Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2014
03/06/2014US20140061944 Semiconductor Device and Method of Forming Thick Encapsulant for Stiffness with Recesses for Stress Relief in FO-WLCSP
03/06/2014US20140061943 Latch-up suppression and substrate noise coupling reduction through a substrate back-tie for 3d integrated circuits
03/06/2014US20140061942 Heterogeneous annealing method and device
03/06/2014US20140061941 Semiconductor device and method of manufacturing the same
03/06/2014US20140061940 Semiconductor device and method of manufacturing the same
03/06/2014US20140061939 Semiconductor devices having bit line contact plugs and methods of manufacturing the same
03/06/2014US20140061938 Semiconductor device
03/06/2014US20140061937 Fan-Out Package Comprising Bulk Metal
03/06/2014US20140061936 Latch-up suppression and substrate noise coupling reduction through a substrate back-tie for 3d integrated circuits
03/06/2014US20140061935 Method for manufacturing a layer arrangement, and a layer arrangement
03/06/2014US20140061934 Semiconductor device
03/06/2014US20140061933 Wire bond splash containment
03/06/2014US20140061932 Methods and Apparatus for Package on Package Structures
03/06/2014US20140061931 Semiconductor device including fluorine-free tungsten barrier layer and method for fabricating the same
03/06/2014US20140061930 Overlay-tolerant via mask and reactive ion etch (rie) technique
03/06/2014US20140061929 Semiconductor device and manufacturing method thereof
03/06/2014US20140061928 Interconnection structure for semiconductor package
03/06/2014US20140061927 Chip package incorporating interfacial adhesion through conductor sputtering
03/06/2014US20140061926 Semiconductor devices including supporting patterns in gap regions between conductive patterns and methods of fabricating the same
03/06/2014US20140061925 Low resistivity gate conductor
03/06/2014US20140061924 Interconnect Structure and Method
03/06/2014US20140061923 Structure to increase resistance to electromigration
03/06/2014US20140061922 Semiconductor device and method for manufacturing the same
03/06/2014US20140061921 Gold bonding in semiconductor devices using porous gold
03/06/2014US20140061920 Semiconductor device
03/06/2014US20140061919 Electroplated Metallic Interconnects And Products
03/06/2014US20140061918 METHOD OF FORMING LOW RESISTIVITY TaNx/Ta DIFFUSION BARRIERS FOR BACKEND INTERCONNECTS
03/06/2014US20140061917 Semiconductor device and fabricating method thereof
03/06/2014US20140061916 Semiconductor device with low resistance wiring and manufacturing method for the device
03/06/2014US20140061915 Prevention of thru-substrate via pistoning using highly doped copper alloy seed layer
03/06/2014US20140061914 Doping of copper wiring structures in back end of line processing
03/06/2014US20140061913 Aluminum Interconnection Apparatus
03/06/2014US20140061912 Patterned Graphene Structures on Silicon Carbide
03/06/2014US20140061911 Self-aligning hybridization method
03/06/2014US20140061910 Semiconductor device structures and methods for copper bond pads
03/06/2014US20140061909 Pre-Sintered Semiconductor Die Structure
03/06/2014US20140061908 Plastic ball grid array package having reinforcement resin
03/06/2014US20140061907 Semiconductor device and method for forming the same
03/06/2014US20140061906 Semiconductor structure
03/06/2014US20140061905 Polyol Photosensitizers, Carrier Gas UV Laser Ablation Sensitizers, and Other Additives and Methods For Making and Using Same
03/06/2014US20140061904 Semiconductor structure and method of manufacturing the same
03/06/2014US20140061903 Package on package structrue and method for manufacturing same
03/06/2014US20140061902 Techniques and configurations for surface treatment of an integrated circuit substrate
03/06/2014US20140061901 Precise-Aligned Lock-And-Key Bonding Structures
03/06/2014US20140061900 Semiconductor package with improved redistribution layer design and fabricating method thereof
03/06/2014US20140061899 Wafer level package structure and manufacturing method of the same
03/06/2014US20140061898 Metal Pads with Openings in Integrated Circuits
03/06/2014US20140061897 Bump Structures for Semiconductor Package
03/06/2014US20140061896 Die Underfill Structure And Method
03/06/2014US20140061894 Heat spreader for use within a packaged semiconductor device
03/06/2014US20140061893 Hybrid thermal interface material for ic packages with integrated heat spreader
03/06/2014US20140061891 Semiconductor chip package and manufacturing method thereof
03/06/2014US20140061890 Semiconductor package and method of manufacturing the same
03/06/2014US20140061889 Interfacial alloy layer for improving electromigration (em) resistance in solder joints
03/06/2014US20140061888 Three dimensional (3d) fan-out packaging mechanisms
03/06/2014US20140061887 Semiconductor device and manufacturing method of semiconductor device
03/06/2014US20140061886 Semiconductor Package with Interposer
03/06/2014US20140061885 Power Quad Flat No-Lead (PQFN) Package
03/06/2014US20140061884 Stacked die power converter
03/06/2014US20140061883 Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture
03/06/2014US20140061882 Electronic system modules and method of fabrication
03/06/2014US20140061880 Wafer level chip scale package
03/06/2014US20140061879 Multilayer packaged semiconductor device and method of packaging
03/06/2014US20140061878 Integrated circuits and a method for manufacturing an integrated circuit
03/06/2014US20140061877 Wiring board with embedded device, built-in stopper and electromagnetic shielding
03/06/2014US20140061874 Semiconductor device and method for fabricating the same
03/06/2014US20140061873 Method for processing a wafer, and layer arrangement
03/06/2014US20140061871 Semiconductor device and method of manufacturing the same
03/06/2014US20140061867 Method for depositing one or more polycrystalline silicon layers on substrate
03/06/2014US20140061866 Semiconductor chip and semiconductor package having the same
03/06/2014US20140061865 Semiconductor device and method of manufacturing semiconductor device
03/06/2014US20140061864 Semiconductor substrate having crack preventing structure and method of manufacturing the same
03/06/2014US20140061854 Small size and fully integrated power converter with magnetics on chip
03/06/2014US20140061852 Unbalanced parallel circuit protection fuse device
03/06/2014US20140061851 Metal-via fuse
03/06/2014US20140061821 Electronic device and semiconductor device
03/06/2014US20140061747 Memory array having connections going through control gates
03/06/2014US20140061736 Semiconductor device and method of manufacturing the same
03/06/2014US20140061673 Semiconductor unit and semiconductor device using the same
03/06/2014US20140061669 Chip package and a method for manufacturing a chip package
03/06/2014US20140061644 Super-junction semiconductor device
03/06/2014US20140061643 Semiconductor device
03/06/2014US20140061642 Method and apparatus for routing die signals using external interconnects
03/06/2014US20140060648 Inorganic multilayer stack and methods and compositions relating thereto
03/06/2014US20140060617 Semiconductor device, solar cell module, solar cell string, and solar cell array
03/06/2014US20140059851 Circuit board structure and method for manufacturing a circuit board structure
03/06/2014DE112012002370T5 Mikroelektronisches Substrat für alternierende Package-Funktionalität The microelectronic substrate for alternating package functionality
03/06/2014DE102013217292A1 Seitliche Elemententrennvorrichtung Side element separating device
03/06/2014DE102013217225A1 Halbleiterbauelement mit einer Passivierungsschicht und Verfahren zu dessen Herstellung A semiconductor device with a passivation layer and process for its preparation
03/06/2014DE102013216633A1 Vorgesinterte Halbleiterchip-Struktur Presintered semiconductor chip structure
03/06/2014DE102013109650A1 Spannungsregler Voltage Regulators
03/06/2014DE102013109558A1 Integrierte schaltkreise und verfahren zur herstellung eines integrierten schaltkreises Integrated circuits and methods for producing an integrated circuit
03/06/2014DE102013109542A1 Chipbaugruppe und verfahren zur herstellung einer chipbaugruppe Chip module and method of producing a chip package
03/06/2014DE102013109375A1 Verfahren zum verarbeiten eines wafers und schichtanordnung A method for processing a wafer and layer arrangement
03/06/2014DE102013104112A1 Verbindungsstruktur und -verfahren Connection structure and procedures
03/06/2014DE102013101192A1 Dreidimensionales (3-D), aufgefächertes Gehäusebauteil Three-dimensional (3-D), fanned housing component
03/06/2014DE102012221080A1 Verfahren zur Herstellung einer Schicht auf einem Oberflächenbereich eines elektronischen Bauelements A method for producing a layer on a surface region of an electronic component
03/06/2014DE102012215787A1 Leistungselektronisches System mit Flüssigkeitskühleinrichtung Power electronic system with liquid cooling device
03/06/2014DE102012215705A1 Gehäuse für ein optisches bauelement, baugruppe, verfahren zum herstellen eines gehäuses und verfahren zum herstellen einer baugruppe Housing for an optical component assembly, method for producing a casing and method for manufacturing an assembly
03/06/2014DE102012215656A1 Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls The power semiconductor module and method of producing a power semiconductor module
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