H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2004
12/09/2004	US20040246679 Method and system for applying target load to an application specific integrated circuit (ASIC) assembly with attach hardware
12/09/2004	US20040246678 Function module with built-in heat dissipation device
12/09/2004	US20040246677 Computer cooling apparatus
12/09/2004	US20040246676 System and method for heat dissipation and air flow redirection in a chassis
12/09/2004	US20040246650 Highly conductive macromolecular materials and improved methods for making same
12/09/2004	US20040246064 Multilayer circuit board for high frequency signals
12/09/2004	US20040245965 Shunt voltage regulator and method of using
12/09/2004	US20040245936 Integrated circuit device for driving a laser diode with reduced heat transfer and method for fabricating the device
12/09/2004	US20040245896 Piezoelectric device and manufacturing method therefor
12/09/2004	US20040245866 Integrated cooler for electronic devices
12/09/2004	US20040245656 Semiconductor integrated circuit device
12/09/2004	US20040245655 Semiconductor device, its manufacturing method, and radio communication device
12/09/2004	US20040245653 Flip chip package having protective cap and method of fabricating the same
12/09/2004	US20040245650 Semiconductor contact structure and method of forming the same
12/09/2004	US20040245649 Optical device, optical module, semiconductor apparatus and its manufacturing method, and electronic apparatus
12/09/2004	US20040245648 Bonding material and bonding method
12/09/2004	US20040245646 Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the same
12/09/2004	US20040245645 Semiconductor integrated circuit device having multilevel interconnection
12/09/2004	US20040245643 Semiconductor device and method of manufacturing the same
12/09/2004	US20040245642 Semiconductor device
12/09/2004	US20040245641 Semiconductor device, electro-optical unit, and electronic apparatus
12/09/2004	US20040245640 Wiring board and circuit module
12/09/2004	US20040245639 Structure for reducing stress-induced voiding in an interconnect of integrated circuits
12/09/2004	US20040245638 Semiconductor power device having a diamond shaped metal interconnect scheme
12/09/2004	US20040245637 Method for supporting a bond pad in a multilevel interconnect structure and support structure formed thereby
12/09/2004	US20040245636 Full removal of dual damascene metal level
12/09/2004	US20040245633 Integrating chip scale packaging metallization into integrated circuit die structures
12/09/2004	US20040245632 Electrostatic discharge protection
12/09/2004	US20040245631 Integrating chip scale packaging metallization into integrated circuit die structures
12/09/2004	US20040245630 Chip having a passivation layer with a recess; bonding pad exposed by the layer; redistribution layer; second passivation layer with an opening that exposes the redistribution layer above the recess; bump inside the opening and electrically connected to the redistribution layer above the recess
12/09/2004	US20040245629 Semiconductor device and method for manufacturing the same, circuit board and electronic equipment
12/09/2004	US20040245628 Tape package having test pad on reverse surface and method for testing the same
12/09/2004	US20040245627 Die stacking scheme
12/09/2004	US20040245625 Semiconductor device, circuit board, electronic apparatus, and method for manufacturing semiconductor device
12/09/2004	US20040245624 Using solder balls of multiple sizes to couple one or more semiconductor structures to an electrical device
12/09/2004	US20040245623 Semiconductor device, circuit substrate and electronic instrument
12/09/2004	US20040245622 Semiconductor device
12/09/2004	US20040245621 Semiconductor wafer, semiconductor device, circuit board, electronic instrument, and method for manufacturing semiconductor device
12/09/2004	US20040245620 Memory card capable of indicating an inserting direction
12/09/2004	US20040245619 Wired circuit board
12/09/2004	US20040245615 Point to point memory expansion system and method
12/09/2004	US20040245614 Semiconductor package having semiconductor constructing body and method of manufacturing the same
12/09/2004	US20040245613 Chip scale package and method of fabricating the same
12/09/2004	US20040245612 Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument
12/09/2004	US20040245611 Pre-applied thermoplastic reinforcement for electronic components
12/09/2004	US20040245610 Flex tape architecture for integrated circuit signal ingress/egress
12/09/2004	US20040245609 Package structure for an integrated circuit
12/09/2004	US20040245608 Semiconductor package having conductive bumps on chip and method for fabricating the same
12/09/2004	US20040245607 Semiconductor integrated circuit device and method of manufacturing the same
12/09/2004	US20040245606 In-plane on-chip decoupling capacitors and method for making same
12/09/2004	US20040245601 Semiconductor device
12/09/2004	US20040245600 Semiconductor device and its manufacturing method
12/09/2004	US20040245599 Semiconductor device
12/09/2004	US20040245598 Semiconductor device
12/09/2004	US20040245591 Package structure for light emitting diode and method thereof
12/09/2004	US20040245580 [chip structure with a passive device and method for forming the same]
12/09/2004	US20040245575 Thin film resistor integration in a dual damascene structure
12/09/2004	US20040245574 ESD protection device with thick poly film and method for forming the same
12/09/2004	US20040245569 Device architecture and process for improved vertical memory arrays
12/09/2004	US20040245556 Interposer capacitor built on silicon wafer and joined to a ceramic substrate
12/09/2004	US20040245548 Power semiconductor module
12/09/2004	US20040245545 Silicon building block architecture with flex tape
12/09/2004	US20040245518 Self-assembled sub-nanolayers as interfacial adhesion enhancers and diffusion barriers
12/09/2004	US20040245508 Thick film conductor compositions for use on aluminum nitride substrates
12/09/2004	US20040245446 Optical transmitter
12/09/2004	US20040245111 Plating tank for wire patterns on film carrier; prevent bubble adhesion
12/09/2004	US20040245109 Film carrier tape for mounting electronic devices thereon, production method thereof and plating apparatus
12/09/2004	US20040245014 Power delivery through a flex tape in decoupled I/O-power hybrid substrate
12/09/2004	US20040244959 Cooling fin structure and fin assembly
12/09/2004	US20040244952 Integrated heat spreader with mechanical interlock designs
12/09/2004	US20040244951 Integrated circuit heat pipe heat spreader with through mounting holes
12/09/2004	US20040244950 Optimized multiple heat pipe blocks for electronics cooling
12/09/2004	US20040244948 Heat exchange device
12/09/2004	US20040244947 Heat sinks for a cooler
12/09/2004	US20040244405 Active micro cooler
12/09/2004	US20040244383 High efficiency cooling device
12/09/2004	DE4342047B4 Halbleiterbauelement mit einer Diffusionsbarrierenschichtanordnung und Verfahren zu seiner Herstellung A semiconductor device comprising a diffusion barrier layer assembly and process for its preparation
12/09/2004	DE10323146A1 Gehäuse zu definierten Verfüllung Housing to defined filling
12/09/2004	DE10321257A1 Lead frame for receiving and contacting electrical and or optoelectronic components comprises at least two regions of different thicknesses
12/09/2004	DE10320877A1 Halbleiterbauelement und Verfahren zum Herstellen eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
12/09/2004	DE10320561A1 Verbindung zwischen einem Halbleiterchip und einer äußeren Leiterstruktur und Verfahren zu ihrer Herstellung Connection between a semiconductor chip and an outer conductor structure and process for their preparation
12/09/2004	DE10319984A1 Memory module cooling device, especially for PC memory modules, comprises elements for thermally coupling two or more memory modules
12/09/2004	DE10318074A1 Process for improving the mechanical properties of BOC module arrangements used in production of circuit boards comprises providing a wafer or chips after their separation and before their assembly on a circuit board with a casting compound
12/09/2004	DE10297355T5 Mehrstufiger Hochfrequenz- und Hochleistungssignalverstärker A multi-stage high frequency and high power signal amplifier
12/09/2004	DE10297316T5 Gestapelte Baugruppen Stacked modules
12/09/2004	DE10214508B4 Wärmeabfuhrvorrichtung Heat dissipation device
12/09/2004	DE102004011719A1 Halbleitervorrichtung mit symmetrischer Schaltung zur Verwendung in einem Hochfrequenzband A semiconductor device having a symmetrical circuit for use in a high frequency band
12/09/2004	DE10190278B4 Herstellungsverfahren für Multi-Gauge-Streifen Manufacturing processes for multi-gauge strips
12/09/2004	DE10126568B4 Elektronisches Bauelement sowie Verfahren zur Herstellung desselben The same electronic device and methods for preparing
12/09/2004	CA2526484A1 Semiconductor package having filler metal of gold/silver/copper alloy
12/08/2004	EP1484953A1 Integrated circuit device for driving a laser diode with reduced heat transfer and method for fabricating the device
12/08/2004	EP1484949A2 Processing low dielectric constant materials for high speed electronics
12/08/2004	EP1484815A1 Radio-frequency circuit module
12/08/2004	EP1484797A1 Inverter power device and method of making it
12/08/2004	EP1484796A2 Semiconductor device and manufacturing method of the same
12/08/2004	EP1484795A1 Method for manufacturing a chip scale package at wafer level
12/08/2004	EP1484790A1 Semiconductor device and method for fabricating the same
12/08/2004	EP1484767A2 Magnetic memory apparatus and method of manufacturing magnetic memory apparatus
12/08/2004	EP1483816A1 Header assembly having integrated cooling device
12/08/2004	EP1483792A1 Detector arrangement, method for the detection of electrical charge carriers and use of an ono field effect transistor of r detection of an electrical charge

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