2004	US6816995 Method of designing interconnects
11/09/2004	US6816399 Semiconductor memory device including ferroelectric memory formed using ferroelectric capacitor
11/09/2004	US6816385 Compliant laminate connector
11/09/2004	US6816378 Stack up assembly
11/09/2004	US6816377 Electronic control unit
11/09/2004	US6816375 Heat sink attachment
11/09/2004	US6816374 High efficiency heat sink/air cooler system for heat-generating components
11/09/2004	US6816373 Heat dissipation device
11/09/2004	US6816371 Method and arrangement for enhancing the cooling capacity of portable computers
11/09/2004	US6816294 On-the-fly beam path error correction for memory link processing
11/09/2004	US6816041 Microwave monolithic integrated circuit (MMIC) carrier interface
11/09/2004	US6815968 Reduced terminal testing system
11/09/2004	US6815965 Integrated circuit internal heating system and method therefor
11/09/2004	US6815837 Electronic package with strengthened conductive pad
11/09/2004	US6815836 Wire bonding for thin semiconductor package

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