| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/07/2004 | US6828510 Multilayer printed wiring board and method of manufacturing multilayer printed wiring board |
| 12/07/2004 | US6828506 Wiring structure |
| 12/07/2004 | US6828369 Sheet for conducting heat |
| 12/07/2004 | US6828360 Thixotropic fluorinated curable compositions and articles sealed therewith |
| 12/07/2004 | US6828233 Forming reliable, defect free material with substantial void elimination; covering exposed surface and interior sidewalls of hole with titanium aluminide and titanium nitride layers then depositing conductive plug |
| 12/07/2004 | US6828230 Integrated circuit having conductive paths of different heights formed from the same layer structure and method for forming the same |
| 12/07/2004 | US6828225 Substrate processing method |
| 12/07/2004 | US6828224 Method of fabricating substrate utilizing an electrophoretic deposition process |
| 12/07/2004 | US6828223 Localized slots for stress relieve in copper |
| 12/07/2004 | US6828222 Method for manufacturing multilayer wiring structure semiconductor device |
| 12/07/2004 | US6828220 Flip chip-in-leadframe package and process |
| 12/07/2004 | US6828215 Device and method for core buildup using a separator |
| 12/07/2004 | US6828175 Semiconductor component with backside contacts and method of fabrication |
| 12/07/2004 | US6828173 Semiconductor device including edge bond pads and methods |
| 12/07/2004 | US6828170 Method of making a semiconductor radiation emitter package |
| 12/07/2004 | US6828164 Method for measuring the etching speed |
| 12/07/2004 | US6828071 Method of aligning a wafer and masks |
| 12/07/2004 | US6828039 Magnetoresistive sensor and manufacturing method therefor |
| 12/07/2004 | US6828002 Substrate strip with sides having flanges and recesses |
| 12/07/2004 | US6827868 Thinning of fuse passivation after C4 formation |
| 12/07/2004 | US6827800 Process for the constrained sintering of asymmetrically configured dielectric layers |
| 12/07/2004 | US6827584 Interconnect for microelectronic structures with enhanced spring characteristics |
| 12/07/2004 | US6827218 Packaging container for electronic components |
| 12/07/2004 | US6827140 Radiator (1) |
| 12/07/2004 | US6827136 Heat dissipating apparatus and method for producing same |
| 12/07/2004 | US6827135 High flux heat removal system using jet impingement of water at subatmospheric pressure |
| 12/07/2004 | US6827134 Parallel-plate heat pipe apparatus having a shaped wick structure |
| 12/07/2004 | US6827132 Radiation apparatus |
| 12/07/2004 | US6827131 Apparatus of water-cooled heat sink |
| 12/07/2004 | US6827130 Heatsink assembly and method of manufacturing the same |
| 12/07/2004 | US6826970 Method and apparatus for detecting bearing failure |
| 12/07/2004 | US6826923 Cooling device for semiconductor elements |
| 12/07/2004 | US6826916 Laser module, Peltier module, and Peltier module integrated heat spreader |
| 12/07/2004 | US6826830 Multi-layered interconnect structure using liquid crystalline polymer dielectric |
| 12/07/2004 | US6826829 Method for attaching a die with a low melting metal |
| 12/07/2004 | US6826827 Forming conductive posts by selective removal of conductive material |
| 12/02/2004 | WO2004105456A1 Transfer assembly for manufacturing electronic devices |
| 12/02/2004 | WO2004105134A1 An integrated circuit package |
| 12/02/2004 | WO2004105133A1 Wire bonding on in-line connection pads |
| 12/02/2004 | WO2004105132A1 An electrical connection for a microelectronic chip, and a method for manufacturing such a connection |
| 12/02/2004 | WO2004105130A1 Cooling device with a centrifugal pump for cooling electronic devices |
| 12/02/2004 | WO2004105129A1 Printed circuit board unit and method of manufacturing the unit |
| 12/02/2004 | WO2004105128A1 Semiconductor package |
| 12/02/2004 | WO2004105127A1 Semiconductor die package with increased thermal conduction |
| 12/02/2004 | WO2004105126A1 Thermal transfer container for semiconductor component |
| 12/02/2004 | WO2004105125A2 Semiconductor device, method of authentifying and system |
| 12/02/2004 | WO2004105123A1 Semiconductor device |
| 12/02/2004 | WO2004105122A1 Method of manufacturing a substrate, having a porous dielectric layer and air gaps, and a substrate |
| 12/02/2004 | WO2004105120A1 Lsi package, lsi device testing method, semiconductor device manufacturing method |
| 12/02/2004 | WO2004105092A2 Esd protection for semiconductor products |
| 12/02/2004 | WO2004105088A2 Circuit and method for trimming locking of integrated circuits |
| 12/02/2004 | WO2004105053A1 Conductive ball, method of forming electrode of electronic part, electronic part and electronic equipment |
| 12/02/2004 | WO2004104911A1 Ic card and ic card making method |
| 12/02/2004 | WO2004090979A3 Overlay metrology mark |
| 12/02/2004 | WO2004077527A3 Area-array device assembly with pre-applied underfill layers on printed wiring board |
| 12/02/2004 | WO2004077513A3 Packaging system for power supplies |
| 12/02/2004 | WO2004064464A3 System and method for packaging electronic components |
| 12/02/2004 | WO2004052547A3 Coated and magnetic particles and applications thereof |
| 12/02/2004 | WO2004049432A3 Sealing porous structures |
| 12/02/2004 | WO2004010498A3 Oxygen getter and method for forming it |
| 12/02/2004 | US20040243960 Methods and apparatus for defining power grid structures having diagonal stripes |
| 12/02/2004 | US20040243890 Method and architecture for detecting random and systematic transistor degradation for transistor reliability evaluation in high-density memory |
| 12/02/2004 | US20040242834 Blends; heat resistance; semiconductor sealing; reacting phenol with dicyclopentadiene in presence ofacid catalyst |
| 12/02/2004 | US20040242796 Unsaturated compounds containing silane, electron donor and electron acceptor functionality |
| 12/02/2004 | US20040242031 Pressure piece for use in a power semiconductor module |
| 12/02/2004 | US20040242030 Packaged device adapter assembly with alignment structure and methods regarding same |
| 12/02/2004 | US20040242020 Semiconductor device and production method therefor |
| 12/02/2004 | US20040242017 Etchant for signal wire and method of manufacturing thin film transistor array panel using etchant |
| 12/02/2004 | US20040242001 Notched compound semiconductor wafer |
| 12/02/2004 | US20040241994 Microelectromechanical device and method for producing it |
| 12/02/2004 | US20040241990 Process skew results for integrated circuits |
| 12/02/2004 | US20040241987 Contact portion of semiconductor device, and thin film transistor array panel for display device including the contact portion |
| 12/02/2004 | US20040241985 Substrate processing method and apparatus |
| 12/02/2004 | US20040241977 Passivation scheme for bumped wafers |
| 12/02/2004 | US20040241970 Method of Forming Vias in Silicon Carbide and Resulting Devices and Circuits |
| 12/02/2004 | US20040241936 Semiconductor device having silicide film formed in a part of source-drain diffusion layers and method of manufacturing the same |
| 12/02/2004 | US20040241932 Method of making an anisotropic conductive polymer film on a semiconductor wafer |
| 12/02/2004 | US20040241928 Method of manufacturing a semiconductor device and apparatus for manufacturing a semiconductor device |
| 12/02/2004 | US20040241927 Curable organopolysiloxane composition, use of the cured product of the composition, and semiconductor device |
| 12/02/2004 | US20040241914 Mechanical support system for a thin package |
| 12/02/2004 | US20040241913 High impedance radio frequency power plastic package |
| 12/02/2004 | US20040241912 Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device |
| 12/02/2004 | US20040241911 [bump process for flip chip package] |
| 12/02/2004 | US20040241909 Method and system for chip-to-package interconnection |
| 12/02/2004 | US20040241908 Semiconductor package with semiconductor chips stacked therein and method of making the package |
| 12/02/2004 | US20040241907 Method of manufacturing a semiconductor device |
| 12/02/2004 | US20040241905 Apparatus and method for attaching an integrated circuit sensor to a substrate |
| 12/02/2004 | US20040241899 Image sensor with recessed planarizing layers and method for making same |
| 12/02/2004 | US20040241466 Sandwich arc structure for preventing metal to contact from shifting |
| 12/02/2004 | US20040241447 Composite material having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods |
| 12/02/2004 | US20040241401 Capacitor having improved electrodes |
| 12/02/2004 | US20040241323 Confining a liquid adhesive to a region of a substrate surface by first forming a fixed coating on a substrate with a boundary enclosing a region of the substrate surface and an average receding contact angle with water at least 30 degrees higher than the average receding contact angle of the enclosure |
| 12/02/2004 | US20040240309 On die voltage regulator |
| 12/02/2004 | US20040240259 Semiconductor memory device and defect remedying method thereof |
| 12/02/2004 | US20040240245 Power conditioning module |
| 12/02/2004 | US20040240191 Electromagnetic interference shielding for a printed circuit board |
| 12/02/2004 | US20040240188 Protective coating for attach hardware for circuits |
| 12/02/2004 | US20040240187 Electronic component |
| 12/02/2004 | US20040240184 Circuit cooling apparatus |
| 12/02/2004 | US20040240183 Electronic component mounting board, electronic component module, method of manufacturing electronic component mounting board, and communications equipment |