H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2004
11/24/2004	EP1480267A2 Integrated electronic component
11/24/2004	EP1480264A1 Electrical circuit device
11/24/2004	EP1480234A2 Integrated circuit inductor with integrated vias
11/24/2004	EP1479161A1 Mems-based, computer systems, clock generation and oscillator circuits and lc-tank apparatus for use therein
11/24/2004	EP1479106A2 Fuse structure programming by electromigration of silicide enhanced by creating temperature gradient
11/24/2004	EP1478674A1 Low-corrosive epoxy resins and production method therefor
11/24/2004	EP1226604A4 Fabrication process of a semiconductor device
11/24/2004	EP1200509B1 Composites of powdered fillers and polymer matrix and process for preparing them
11/24/2004	EP1190448A4 Chip package with molded underfill
11/24/2004	EP1019962B1 Method for encapsulating a silicon chip and electronic card comprising at least one chip coated by such method
11/24/2004	EP0710430B1 Processing low dielectric constant materials for high speed electronics
11/24/2004	CN2659095Y Radiating fin
11/24/2004	CN2659094Y Fastener
11/24/2004	CN2658947Y Water cooling type computer heat sink
11/24/2004	CN2658946Y Double heat radiation device
11/24/2004	CN2658945Y Twin fan heat sink
11/24/2004	CN2658944Y Heat sink
11/24/2004	CN2658943Y Improved structure of heat-transfer plate
11/24/2004	CN2658942Y Net-shaped laminated heat sink
11/24/2004	CN2658941Y Electron assembly radiation module
11/24/2004	CN2658940Y Electron assembly radiation module
11/24/2004	CN2658939Y Input/output structure and integrated circuit using said structure
11/24/2004	CN2658824Y Noise control and heat sink integrated structure of computer internal system
11/24/2004	CN2658823Y Water cooling type heat sink applied on computer interface card
11/24/2004	CN1550045A Method of depositing an oxide layer on a substrate and a photovoltaic cell using said substrate
11/24/2004	CN1550038A Making contact with the emitter contact of a semiconductor
11/24/2004	CN1550030A Elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
11/24/2004	CN1549676A Radiating body forming method and structure
11/24/2004	CN1549344A Electrostatic discharge protection element and producing method thereof
11/24/2004	CN1549343A Electrostatic discharge protection element and electronic device with thick diaphragm polysilicon and producing method thereof
11/24/2004	CN1549342A Character line interface point arranging structure
11/24/2004	CN1549341A Non pin semiconductor package parts and production process constituted with conducting wire frame
11/24/2004	CN1549340A Semiconductor device having pad
11/24/2004	CN1549339A Functional module with built-in radiating fin
11/24/2004	CN1549338A Functional module with built-in flat plate type radiating element
11/24/2004	CN1549337A Radiating fin device for preventing radiating fin glue spilling in semi conductor packaging parts
11/24/2004	CN1549336A Wiring board, semiconductor device having wiring board and manufacturing method thereof and packaging method
11/24/2004	CN1549319A Open-window type ball grid array semiconductor packaging elements and its producing method and used chip bearing elements
11/24/2004	CN1549317A Device having resin package and method of producing the same
11/24/2004	CN1549306A Self-aligned contact/borderless contact opening and method for forming same
11/24/2004	CN1549305A Semiconductor element and its producing method, semiconductor
11/24/2004	CN1549080A Ring radiating fin module group
11/24/2004	CN1549079A Repeatedly bend heat conducting & radiating module group with flexible pivot
11/24/2004	CN1177518C Heat sink fastening for electronic assembly and electronic assembly and its assembling method
11/24/2004	CN1177517C Manufacture of multi-layered ceramic substrate
11/24/2004	CN1177516C Heat radiator assembly and its assembling method
11/24/2004	CN1177374C Thin film transistor substrate and its producing method
11/24/2004	CN1177368C 半导体器件 Semiconductor devices
11/24/2004	CN1177366C Mixed fuse technique
11/24/2004	CN1177364C Device for electronic packaging and pin jig fixture
11/24/2004	CN1177363C Gate electrode device body of electric power electronic power device
11/24/2004	CN1177362C Radiating structure of integrated circuit (IC)
11/24/2004	CN1177358C Semiconductor device chip scale surface assembling and packaging, and mfg. method therefor
11/24/2004	CN1177255C Flexible printed board
11/23/2004	US6822921 Semiconductor device having semiconductor memory
11/23/2004	US6822880 Multilayer thin film hydrogen getter and internal signal EMI shield for complex three dimensional electronic package components
11/23/2004	US6822875 Assembly of opto-electronic module with improved heat sink
11/23/2004	US6822870 Retaining apparatus
11/23/2004	US6822869 Fastening device
11/23/2004	US6822868 Heat sink with integrated electronics
11/23/2004	US6822867 Electronic assembly with solderable heat sink and methods of manufacture
11/23/2004	US6822865 Cooling device for semiconductor modules
11/23/2004	US6822864 Heat-dissipating assembly and securing device used therein
11/23/2004	US6822862 Apparatus and method for heat sink
11/23/2004	US6822861 Active cooling system for CPU and semiconductors also enabling thermal acceleration
11/23/2004	US6822850 Laminated bus bar for use with a power conversion configuration
11/23/2004	US6822541 Electromagnetic wave absorber and high-frequency circuit package using the same
11/23/2004	US6822529 Integrated circuit interconnect system
11/23/2004	US6822473 Determination of permeability of layer material within interconnect
11/23/2004	US6822472 Detection of hard mask remaining on a surface of an insulating layer
11/23/2004	US6822437 Interconnect test structure with slotted feeder lines to prevent stress-induced voids
11/23/2004	US6822430 Method of assessing lateral dopant and/or charge carrier profiles
11/23/2004	US6822399 Half-bridge circuit
11/23/2004	US6822345 Chip/package resonance damping using controlled package series resistance
11/23/2004	US6822341 Latent catalysts for molding compounds
11/23/2004	US6822340 Low capacitance coupling wire bonded semiconductor device
11/23/2004	US6822339 Semiconductor device
11/23/2004	US6822338 Wiring structure of semiconductor device
11/23/2004	US6822337 Window-type ball grid array semiconductor package
11/23/2004	US6822336 Semiconductor device
11/23/2004	US6822334 Semiconductor device having a layered wiring structure with hard mask covering
11/23/2004	US6822333 Methods of filling constrained spaces with insulating materials and/or of forming contact holes and/or contacts in an integrated circuit
11/23/2004	US6822331 Electrical circuit assembly having components bonded together with electrically conductive joint structure comprising flexible mesh infiltrated by solder material; solder-free portion of mesh extends outside of joint, forming jumper
11/23/2004	US6822330 Semiconductor integrated circuit device with test element group circuit
11/23/2004	US6822329 Integrated circuit connecting pad
11/23/2004	US6822327 Flip-chip interconnected with increased current-carrying capability
11/23/2004	US6822326 Wafer bonding hermetic encapsulation
11/23/2004	US6822325 Isolating temperature sensitive components from heat sources in integrated circuits
11/23/2004	US6822324 Wafer-level package with a cavity and fabricating method thereof
11/23/2004	US6822323 Semiconductor package having more reliable electrical conductive patterns
11/23/2004	US6822322 Substrate for mounting a semiconductor chip and method for manufacturing a semiconductor device
11/23/2004	US6822321 Packaged RF power transistor having RF bypassing/output matching network
11/23/2004	US6822320 Microelectronic connection components utilizing conductive cores and polymeric coatings
11/23/2004	US6822319 Leadframe including die attach pad for mounting semiconductor die; plurality of contacts circumscribing pad; silver plating on portion of pad around periphery; layer of organometallic complexes on portions of pad not covered by silver plating
11/23/2004	US6822318 Stress isolating die attach structure and method
11/23/2004	US6822317 Semiconductor apparatus including insulating layer having a protrusive portion
11/23/2004	US6822316 Integrated circuit with improved interconnect structure and process for making same
11/23/2004	US6822315 Apparatus and method for scribing semiconductor wafers using vision recognition
11/23/2004	US6822310 Semiconductor integrated circuit
11/23/2004	US6822309 Apparatus for selectively cutting fuse electrodes

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