H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2004
12/02/2004	US20040240182 Method of making split fin heat sink
12/02/2004	US20040240181 Heat dissipating apparatus
12/02/2004	US20040240180 Apparatus employing heat sink
12/02/2004	US20040240179 Cooling device and centrifugal pump to be used in the same device
12/02/2004	US20040240178 Cooling system for a portable computer
12/02/2004	US20040240176 Radiator structure for a computer device
12/02/2004	US20040240130 Semiconductor device having protection device for protecting internal device
12/02/2004	US20040240126 Planar inductive component and a planar transformer
12/02/2004	US20040239469 Embedded 3D coil inductors in a low temperature, co-fired ceramic substrate
12/02/2004	US20040239439 High frequency signal transmission structure
12/02/2004	US20040239278 Mounting structure of a switching element at a heat sink
12/02/2004	US20040239242 LIght-emitting unit and illuminator utilizing the same
12/02/2004	US20040238973 Semiconductor device having alignment post electrode and method of manufacturing the same
12/02/2004	US20040238971 Chip-scale package
12/02/2004	US20040238970 Electronic pckage with conductive pad capable of withstanding significant loads and information handling system utilizing same
12/02/2004	US20040238968 Semiconductor device and manufacturing method thereof
12/02/2004	US20040238967 Cap attach surface modification for improved adhesion
12/02/2004	US20040238966 Solder, microelectromechanical component and device, and a process for producing a component or device
12/02/2004	US20040238965 neighboring film (selected from rhodium, ruthenium, iridium or osmium) prevents voids due to electromigration of the platinum or copper
12/02/2004	US20040238964 Semiconductor device with interconnection structure for reducing stress migration
12/02/2004	US20040238963 Semiconductor device having structure for connecting interconnect lines
12/02/2004	US20040238962 Semiconductor device including metal interconnection and metal resistor and method of manufacturing the same
12/02/2004	US20040238961 Copper interconnect systems which use conductive, metal-based cap layers
12/02/2004	US20040238960 Interconnect integration
12/02/2004	US20040238959 Method and pattern for reducing interconnect failures
12/02/2004	US20040238958 Electrode structure for use in an integrated circuit
12/02/2004	US20040238957 Semiconductor components having multiple on board capacitors
12/02/2004	US20040238956 Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad
12/02/2004	US20040238955 Semiconductor device and method of fabricating the same
12/02/2004	US20040238954 Module component
12/02/2004	US20040238953 Built-up bump pad structure and method for same
12/02/2004	US20040238952 Asymmetric plating
12/02/2004	US20040238951 Semiconductor component
12/02/2004	US20040238950 Tunable low loss transmission lines
12/02/2004	US20040238949 Semiconductor package and method of production thereof
12/02/2004	US20040238947 Package and method for attaching an integrated heat spreader
12/02/2004	US20040238946 Heat spreader and semiconductor device and package using the same
12/02/2004	US20040238945 Thermally enhanced semiconductor package and fabrication method thereof
12/02/2004	US20040238944 Integrated heat spreader lid
12/02/2004	US20040238942 Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
12/02/2004	US20040238941 Semiconductor connection substrate
12/02/2004	US20040238940 Electronic device and pressure sensor
12/02/2004	US20040238939 Multi-power ring chip scale package for system level integration
12/02/2004	US20040238938 Substrate method and apparatus
12/02/2004	US20040238937 Semiconductor device and voltage regulator
12/02/2004	US20040238936 Through silicon via, folded flex microelectronic package
12/02/2004	US20040238935 Semiconductor device and method of manufacturing semiconductor device
12/02/2004	US20040238934 High-frequency chip packages
12/02/2004	US20040238932 Array printed circuit board
12/02/2004	US20040238931 Assemblies having stacked semiconductor chips and methods of making same
12/02/2004	US20040238929 Semiconductor device and method for fabricating the same
12/02/2004	US20040238928 Electronic component and package
12/02/2004	US20040238927 Method of manufacturing semiconductor device, semiconductor device, circuit substrate and electronic apparatus
12/02/2004	US20040238926 Semiconductor wafer, semiconductor device and method for manufacturing same, circuit board, and electronic apparatus
12/02/2004	US20040238925 Pre-applied thermoplastic reinforcement for electronic components
12/02/2004	US20040238924 Semiconductor package
12/02/2004	US20040238923 Surface-mount-enhanced lead frame and method for fabricating semiconductor package with the same
12/02/2004	US20040238922 Connection components with frangible leads and bus
12/02/2004	US20040238921 Ground-enhanced semiconductor package and lead frame for the same
12/02/2004	US20040238919 Methods and apparatus for providing an antifuse function
12/02/2004	US20040238917 Edge intensive antifuse and method for making the same
12/02/2004	US20040238916 Edge intensive antifuse and method for making the same
12/02/2004	US20040238913 Reduced surface field technique for semiconductor devices
12/02/2004	US20040238894 Semiconductor circuit device
12/02/2004	US20040238893 Semiconductor device having transistor with high electro-static discharge capability and high noise capability
12/02/2004	US20040238888 Thin film transistor substrate and method of manufacturing the same
12/02/2004	US20040238886 Thin film transistor array panel and a method for manufacturing the same
12/02/2004	US20040238871 Semiconductor device
12/02/2004	US20040238870 Semiconductor device
12/02/2004	US20040238863 Word line strap layout structure
12/02/2004	US20040238857 High frequency chip packages with connecting elements
12/02/2004	US20040238853 Semiconductor pmd layer dielectric
12/02/2004	US20040238851 Substrate with crystal silicon array
12/02/2004	US20040238850 Integrated circuit device and method for forming the same
12/02/2004	US20040238838 Glass-sealed light-emitting diode
12/02/2004	US20040238825 Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same
12/02/2004	US20040238818 Semiconductor chip with test pads and tape carrier package using the same
12/02/2004	US20040238603 Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus
12/02/2004	US20040238600 Novel packaging method for microstructure and semiconductor devices
12/02/2004	US20040238483 Reducing corrugated edge pattern range and skirt spreading length variation; can employ aluminum metal or alloy and brazing filler bonding; utilizing acid free ferric chloride and water
12/02/2004	US20040238402 Method and system for flip chip packaging
12/02/2004	US20040238212 Electronic circuit comprising conductive bridges and method for making such bridges
12/02/2004	US20040238206 Selective reference plane bridge(s) on folded package
12/02/2004	US20040238160 Heat dissipating device
12/02/2004	US20040238127 Fixture used to prepare semiconductor specimens for film adhesion testing
12/02/2004	US20040238099 Eliminates conventional grinding and ultrasonic machining
12/02/2004	US20040237299 Method for hermetically encapsulating a component
12/02/2004	DE202004011439U1 Cooler for a power semiconductor, has fan blowing onto at least two heat exchange surfaces, at least one of which is thermally connected to the semiconductor
12/02/2004	DE202004010951U1 Thermoelektrische Kühlvorrichtung Thermoelectric cooling device
12/02/2004	DE202004010006U1 Computer processor heat sink clamping device has a lever that pivots about axle bolts for attachment or release of a moveable connection to a pressure part
12/02/2004	DE10322135A1 Component used in microelectronics, especially as a flip-chip contact comprises a solder connection formed between a first partial body having a first flat metallization and a second partial body having a second flat metallization
12/02/2004	DE10321954A1 Einzelhalbleiterelement in Flip-Chip-Bauweise Single semiconductor element in a flip-chip-type
12/02/2004	DE10321549A1 Anordnung zum Kühlen eines Thyristors Arrangement for cooling a thyristor
12/02/2004	DE10320838A1 Verbundwerkstoff sowie elektrischer Schaltkreis oder elektrisches Modul Composite and electrical circuit or electrical module
12/02/2004	DE10320186A1 Heat conducting paste used in the production of power semiconductor modules comprises a base material and a filler
12/02/2004	DE102004021075A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
12/02/2004	CA2526481A1 Method of room temperature covalent bonding
12/01/2004	EP1482773A1 Perimeter matrix ball grid array circuit package with a populated center
12/01/2004	EP1482771A2 Metal/ceramic circuit board and method for producing same
12/01/2004	EP1482631A2 Mounting structure of a switching element at a heat sink

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