H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2004
12/01/2004	EP1482572A1 Method of manufacturing a laminated structure, laminated structure, display device and display unit with laminated structure
12/01/2004	EP1482553A2 Semiconductor device and manufacturing method thereof
12/01/2004	EP1482552A2 Semiconductor device and manufacturing method thereof
12/01/2004	EP1482550A2 Low dielectric constant insulating film and method of forming the same
12/01/2004	EP1482396A2 Cooling system for a portable computer
12/01/2004	EP1482314A1 Microelectronic spring contact element
12/01/2004	EP1482291A1 Electronic device and pressure sensor
12/01/2004	EP1481422A2 Multi-row leadframe
12/01/2004	EP1481421A2 Semiconductor package device and method of formation and testing
12/01/2004	EP1481420A1 B-stageable underfill encapsulant and method for its application
12/01/2004	EP1481419A1 Underfill encapsulant for wafer packaging and method for its application
12/01/2004	EP1352185B1 Hydraulic motor-vehicle gearbox control device with a plastic hydraulic distribution plate and conductors integrated therein
12/01/2004	EP1259566B1 Thermosetting resin composition
12/01/2004	EP1042802B1 Semiconductor processing method comprising the fabrication of a barrier layer
12/01/2004	EP0998757B1 Integrated circuit and method for the production thereof
12/01/2004	CN2660684Y Radiating fin set
12/01/2004	CN2660683Y Special mounting assembly for radiator
12/01/2004	CN1552099A Modular component
12/01/2004	CN1552098A 半导体器件和电压调节器 The semiconductor device and the voltage regulator
12/01/2004	CN1552096A Method of forming copper interconnect capping layers with improved interface and adhesion
12/01/2004	CN1552094A Method and apparatus for processing organosiloxane film
12/01/2004	CN1552078A Interface materials and methods of production and use thereof
12/01/2004	CN1551820A Sealing material tablet, method of manufacturing the tablet, and electronic component device
12/01/2004	CN1551725A Streamline heat sink and method for manufacturing the heat sink
12/01/2004	CN1551724A Thermosyphon and method for producing it
12/01/2004	CN1551720A Multilayer ceramic device
12/01/2004	CN1551716A Method of forming composite insulating layer and process of producing wiring board
12/01/2004	CN1551714A Method for improving mechanical property of module device for chip upper board
12/01/2004	CN1551708A Multi-layer wiring board
12/01/2004	CN1551619A Solid-state imaging device, camera module, and camera-module manufacturing method
12/01/2004	CN1551500A Duplexer using surface acoustic wave filters and electronic device equipped with the same
12/01/2004	CN1551468A Surface mounted power supply circuit apparatus and method for manufacturing it
12/01/2004	CN1551353A Semiconductor device comprising metal interconnecting and metal resistor and its manufacturing method
12/01/2004	CN1551350A Semiconductor device
12/01/2004	CN1551349A Semiconductor device packaging
12/01/2004	CN1551348A Semiconductor integrated circuit device and audio appliance employing it
12/01/2004	CN1551347A 半导体装置及其制造方法 Semiconductor device and manufacturing method
12/01/2004	CN1551346A Method to generate porous organic dielectric
12/01/2004	CN1551345A Single semiconductor element in a flip chip construction
12/01/2004	CN1551344A Semiconductor device and stacked semiconductor devcie and their manufacturing method
12/01/2004	CN1551343A Electronic component packaging structure and method for producing the same
12/01/2004	CN1551342A Semiconductor device and power supply system
12/01/2004	CN1551341A Semiconductor device, electronic device,electronic machine and method for manufacturing semiconductor device
12/01/2004	CN1551340A Semiconductor device and its manufacturing method
12/01/2004	CN1551339A Thermal management device or heat sink manufactured from conductive loaded resin-based materials
12/01/2004	CN1551338A Method for manufacturing semiconductor package and method for manufacturing semiconductor
12/01/2004	CN1551337A Semiconductor device and its manufacturing method
12/01/2004	CN1551329A 半导体装置 Semiconductor device
12/01/2004	CN1551324A Semiconductor device and method for evaluating characteristics of the same
12/01/2004	CN1551319A Method of production of semiconductor device
12/01/2004	CN1551317A Semiconductor device manufacturing method and electronic device manufacturing method
12/01/2004	CN1551316A 电子电路装置 Electronic circuit means
12/01/2004	CN1551315A Semiconductor device, adhesive and adhesive film
12/01/2004	CN1551314A Semiconductor package and cutting groove forming method and flash eleminating method thereof
12/01/2004	CN1551313A Semiconductor device and stacked semiconductor device and its manufacturing method
12/01/2004	CN1551312A Method for manfacturing semiconductor chip, semiconductor device manufacturing method, semiconductor chip and semiconductor device
12/01/2004	CN1551308A Method for forming insulated membrane with improved insulating property
12/01/2004	CN1551307A Method for manufacturing semiconductor and method for cleaning plasma etching device
12/01/2004	CN1550869A Light source device and mfg. method and projection display device
12/01/2004	CN1550577A Improved tin plating method
12/01/2004	CN1178566C Multi-layer circuit plate and its mfg. method
12/01/2004	CN1178564C Wiring method and wiring device and IC card manufacturing method
12/01/2004	CN1178302C Metal-insulator-metal capacitor and method for producing same
12/01/2004	CN1178299C Semiconductor IC system
12/01/2004	CN1178298C Diode-triggered electrostatic discharge protection circuit
12/01/2004	CN1178297C Heat sink material and method of maufacturing the heat sink material
12/01/2004	CN1178296C Circuit board and its making method and high output module
12/01/2004	CN1178295C Crystal covered chip and crystal covered chip package substrate
12/01/2004	CN1178294C Electronic element
12/01/2004	CN1178287C Reworkable thermosetting resin composition
12/01/2004	CN1178271C A method and apparatus for transport and tracking of electronic component
12/01/2004	CN1178195C Liquid crystal display device
12/01/2004	CN1178066C Aging test socket
12/01/2004	CN1178065C Aging test socket
11/2004
11/30/2004	US6826742 Semiconductor device, designing method thereof, and recording medium storing semiconductor designing program
11/30/2004	US6826517 Method and apparatus for simulating manufacturing, electrical and physical characteristics of a semiconductor device
11/30/2004	US6826214 Device supporting apparatus
11/30/2004	US6826067 Double capacity stacked memory and fabrication method thereof
11/30/2004	US6826054 Heat sink clip assembly
11/30/2004	US6826053 Electronic device
11/30/2004	US6826052 Retaining assembly for heat sink
11/30/2004	US6826051 Clip for heat sink
11/30/2004	US6826050 Heat sink and electronic device with heat sink
11/30/2004	US6826049 Heat sink assembly with fan-driven fluid circulation
11/30/2004	US6826037 Electronic structure
11/30/2004	US6826031 Ceramic electronic component and production method therefor
11/30/2004	US6825900 Display apparatus
11/30/2004	US6825817 Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules
11/30/2004	US6825749 Symmetric crossover structure of two lines for RF integrated circuits
11/30/2004	US6825708 Apparatus and method for an offset-correcting sense amplifier
11/30/2004	US6825678 Wafer level interposer
11/30/2004	US6825572 Integrated circuit die connected and elevated; wire bonds connect pad on die to pads on substrates; support paste flows outward during connecting; encapsulation; semiconductors
11/30/2004	US6825571 Semiconductor device and its manufacturing method, a circuit board and an electronic device
11/30/2004	US6825569 BGA package having substrate with patterned solder mask defining open die attach area
11/30/2004	US6825568 Flip chip package structure and flip chip device with area bump
11/30/2004	US6825566 Semiconductor device with reduced interconnection capacity
11/30/2004	US6825564 Nickel layer contains phosphorus; wire-bonded; oxidation resistance; integrated and printed circuits; free of gold cap
11/30/2004	US6825563 Slotted bonding pad
11/30/2004	US6825561 Metallization line formed within a low-k dielectric material; hard mask layer; embedded dielectric cap; semiconductors
11/30/2004	US6825559 Group III nitride based flip-chip intergrated circuit and method for fabricating

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