H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2004
11/18/2004	US20040228095 Heat sink mounting assembly
11/18/2004	US20040228094 Dual power module power system architecture
11/18/2004	US20040228092 Electronic apparatus
11/18/2004	US20040228088 Liquid cooling system and personal computer using the same
11/18/2004	US20040227848 Digital image capturing module assembly and method of fabricating the same
11/18/2004	US20040227612 Rectangular contact used as a low voltage fuse element
11/18/2004	US20040227610 High frequency inductor having low inductance and low inductance variation and method of manufacturing the same
11/18/2004	US20040227547 Semiconductor device and power supply system
11/18/2004	US20040227476 Flexible inverter power module for motor drives
11/18/2004	US20040227260 Semiconductor device using fuse/anti-fuse system and method of manufacturing the same
11/18/2004	US20040227259 Substrate for semiconductor device, semiconductor chip mounting substrate, semiconductor device and method of fabrication thereof, and circuit board, together with electronic equipment
11/18/2004	US20040227258 Electronic component packaging structure and method for producing the same
11/18/2004	US20040227257 Semiconductor component and method for bonding said semiconductor component
11/18/2004	US20040227256 Semiconductor device and production method therefor
11/18/2004	US20040227255 Liquid epoxy resin composition and flip chip semiconductor device
11/18/2004	US20040227254 Semiconductor integrated circuit device and method of manufacturing the same
11/18/2004	US20040227253 Flip chip package, circuit board thereof and packaging method thereof
11/18/2004	US20040227251 Semiconductor device and method for fabricating semiconductor device
11/18/2004	US20040227250 Semiconductor component having stacked, encapsulated dice
11/18/2004	US20040227249 Fluxless die-to-heat spreader bonding using thermal interface material
11/18/2004	US20040227246 Semiconductor device
11/18/2004	US20040227245 Integrated circuits with openings that allow electrical contact to conductive features having self-aligned edges
11/18/2004	US20040227242 Semiconductor device and manufacturing method thereof
11/18/2004	US20040227241 Semiconductor device and method of manufacturing the same
11/18/2004	US20040227240 Semiconductor component having encapsulated die stack
11/18/2004	US20040227239 Wiring board
11/18/2004	US20040227238 Electronic device and method of manufacturing the same, circuit board, and electronic instrument
11/18/2004	US20040227237 Semiconductor apparatus and method of manufactuing the same
11/18/2004	US20040227236 Semiconductor device, electronic device, electronic apparatus, and methods for manufacturing carrier substrate, semiconductor device, and electronic device
11/18/2004	US20040227235 Electronic device and method of manufacturing the same, circuit board, and electronic instrument
11/18/2004	US20040227234 Flash-preventing window ball grid array semiconductor package, method for fabricating the same, and chip carrier used in the semiconductor package
11/18/2004	US20040227233 Interconnection pattern design
11/18/2004	US20040227231 Power module with voltage overshoot limiting
11/18/2004	US20040227230 Heat spreaders
11/18/2004	US20040227229 Fluxless die-to-heat spreader bonding using thermal interface material
11/18/2004	US20040227227 Aerosol deposition process
11/18/2004	US20040227226 Structure of multi-tier wire bonding for high frequency integrated circuits and method of layout for the same
11/18/2004	US20040227225 Microelectronic assemblies having compliant layers
11/18/2004	US20040227224 Mounting structure of semiconductor device and mounting method thereof
11/18/2004	US20040227223 Semiconductor device, electronic device, electronic apparatus, and methods for manufacturing semiconductor device and electronic device
11/18/2004	US20040227222 Stacked semiconductor package
11/18/2004	US20040227221 Method and apparatus for electrostatically aligning integrated circuits
11/18/2004	US20040227220 Semiconductor package and structure thereof
11/18/2004	US20040227218 Semiconductor package having flex circuit with external contacts
11/18/2004	US20040227217 Semiconductor package having improved adhesiveness and ground bonding
11/18/2004	US20040227216 Flex resistant semiconductor die pad, leadframe, and package
11/18/2004	US20040227215 Circuit and method for trimming locking of integrated circuits
11/18/2004	US20040227214 Method and apparatus of stress relief in semiconductor structures
11/18/2004	US20040227212 Making contact with the emitter contact of a semiconductor
11/18/2004	US20040227209 MOS antifuse with low post-program resistance
11/18/2004	US20040227190 ESD protection for semiconductor products
11/18/2004	US20040227189 Semiconductor device
11/18/2004	US20040227168 Single semiconductor element in a flip chip construction
11/18/2004	US20040227163 Semiconductor device
11/18/2004	US20040227161 Semiconductor integrated circuit device and wiring arranging method thereof
11/18/2004	US20040227156 Surface mounted power supply circuit apparatus and method for manufacturing it
11/18/2004	US20040227138 Diamondoid-containing capacitors
11/18/2004	US20040226929 Method for fixing functional material apparatus for fixing functional material, device fabrication method, electrooptical device, and electronic equipment
11/18/2004	US20040226828 electroplating multiple electrodes; electrically connecting electrodes via plating wires; activation; sealing with resin
11/18/2004	US20040226743 Bumpless assembly package
11/18/2004	US20040226741 Package for electronic device, base substrate, electronic device and fabrication method thereof
11/18/2004	US20040226735 Method and apparatus for integrated noise decoupling
11/18/2004	US20040226697 Heat-dissipating module
11/18/2004	US20040226691 Heat dissipation device
11/18/2004	US20040226690 Tubular heat dissipation device
11/18/2004	US20040226688 Application specific apparatus for dissipating heat from multiple electronic components
11/18/2004	DE202004013725U1 Heat dispersion system e.g. for computer, has heat exhaust device with upper and lower heat sinks which are fastened together with cooling chip embedded between two heat sinks
11/18/2004	DE202004012897U1 Metal heat sink for electronic components of computer, has one or more detachable fastenings for protective covers
11/18/2004	DE202004010376U1 Chip package used e.g. in flip-chip and wafer construction, includes metal plate at rear of chip, made of selected alloy having similar coefficient of thermal expansion to that of board
11/18/2004	DE202004009712U1 Heat sink has a base with a corrugated surface in which grooves are machined perpendicular to the projections from the base and with heat dissipation plates embedded in the grooves and clamped to each other
11/18/2004	DE20122278U1 Wafer for electronic chip manufacture has electronic chips and memory device with stored classification map with position and classification information for at least one part of chip
11/18/2004	DE19532195B4 Elektrische Widerstandszusammensetzung und elektrisches Widerstandsmaterial Electrical resistance and electrical resistance material composition
11/18/2004	DE10345982A1 Verfahren und Vorrichtung zur Minimierung von mikroskopischen und makroskopischen Ausrichtungsfehlern einer Mehrfachschicht Method and apparatus for minimizing microscopic and macroscopic alignment errors of a multiple layer
11/18/2004	DE10326804A1 Method for forming semiconductor chip(s) provides one or more independent semiconductor circuits on semiconductor wafer, with at least one conductive track, extending up to rim of semiconductor circuit
11/18/2004	DE10319661A1 Encapsulated micro-sensor for pressure measurement, has a current conductor within its chamber that has at least two voltage taps to permit determination of a gaseous medium thermodynamic value to detect leaks in the encapsulation
11/18/2004	DE10317182A1 Fastening device for an electronic component on an aluminum heat sink, has a bearing for a profiled spring's end to use compression force to lock onto the electronic component
11/18/2004	DE10317018A1 Multichipmodul mit mehreren Halbleiterchips sowie Leiterplatte mit mehreren Komponenten Multi-chip module with a plurality of semiconductor chips and printed circuit board with multiple components
11/18/2004	DE10316136A1 Gekapselte Leistungshalbleiteranordnung Encapsulated power semiconductor device
11/18/2004	DE10232051A1 Kühlkörper und Gleichrichterbaueinheit für eine elektrische Maschine Heat sink and rectifier unit for an electrical machine
11/18/2004	DE102004017182A1 Verfahren zur Fertigung eines Halbleiterwafers A method for manufacturing a semiconductor wafer
11/18/2004	DE102004014703A1 Wärmeverteilermodul und Verfahren zur Herstellung desselben Heat spreader module and method of manufacturing the same
11/17/2004	EP1478219A2 Cooling arrangement for a thyristor
11/17/2004	EP1478023A1 Module part
11/17/2004	EP1478022A1 Integrated circuit package marked with product tracking information
11/17/2004	EP1478021A1 Semiconductor device and manufacturing method thereof
11/17/2004	EP1478020A1 Streamline heat sink and method for manufacturing the heat sink
11/17/2004	EP1478019A1 Streamline heat sink and method for manufacturing the heat sink
11/17/2004	EP1478018A1 Metal shield for protecting a chip against damage
11/17/2004	EP1478017A1 Method for preparing gas-tight terminal
11/17/2004	EP1478015A2 Discrete semiconductor device with flip-chip arrangement
11/17/2004	EP1478014A1 Improved production method for QFN leadframes
11/17/2004	EP1477841A1 Liquid crystal display device and manufacturing method thereof
11/17/2004	EP1477762A2 Thermosyphon and method for producing it
11/17/2004	EP1477587A2 Improved tin plating method
11/17/2004	EP1477516A1 Static electricity preventing method and method using the method
11/17/2004	EP1477467A1 Composite material having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate
11/17/2004	EP1477048A1 Method for embedding a component in a base
11/17/2004	EP1476902A2 Electronic component with an adhesive layer and method for the production thereof
11/17/2004	EP1476500A1 Method of making a nanoporous film
11/17/2004	EP1476416A2 Multifunctional monomers and their use in making cross-linked polymers and porous films

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