H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2004
11/16/2004	US6818479 Highly moisture-sensitive electronic device element and method for fabrication
11/16/2004	US6818476 Insert-moldable heat spreader, semiconductor device using same, and method for manufacturing such semiconductor device
11/16/2004	US6818475 Wafer level package and the process of the same
11/16/2004	US6818474 Method for manufacturing stacked chip package
11/16/2004	US6818473 Method for fabricating ceramic chip packages
11/16/2004	US6818472 Ball grid array package
11/16/2004	US6818464 Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes
11/16/2004	US6818462 Method of determining the active region width between shallow trench isolation structures using a c-v measurement technique for fabricating a flash memory semiconductor device and a device thereby formed
11/16/2004	US6818460 Method for applying adhesives to a lead frame
11/16/2004	US6818436 Formed by high-speed injection molding; for in vivo enzyme treatment
11/16/2004	US6818318 Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complex
11/16/2004	US6818285 Product of diels alder and phenyl acetylene cure reactions between at least one compound having two or more diene functional groups and at least one compound having two or more dienophile functional groups
11/16/2004	US6818090 Semiconductor device in chip format and method for producing it
11/16/2004	US6817854 Mold with compensating base
11/16/2004	US6817405 Apparatus having forced fluid cooling and pin-fin heat sink
11/16/2004	US6817255 Apparatus and method for testing of microscale to nanoscale thin films
11/16/2004	US6817204 Modular sprayjet cooling system
11/16/2004	US6817196 Spray cooling system with cooling regime detection
11/16/2004	US6817096 Method of manufacturing a heat pipe construction
11/16/2004	US6817091 Electronic assembly having solder thermal interface between a die substrate and a heat spreader
11/16/2004	CA2291402C Stress relieved call grid array package
11/11/2004	WO2004097940A1 Package structure and sensor module using the same
11/11/2004	WO2004097937A1 Lead free alloys for column/ball grid arrays, organic interposers and passive component assembly
11/11/2004	WO2004097936A1 A cellular thermal management device and method of making such a device
11/11/2004	WO2004097935A2 Heatsink assembly
11/11/2004	WO2004097934A2 An encased thermal management device and method of making such a device
11/11/2004	WO2004097933A2 Method and apparatus for optically aligning integrated circuit devices
11/11/2004	WO2004097931A1 Method for fabricating semiconductor device
11/11/2004	WO2004097930A1 Semiconductor device and method for fabricating the same
11/11/2004	WO2004097917A1 Method for fabricating semiconductor device, semiconductor wafer and semiconductor device
11/11/2004	WO2004097916A1 Method for fabricating semiconductor device, semiconductor wafer and semiconductor device
11/11/2004	WO2004097905A2 Dc-dc converter implemented in a land grid array package
11/11/2004	WO2004097904A2 System and method of reducing die attach stress and strain
11/11/2004	WO2004097898A2 Fuse and method for forming
11/11/2004	WO2004097896A2 A packaged integrated circuit having a heat spreader and method therefor
11/11/2004	WO2004096911A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device
11/11/2004	WO2004096513A2 Metal-plastic composite component and methods for the production thereof
11/11/2004	WO2004088727A3 Multi-chip ball grid array package and method of manufacture
11/11/2004	WO2004082018A3 Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same
11/11/2004	WO2004061962A3 Multi-layer integrated semiconductor structure
11/11/2004	WO2004057649A3 Voltage contrast test structure
11/11/2004	WO2004049434A3 Decreasing thermal contact resistance at a material interface
11/11/2004	WO2004042306A3 Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
11/11/2004	WO2004034428A3 Semiconductor device package
11/11/2004	US20040225991 Method and apparatus for circuit design
11/11/2004	US20040225385 Method for manufacturing multi-kind and small quantity semiconductor products in a mass- production line and system thereof
11/11/2004	US20040224647 High density interconnect structure for use on software defined radio
11/11/2004	US20040224535 Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold
11/11/2004	US20040224515 Method and apparatus for forming metal-metal oxide etch stop/barrier for integrated circut interconnects
11/11/2004	US20040224507 Copper alloys for interconnections having improved electromigration characteristics and methods of making same
11/11/2004	US20040224500 Method of forming metal line of semiconductor device
11/11/2004	US20040224499 Semiconductor device substrate and manufacturing method thereof and semiconductor package
11/11/2004	US20040224497 Method to form selective cap layers on metal features with narrow spaces
11/11/2004	US20040224494 Method to generate porous organic dielectric
11/11/2004	US20040224493 Semiconductor device and method for fabricating the same
11/11/2004	US20040224491 Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps
11/11/2004	US20040224481 Semiconductor devices, manufacturing methods therefor, circuit substrates and electronic devices
11/11/2004	US20040224477 Method of producing a high resistivity simox silicon substrate
11/11/2004	US20040224476 Semiconductor integrated circuit device
11/11/2004	US20040224453 Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus
11/11/2004	US20040224444 Fuse layout and method of trimming
11/11/2004	US20040224442 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
11/11/2004	US20040224441 Method of manufacturing electronic part, electronic part, method of mounting electronic part, and electronic apparatus
11/11/2004	US20040224439 Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor package
11/11/2004	US20040224438 Chip scale surface mounted device and process of manufacture
11/11/2004	US20040224437 Microelectronic devices including underfill apertures
11/11/2004	US20040224436 Method of producing tab tape carrier
11/11/2004	US20040224431 Electrical fuse element test structure and method
11/11/2004	US20040224241 Thin film transistor array panel, manufacturing method thereof, and mask therefor
11/11/2004	US20040224149 Circuit tape having adhesive film semiconductor device and a method for manufacturing the same
11/11/2004	US20040224148 Anisotropically conductive sheet
11/11/2004	US20040224143 Metal-ceramic composite material
11/11/2004	US20040224138 Electrically active textile article
11/11/2004	US20040223306 AC coupling circuit having a large capacitance and a good frequency response
11/11/2004	US20040223303 Dual material heat sink core assembly
11/11/2004	US20040223289 Multi-layer capacitor, wiring board, and high-frequency circuit
11/11/2004	US20040223072 Solid-state imaging device, camera module, and camera-module manufacturing method
11/11/2004	US20040222915 Semiconductor integrated circuit device and audio appliance employing it
11/11/2004	US20040222850 Integrated power amplifier module with power sensor
11/11/2004	US20040222811 Integrated module having a delay element
11/11/2004	US20040222810 Integrated test circuit in an integrated circuit
11/11/2004	US20040222809 System for probing, testing, burn-in, repairing and programming of integrated circuits
11/11/2004	US20040222773 Fully integrated DC-to-DC regulator utilizing on-chip inductors with high frequency magnetic materials
11/11/2004	US20040222535 Apparatus for connecting between substrates
11/11/2004	US20040222534 Semiconductor device, electronic device, electronic equipment, method of manufacturing semiconductor device, and method of manufacturing electronic device
11/11/2004	US20040222533 Semiconductor device and method of manufacturing the same
11/11/2004	US20040222532 Controlling interdiffusion rates in metal interconnection structures
11/11/2004	US20040222531 Cu or a Cu alloy wiring; designed with dummy pattern rule; number of contacts determined by width; via hole etching process through wiring layer averts contact defect and degraded reliabilty; circuits
11/11/2004	US20040222530 Semiconductor device having low-k dielectric film in pad region and method for manufacturing thereof
11/11/2004	US20040222529 Dual damascene pattern liner
11/11/2004	US20040222528 Semiconductor device
11/11/2004	US20040222527 Dual damascene pattern liner
11/11/2004	US20040222526 Semiconductor device and manufacturing method thereof
11/11/2004	US20040222525 Advanced VLSI metallization
11/11/2004	US20040222523 Insulated conductive ball for anisotropic conductive connection, method of preparing the same, and product using the same
11/11/2004	US20040222522 Semiconductor device and manufacturing method of the same
11/11/2004	US20040222521 Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device
11/11/2004	US20040222520 Integrated circuit package with flat metal bump and manufacturing method therefor
11/11/2004	US20040222519 Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device
11/11/2004	US20040222518 Ball grid array with bumps

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