H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2004
11/17/2004	EP1081205B1 Resin compositions
11/17/2004	CN2657202Y Improved surge-resisting device for semiconductor
11/17/2004	CN2657201Y Water-cooled radiator
11/17/2004	CN2657200Y Liquid-flow type heat conduction seat
11/17/2004	CN2657199Y Pile-up finned radiator
11/17/2004	CN2657198Y Combined finned radiator
11/17/2004	CN2657197Y Radiator assembly
11/17/2004	CN2657196Y Radiator assembly
11/17/2004	CN2657195Y Radiator fixed fastening device
11/17/2004	CN2657194Y Fastening device for radiator
11/17/2004	CN2657193Y Fastening device for radiator
11/17/2004	CN2657192Y 散热器 Heat sink
11/17/2004	CN2657191Y Base structure for integrated circuit
11/17/2004	CN2657082Y Radiator for heat pipe
11/17/2004	CN2657079Y Fastening device for radiator
11/17/2004	CN2657078Y Water-cooled radiator
11/17/2004	CN1547778A Process for producing microelectromechanical components
11/17/2004	CN1547775A Integrated circuit structure for mixed-signal RF applications and circuits
11/17/2004	CN1547774A Integrated circuit package with a capacitor
11/17/2004	CN1547773A Optically and electrically programmable silicided polysilicon fuse device
11/17/2004	CN1547772A Interconnect module with reduced power distribution impedance
11/17/2004	CN1547771A High performance, low cost microelectronic circuit package with interposer
11/17/2004	CN1547769A Method of forming a raised contact for a substrate
11/17/2004	CN1547767A Semiconductor epitaxial wafer and method for measuring withstand voltage thereof
11/17/2004	CN1547763A Dummy structures to reduce metal recess in electropolishing process
11/17/2004	CN1547758A Wafer level underfill and interconnect process
11/17/2004	CN1547258A 导线布局结构 Wire layout structure
11/17/2004	CN1547257A Electronic chip bias fan axis type radiator
11/17/2004	CN1547250A Hierarchy type programmable interconnecting line structure
11/17/2004	CN1547246A Manufacturing method of ceramic packaging substrate
11/17/2004	CN1546627A Novel cleaning solution for the stripping of silicon nitride film in wet method
11/17/2004	CN1176547C Image instrument module package
11/17/2004	CN1176496C Semiconductor device and mfg. method thereof
11/17/2004	CN1176491C Mixed medium structure used for improving stability of rear production line structure
11/17/2004	CN1176488C Method for testing intensity of dielectric layer between metal layers
11/17/2004	CN1176174C Sealing wax for electronic component coil
11/16/2004	US6820241 Semiconductor device with voltage down circuit changing power supply voltage to operating voltage
11/16/2004	US6820028 Method and apparatus for monitoring integrated circuit fabrication
11/16/2004	US6819572 Electromagnetic noise suppression device
11/16/2004	US6819570 Circuit board with lead frame
11/16/2004	US6819566 Grounding and thermal dissipation for integrated circuit packages
11/16/2004	US6819565 Cavity-down ball grid array semiconductor package with heat spreader
11/16/2004	US6819564 Heat dissipation module
11/16/2004	US6819562 Cooling apparatus for stacked components
11/16/2004	US6819561 Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same
11/16/2004	US6819542 Interdigitated capacitor structure for an integrated circuit
11/16/2004	US6819426 Overlay alignment metrology using diffraction gratings
11/16/2004	US6819161 Structure for temporarily isolating a die from a common conductor to facilitate wafer level testing
11/16/2004	US6819160 Self-timed and self-tested fuse blow
11/16/2004	US6819128 Latch locking mechanism of a KGD carrier
11/16/2004	US6819003 Recessed encapsulated microelectronic devices and methods for formation
11/16/2004	US6819002 Between a bonding pad on a chip and a solder bump made with tin-based material, adhesion layer, a nickel-vanadium layer, wettable layer, barrier layer
11/16/2004	US6819001 Interposer, interposer package and device assembly employing the same
11/16/2004	US6819000 High density area array solder microjoining interconnect structure and fabrication method
11/16/2004	US6818999 Semiconductor device having multiple semiconductor chips in a single package
11/16/2004	US6818998 Stacked chip package having upper chip provided with trenches and method of manufacturing the same
11/16/2004	US6818996 Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps
11/16/2004	US6818992 Self-aligned copper silicide formation for improved adhesion/electromigration
11/16/2004	US6818991 Copper-alloy interconnection layer
11/16/2004	US6818990 Fluorine diffusion barriers for fluorinated dielectrics in integrated circuits
11/16/2004	US6818989 BGA type semiconductor device, tape carrier for semiconductor device, and semiconductor device using said tape carrier
11/16/2004	US6818988 Packaging
11/16/2004	US6818987 Electronic component and process for manufacturing the same
11/16/2004	US6818986 Semiconductor device and method of inspecting the same
11/16/2004	US6818985 Embedded antenna and semiconductor die on a substrate in a laminate package
11/16/2004	US6818983 Semiconductor memory chip and semiconductor memory device using the same
11/16/2004	US6818982 Heat dissipation type semiconductor package and method of fabricating the same
11/16/2004	US6818981 Heat spreader interconnect for thermally enhanced PBGA packages
11/16/2004	US6818979 High-frequency semiconductor device
11/16/2004	US6818978 Ball grid array package with shielding
11/16/2004	US6818977 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages
11/16/2004	US6818976 Bumped chip carrier package using lead frame
11/16/2004	US6818974 Semiconductor device
11/16/2004	US6818973 Integrated circuit chip package, creating exposed leads in a cost-effective manner.
11/16/2004	US6818972 Reduction of chip carrier flexing during thermal cycling
11/16/2004	US6818971 Lead frame for resin-molded semiconductor device
11/16/2004	US6818970 Leadless leadframe package design that provides a greater structural integrity
11/16/2004	US6818969 Semiconductor device
11/16/2004	US6818968 Integrated circuit package and process for forming the same
11/16/2004	US6818958 Semiconductor device and process for its manufacture to increase threshold voltage stability
11/16/2004	US6818957 Semiconductor chip with fuse unit
11/16/2004	US6818955 Electrostatic discharge protection
11/16/2004	US6818920 Integrated circuit provided with a substrate and memory transponder
11/16/2004	US6818840 Method for manufacturing raised electrical contact pattern of controlled geometry
11/16/2004	US6818836 Printed circuit board and its manufacturing method
11/16/2004	US6818817 Heat dissipating silicon-on-insulator structures
11/16/2004	US6818702 Thermosetting resin composition and flexible circuit overcoating material comprising the same
11/16/2004	US6818574 Jointed body of glass-ceramic and aluminum nitride sintered compact and method for producing the same
11/16/2004	US6818554 Method for fabricating a semiconductor device having a metallic silicide layer
11/16/2004	US6818552 Method for eliminating reaction between photoresist and OSG
11/16/2004	US6818546 Semiconductor integrated circuit device and a method of manufacturing the same
11/16/2004	US6818545 Low fabrication cost, fine pitch and high reliability solder bump
11/16/2004	US6818544 Compliant, solderable input/output bump structures
11/16/2004	US6818542 Tape circuit board and semiconductor chip package including the same
11/16/2004	US6818541 Metal bonding method for semiconductor circuit components employing prescribed feeds of metal balls
11/16/2004	US6818540 Fine pitch system and method for reinforcing bond pads in semiconductor devices
11/16/2004	US6818539 Semiconductor devices and methods of fabricating the same
11/16/2004	US6818538 Ball grid array semiconductor package and method of fabricating the same
11/16/2004	US6818537 Method of manufacturing a contact plug for a semiconductor device
11/16/2004	US6818524 Method of improving alignment for semiconductor fabrication

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