H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2004
12/08/2004	EP1483789A2 Semiconductor device having a wire bond pad and method therefor
12/08/2004	EP1483787A2 Semiconductor device having a bond pad and method therefor
12/08/2004	EP1483786A1 Method and resulting structure for manufacturing semiconductor substrate
12/08/2004	EP1483723A1 Methods and apparatus for fabricating chip-on-board modules
12/08/2004	EP1483722A1 Memory module assembly using partially defective chips
12/08/2004	EP1483419A2 Lead−free tin−silver−copper alloy solder composition
12/08/2004	EP1483110A1 Thermal interface materials
12/08/2004	EP1399966B1 Power pads for application of high current per bond pad in silicon technology
12/08/2004	CN2662455Y Electric packaging body
12/08/2004	CN2662454Y Heat radiating fin and composite structure thereof
12/08/2004	CN2662453Y Heat radiating fin
12/08/2004	CN2662452Y 散热器 Heat sink
12/08/2004	CN2662451Y Heat radiating fin
12/08/2004	CN2662450Y Protective covering body for heat radiating die set
12/08/2004	CN2662449Y Base plate stack type packaging structure
12/08/2004	CN2662448Y Circuit module with joint line
12/08/2004	CN2662324Y Computer host radiating device
12/08/2004	CN2662323Y Radiating exhaust duct holder for computer radiator capable of stretching and arbitrary angle buckling
12/08/2004	CN1554214A An electronic assembly and a method of constructing an electronic assembly
12/08/2004	CN1554141A An arrangement for ESD protection of an integrated circuit
12/08/2004	CN1554120A Electronic assembly with high capacity thermal interface and methods of manufacture
12/08/2004	CN1554116A Method of forming a bond pad and structure thereof
12/08/2004	CN1553830A Electro-optical component including a fluorinated poly (phenylene ether ketone) protective coating and related methods
12/08/2004	CN1553570A Output driver impedance controller and its integrated circuits and control method
12/08/2004	CN1553569A Apparatus and method for adjusting the impedance of an output driver
12/08/2004	CN1553505A Semiconductor device and producing method thereof
12/08/2004	CN1553504A Protective transistors
12/08/2004	CN1553503A Nonvolatile memory integrated circuits
12/08/2004	CN1553502A Radiating fin structure
12/08/2004	CN1553501A Radiator
12/08/2004	CN1553500A Substrates of package integrated circuits and manufacture thereof
12/08/2004	CN1553492A Semiconductor copper bond pad surface protection
12/08/2004	CN1553490A Electronic sealer with three-dimensional stack and assembling method thereof
12/08/2004	CN1553480A Printing preparation of mini gap reversed-mounting welded convex templates with lead/tin or leadless solder
12/08/2004	CN1552951A Technology for electrolyzing and manufacturing micro-gap counter-assembled welding projects
12/08/2004	CN1552661A Glass ceramic composition, electronic component therewith and laminated LC composite component
12/08/2004	CN1179619C Highly heat-conductive composite magnetic material
12/08/2004	CN1179413C Guider for preventing destroy of electrostatic discharge and its making method
12/08/2004	CN1179412C Solder bump structure and its forming method
12/08/2004	CN1179411C Connecting pad with insulation intensifying structure and its making method
12/08/2004	CN1179410C Surface wave device
12/08/2004	CN1179409C Semiconductor device design method and apparatus
12/08/2004	CN1179402C Production technology of semiconductor device
12/08/2004	CN1179238C LCD device
12/08/2004	CN1179188C Plate type radiating pipe and its cooling structure
12/08/2004	CN1179186C Multi-mode two-phase cooling module
12/07/2004	US6829266 Optical semiconductor device increasing productivity and method of fabricating the same
12/07/2004	US6829265 Semiconductor laser array
12/07/2004	US6829149 Placement of sacrificial solder balls underneath the PBGA substrate
12/07/2004	US6829147 Multilayered hybrid electronic module
12/07/2004	US6829146 Blindmate heat sink assembly
12/07/2004	US6829145 Separable hybrid cold plate and heat sink device and method
12/07/2004	US6829144 Flip chip package with heat spreader allowing multiple heat sink attachment
12/07/2004	US6829143 Heatsink retention apparatus
12/07/2004	US6829135 Layered product, capacitor, electronic component and method and apparatus manufacturing the same
12/07/2004	US6828812 Test apparatus for testing semiconductor dice including substrate with penetration limiting contacts for making electrical connections
12/07/2004	US6828688 Resin-sealed semiconductor device, circuit member used for the device, and method of manufacturing the circuit member
12/07/2004	US6828687 Cavity down ball grid array package structure and carrier thereof
12/07/2004	US6828686 Chip size stack package and method of fabricating the same
12/07/2004	US6828684 Semiconductor device and method of manufacturing the same
12/07/2004	US6828683 Forming conductive copper-containing material over substrate and barrier layer comprising methylated silicon nitride
12/07/2004	US6828682 Substrate voltage connection
12/07/2004	US6828681 Semiconductor devices having contact pads and methods of manufacturing the same
12/07/2004	US6828680 Integrated circuit configuration using spacers as a diffusion barrier and method of producing such an integrated circuit configuration
12/07/2004	US6828679 Solid image pickup device
12/07/2004	US6828678 Semiconductor topography with a fill material arranged within a plurality of valleys associated with the surface roughness of the metal layer
12/07/2004	US6828677 Precision electroplated solder bumps and method for manufacturing thereof
12/07/2004	US6828676 Semiconductor device manufacturing method, semiconductor device, and semiconductor device unit
12/07/2004	US6828674 Microelectrical-mechanical systems devices; microstructure and cap wafers bonded with frit glass sealant, connected by wire bond, and protected by overmold
12/07/2004	US6828673 Heat sink assembly
12/07/2004	US6828672 Thermally conductive silk-screenable interface material
12/07/2004	US6828671 Enhanced BGA grounded heatsink
12/07/2004	US6828670 Module component
12/07/2004	US6828669 Plurality of terminal pads located at positions corresponding to plurality of solder bumps or flip chips; semiconductors
12/07/2004	US6828668 Flexible lead structures and methods of making same
12/07/2004	US6828666 Low inductance power distribution system for an integrated circuit chip
12/07/2004	US6828665 Module device of stacked semiconductor packages and method for fabricating the same
12/07/2004	US6828664 Packaging substrate with electrostatic discharge protection
12/07/2004	US6828663 Method of packaging a device with a lead frame, and an apparatus formed therefrom
12/07/2004	US6828662 Semiconductor device
12/07/2004	US6828661 Lead frame and a resin-sealed semiconductor device exhibiting improved resin balance, and a method for manufacturing the same
12/07/2004	US6828660 Semiconductor device with double nickel-plated leadframe
12/07/2004	US6828659 Semiconductor device having a die pad supported by a die pad supporter
12/07/2004	US6828658 Package for integrated circuit with internal matching
12/07/2004	US6828656 High performance silicon contact for flip chip and a system using same
12/07/2004	US6828653 Method of forming metal fuses in CMOS processes with copper interconnect
12/07/2004	US6828652 Fuse structure for semiconductor device
12/07/2004	US6828649 Semiconductor device having an interconnect that electrically connects a conductive material and a doped layer, and a method of manufacture therefor
12/07/2004	US6828647 Structure for determining edges of regions in a semiconductor wafer
12/07/2004	US6828643 Bonding pads over input circuits
12/07/2004	US6828637 Semiconductor memory devices having dummy active regions
12/07/2004	US6828636 Semiconductor device isolated resistive zone
12/07/2004	US6828616 Integrated circuit devices that utilize doped Poly-Si1−xGex conductive plugs as interconnects
12/07/2004	US6828611 Integrated circuit ferroelectric memory devices including plate lines directly on ferroelectric capacitors
12/07/2004	US6828607 Discontinuous nitride structure for non-volatile transistors
12/07/2004	US6828604 Semiconductor device with antenna pattern for reducing plasma damage
12/07/2004	US6828600 Power semiconductor module with ceramic substrate
12/07/2004	US6828543 Flip chip package structure for an image sensor and an image sense module with the flip chip package structure
12/07/2004	US6828514 High speed circuit board and method for fabrication
12/07/2004	US6828511 Prefabricated semiconductor chip carrier

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