H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2004
11/23/2004	US6822299 Boron-doped titanium nitride layer for high aspect ratio semiconductor devices
11/23/2004	US6822294 High holding voltage LVTSCR
11/23/2004	US6822282 Analog capacitor in dual damascene process
11/23/2004	US6822279 Semiconductor device and method of fabricating the same
11/23/2004	US6822263 Thin film transistor formed on a transparent substrate
11/23/2004	US6822260 Linewidth measurement structure with embedded scatterometry structure
11/23/2004	US6822170 Embedding resin and wiring substrate using the same
11/23/2004	US6822164 Semiconductor device and electro-optical device including the same
11/23/2004	US6822162 Microcircuit housing with sloped gasket
11/23/2004	US6821890 Method for improving adhesion to copper
11/23/2004	US6821889 Atomic layer deposition using a boron compound as a reducing agent.
11/23/2004	US6821888 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
11/23/2004	US6821886 IMP TiN barrier metal process
11/23/2004	US6821885 Semiconductor device and method for manufacturing the same
11/23/2004	US6821884 Method of fabricating a semiconductor device
11/23/2004	US6821882 Semiconductor device manufacturing method for improving adhesivity of copper metal layer to barrier layer
11/23/2004	US6821879 Copper interconnect by immersion/electroless plating in dual damascene process
11/23/2004	US6821878 Area-array device assembly with pre-applied underfill layers on printed wiring board
11/23/2004	US6821877 Method of fabricating metal interconnection of semiconductor device
11/23/2004	US6821876 Fabrication method of strengthening flip-chip solder bumps
11/23/2004	US6821874 Method for depositing tungsten silicide film and method for preparing gate electrode/wiring
11/23/2004	US6821867 Method for forming grooves in the scribe region to prevent a warp of a semiconductor substrate
11/23/2004	US6821826 Three dimensional CMOS integrated circuits having device layers built on different crystal oriented wafers
11/23/2004	US6821821 Methods for manufacturing resistors using a sacrificial layer
11/23/2004	US6821820 Lead frame manufacturing method
11/23/2004	US6821819 Method of packaging and assembling micro-fluidic device
11/23/2004	US6821818 Method of assembling a semiconductor device including sweeping (with a squeegee) encapsulant over the device repeatedly
11/23/2004	US6821817 Premolded cavity IC package
11/23/2004	US6821816 Relaxed tolerance flip chip assembly
11/23/2004	US6821815 Method of assembling a semiconductor chip package
11/23/2004	US6821814 Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package
11/23/2004	US6821812 Structure and method for mounting a small sample in an opening in a larger substrate
11/23/2004	US6821809 Solid state image pickup device and method of producing solid state image pickup device
11/23/2004	US6821791 Method for reworking metal layers on integrated circuit bond pads
11/23/2004	US6821657 Preheating a mixture of an epoxy resin, and organosilicon compound and water prior to adding a curing agent is effective to obtain a thermosetting resin composition which has a low viscosity at a room temperature
11/23/2004	US6821625 Thermal spreader using thermal conduits
11/23/2004	US6821617 Wafer and production thereof
11/23/2004	US6820797 System and method for seal formation
11/23/2004	US6820684 Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader
11/23/2004	US6820525 Precision Fiducial
11/23/2004	CA2447415A1 Active heat sink
11/23/2004	CA2277346C Aluminum nitride sintered body and method of preparing the same
11/18/2004	WO2004100630A1 Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the same
11/18/2004	WO2004100628A1 Electrical element comprising lines made of carbonated plastic, and method and device for the production thereof
11/18/2004	WO2004100623A2 Electronic system comprising slots for any possible excess fusible material, and corresponding assembly method
11/18/2004	WO2004100473A2 Signal isolators using micro-transformers
11/18/2004	WO2004100271A1 Programmable semiconductor device
11/18/2004	WO2004100264A1 Module including circuit elements
11/18/2004	WO2004100263A2 Packaging of an integrated circuit with internal impedance matching
11/18/2004	WO2004100262A1 Cooling part, substrate, and electronic equipment
11/18/2004	WO2004100261A2 Semiconductor wafer, panel and electronic component comprising stacked semiconductor chips, and method for the production thereof
11/18/2004	WO2004100260A1 High-density multi-layered printed wiring board, multi-chip carrier, and semiconductor package
11/18/2004	WO2004100259A2 Semi-conductor component and method for the production of a semi-conductor component
11/18/2004	WO2004100258A2 Ribbon bonding
11/18/2004	WO2004100257A1 Method to form selective cap layers on metal features with narrow spaces
11/18/2004	WO2004100255A1 Method of making a low profile packaged semiconductor device
11/18/2004	WO2004100253A2 Electronic component as well as system support and panel for the production thereof
11/18/2004	WO2004100227A2 Application specific heat-dissipating apparatus that provides electrical isolation for components
11/18/2004	WO2004100219A2 Electronic component packaging
11/18/2004	WO2004100179A1 Insulated conductive ball for anisotropic conductive connection, method of preparing the same, and product using the same
11/18/2004	WO2004100169A2 Mram architecture with a bit line located underneath the magnetic tunneling junction device
11/18/2004	WO2004099960A1 Fully integrated dc-dc converter utilizing on-chip high frequency inductors
11/18/2004	WO2004099296A1 Nanoporous materials suitable for use in semiconductors
11/18/2004	WO2004099065A1 Vacuum package fabrication of integrated circuit components
11/18/2004	WO2004098803A1 Fly ash powder, method for producing the same, and resin composition for sealing semiconductor using the same, and semiconductor device
11/18/2004	WO2004098745A1 Method of crystallizing organic oligomer, epoxy resin composition containing organic oligomer obtained by the method and epoxy resin cured material
11/18/2004	WO2004086826A3 Esd dissipative structural components
11/18/2004	WO2004070790A3 Molded high density electronic packaging structure for high performance applications
11/18/2004	WO2004055891A9 Semiconductor device and stacked semiconductor device
11/18/2004	US20040230396 Method and apparatus for monitoring integrated circuit fabrication
11/18/2004	US20040229500 Method for assembling semiconductor device socket
11/18/2004	US20040229471 Periodic patterns and technique to control misalignment between two layers
11/18/2004	US20040229457 Method to fill a trench and tunnel by using ALD seed layer and electroless plating
11/18/2004	US20040229455 Advanced VLSI metallization
11/18/2004	US20040229454 Process for fabricating an integrated electronic circuit that incorporates air gaps
11/18/2004	US20040229446 Method of production of semiconductor device
11/18/2004	US20040229445 Manufacturing method of semiconductor device
11/18/2004	US20040229443 Structures, materials and methods for fabrication of nanostructures by transposed split of ion cut materials
11/18/2004	US20040229429 Semiconductor device and method of fabricating the same
11/18/2004	US20040229425 Semiconductor device and bump formation method
11/18/2004	US20040229423 Electrode structure for use in an integrated circuit
11/18/2004	US20040229418 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument
11/18/2004	US20040229405 Electrical die contact structure and fabrication method
11/18/2004	US20040229404 Semiconductor encapsulant resin having an additive with a gradient concentration
11/18/2004	US20040229403 Die stacking scheme
11/18/2004	US20040229402 Low profile chip scale stacking system and method
11/18/2004	US20040229401 Method for fabricating semiconductor component having stacked, encapsulated dice
11/18/2004	US20040229400 Multichip wafer level system packages and methods of forming same
11/18/2004	US20040229399 [flip chip package and manufacturing method thereof]
11/18/2004	US20040229397 Semiconductor package having grooves formed at side flash, groove forming method, and deflashing method using semiconductor package formed with grooves
11/18/2004	US20040229396 Multilayer flip-chip substrate interconnect layout
11/18/2004	US20040229389 Manufacturing method of semiconductor device
11/18/2004	US20040229388 Sensitive test structure for assessing pattern anomalies
11/18/2004	US20040229168 Method of fabricating a poly fuse
11/18/2004	US20040229118 Card with embedded IC and electrochemical cell
11/18/2004	US20040228964 Liquid drop supplying means is scanned; liquid crystal displays
11/18/2004	US20040228569 Product management method, program for performing product management, and storage medium having recorded the program therein
11/18/2004	US20040228186 Analysis method for semiconductor device, analysis system and a computer program product
11/18/2004	US20040228097 Construction for high density power module package
11/18/2004	US20040228096 Printed circuit board with improved cooling of electrical component

1 ... 1445 1446 1447 1448 1449 1450 1451 1452 1453 1454 1455 1456 1457 1458 1459 1460 1461 1462 1463 1464 1465 ... 2262