H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2004
11/30/2004	US6825558 Carrier module for μ-BGA type device
11/30/2004	US6825557 Localized backside chip cooling with integrated smart valves
11/30/2004	US6825556 Integrated circuit package design with non-orthogonal die cut out
11/30/2004	US6825554 PBGA electrical noise isolation of signal traces
11/30/2004	US6825553 Multichip wafer level packages and computing systems incorporating same
11/30/2004	US6825552 Connection components with anisotropic conductive material interconnection
11/30/2004	US6825551 Method for packaging a semiconductor chip containing sensors and resulting package
11/30/2004	US6825550 Board-on-chip packages with conductive foil on the chip surface
11/30/2004	US6825549 Electronic component with external flat conductors and a method for producing the electronic component
11/30/2004	US6825548 Semiconductor device
11/30/2004	US6825547 Semiconductor device including edge bond pads
11/30/2004	US6825541 Bump pad design for flip chip bumping
11/30/2004	US6825512 Preparing active part comprising wafer provided with conductive connection pads on one face and the base being provided with conductive pins, electrolytic deposition of conductive metal on the pin; oxidation, nitrizing
11/30/2004	US6825511 Semiconductor device having fuse circuit on cell region and method of fabricating the same
11/30/2004	US6825509 Power distribution system, method, and layout for an electronic device
11/30/2004	US6825249 Epoxy, silicone, acrylic or polyimide resin films; noncracking; void-free; accuracy
11/30/2004	US6825132 Manufacturing method of semiconductor device including an insulation film on a conductive layer
11/30/2004	US6825114 Selective stress-inducing implant and resulting pattern distortion in amorphous carbon patterning
11/30/2004	US6825113 Asymmetric, double-sided self-aligned silicide and method of forming the same
11/30/2004	US6825112 Semiconductor device and method of production thereof
11/30/2004	US6825108 Ball grid array package fabrication with IC die support structures
11/30/2004	US6825098 Method for fabricating microstructures and arrangement of microstructures
11/30/2004	US6825096 Method of forming an alignment mark structure using standard process steps for forming vertical gate transistors
11/30/2004	US6825075 Method of fabricating MIM capacitor with the encapsulated metal structure serving as the lower plate
11/30/2004	US6825067 Mold cap anchoring method for molded flex BGA packages
11/30/2004	US6825066 Stiffener design
11/30/2004	US6825063 Integrated core microelectronic package
11/30/2004	US6825062 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
11/30/2004	US6825053 Test key and method for validating the position of a word line overlaying a trench capacitor in DRAMS
11/30/2004	US6825052 Test assembly including a test die for testing a semiconductor product die
11/30/2004	US6824411 Socket for electrical parts
11/30/2004	US6824395 Semiconductor device-socket
11/30/2004	US6824315 Optical module
11/30/2004	US6823915 Heat-conducting adhesive joint with an adhesive-filled, porous heat conductor
11/25/2004	WO2004103047A1 High efficient heat dissipating module and method of manufacture
11/25/2004	WO2004103039A1 Double-sided wiring board, double-sided wiring board manufacturing method, and multilayer wiring board
11/25/2004	WO2004102771A1 Cooling fan and cooling fan assembly
11/25/2004	WO2004102665A1 High-density circuits that include inductors
11/25/2004	WO2004102663A1 Semiconductor chip mounting body and manufacturing method thereof
11/25/2004	WO2004102662A1 Microelectronic security coatings
11/25/2004	WO2004102661A1 Interconnection pattern design
11/25/2004	WO2004102660A2 Thermal management materials
11/25/2004	WO2004102659A2 Composite material, electrical circuit or electric module
11/25/2004	WO2004102656A1 Method of stress relief in semiconductor structures
11/25/2004	WO2004102653A1 Semiconductor device and interposer
11/25/2004	WO2004102649A1 Film forming method and apparatus
11/25/2004	WO2004102643A2 Contact opening metrology
11/25/2004	WO2004102619A2 Chemical vapor deposition epitaxial growth
11/25/2004	WO2004102618A2 Card with embedded ic and electrochemical cell
11/25/2004	WO2004101849A1 Surface treating agent for tin or tin alloy material
11/25/2004	WO2004101678A1 Resin composition for thermally conductive material and thermally conductive material
11/25/2004	WO2004101643A1 Epoxy resin, method for producing same and epoxy resin composition
11/25/2004	WO2004086202B1 A security housing for a circuit
11/25/2004	WO2004077499A3 Method for integration of single and dual gate logic into one mask set
11/25/2004	WO2004064160A3 Two-stage etching process for producing an integrated circuit arrangement, in particular comprising a capacitor assembly, in addition to an integrated circuit arrangement
11/25/2004	WO2004064144A3 Semiconductor packaging with a partially prepatterned lead frame and method of manufacturing the same
11/25/2004	WO2003025255A3 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
11/25/2004	US20040237060 Integrated circuit device, clock layout system, clock layout method, and clock layout program
11/25/2004	US20040236583 Audio signal processing apparatus
11/25/2004	US20040236200 Analyte monitoring device and methods of use
11/25/2004	US20040235996 Thermoplastic polymer or thermosetting resin (particulary an epoxy) and a catalyst, and optionally a phenoxy-containing compound; expandable filler(s); solvent; expands with heat to form a closed-cell foam structure used to apply chip scale packages to electronic components
11/25/2004	US20040235971 Using polysiloxane comprised of such as methyltrimethoxysilane and tetramethoxysilane; adhesion, uniformity, mechanical strength, reduced moisture absorption
11/25/2004	US20040235314 Method of manufacturing semiconductor device having nitride film with improved insulating properties
11/25/2004	US20040235310 Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring units
11/25/2004	US20040235298 Plating solution, semiconductor device and method for manufacturing the same
11/25/2004	US20040235291 Very low dielectric constant plasma-enhanced CVD films
11/25/2004	US20040235290 Semiconductor device with tapered contact hole and wire groove
11/25/2004	US20040235289 Semiconductor integrated circuit device and method for making the same
11/25/2004	US20040235287 Method of manufacturing semiconductor package and method of manufacturing semiconductor device
11/25/2004	US20040235286 Method of depositing an oxide layer on a substrate and a photovoltaic cell using said substrate
11/25/2004	US20040235279 Method of fabricating polycrystalline silicon and switching device using polycrystalline silicon
11/25/2004	US20040235272 Scribe street width reduction by deep trench and shallow saw cut
11/25/2004	US20040235271 Manufacture of wafer level semiconductor device with quality markings on the sealing resin
11/25/2004	US20040235270 Method of manufacturing semiconductor device
11/25/2004	US20040235242 Methods of forming capacitor constructions
11/25/2004	US20040235241 Method of manufacturing semiconductor device having capacitor
11/25/2004	US20040235237 Semiconductor device and method for manufacturing the same
11/25/2004	US20040235234 Semiconductor device and method of manufacturing the same
11/25/2004	US20040235223 Bond pad scheme for cu process
11/25/2004	US20040235222 Integrated circuit stacking system and method
11/25/2004	US20040235221 Electronic device and method for manufacturing the same
11/25/2004	US20040235220 Flip chip mounting method
11/25/2004	US20040235219 Plating apparatus, plating method, and method for manufacturing semiconductor device
11/25/2004	US20040235218 Method for producing miniature amplifier and signal processing unit
11/25/2004	US20040235203 Monitoring of nitrided oxide gate dielectrics by determination of a wet etch
11/25/2004	US20040234779 Fluorinated aromatic precursors
11/25/2004	US20040234766 Coating a light emitting device with an encapsulation material containing a nanometer inorganic powder and polymer, solidifying to form a waterproof protective coatings; reinforcing by strong bond formation between the nano powder and polymer matrix
11/25/2004	US20040234726 Material consisting of a polyurethane gel, production method and uses thereof
11/25/2004	US20040234704 Carbiding, nitriding, carbonitriding, metallization; atomic- or chemical vapor deposition of nitrides, carbides, carbonitrides, metal silicon nitrides or carbides from organometallic compounds; adhesion promoter comprising compound of nitrogen, silicon, and/or carbon
11/25/2004	US20040234679 Self-aligned corrosion stop for copper C4 and wirebond
11/25/2004	US20040234378 Method and apparatus for low-cost electrokinetic pump manufacturing
11/25/2004	US20040234374 Axial fan for computer
11/25/2004	US20040233768 Programmable fuse device
11/25/2004	US20040233649 Electronic chip and electronic chip assembly
11/25/2004	US20040233648 Electronic component module
11/25/2004	US20040233647 Integrated electronic component
11/25/2004	US20040233642 Heat dissipation structure
11/25/2004	US20040233641 Processor/memory module with foldable substrate
11/25/2004	US20040233640 Electronic control unit
11/25/2004	US20040233638 Improvements in grounding and thermal dissipation for integrated circuit packages

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