H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2004
12/16/2004	US20040251524 Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
12/16/2004	US20040251523 Stackable integrated circuit package and method therefor
12/16/2004	US20040251522 Electromagnetic interference package protection
12/16/2004	US20040251520 Method for manufacturing semiconductor device
12/16/2004	US20040251518 Method of reducing wafer contamination by removing under-metal layers at the wafer edge
12/16/2004	US20040251502 Efficient pMOS ESD protection circuit
12/16/2004	US20040251501 Coupling of signals between adjacent functional blocks in an integrated circuit chip
12/16/2004	US20040251478 Diamondoid-containing materials for passivating layers in integrated circuit devices
12/16/2004	US20040251476 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
12/16/2004	US20040251472 Memory cell for modification of revision identifier in an integrated circuit chip
12/16/2004	US20040251470 Memory cell for modification of default register values in an integrated circuit chip
12/16/2004	US20040251230 Method for fabricating thick film alumina structures used in high frequency, low loss applications and a structure resulting therefrom
12/16/2004	US20040251044 Ceramic package and fabrication method thereof
12/16/2004	US20040251000 Heat-dissipating device and housing thereof
12/16/2004	US20040250999 High flux heat removal system using jet impingement of water at subatmospheric pressure
12/16/2004	US20040250994 Methods and apparatuses for electronics cooling
12/16/2004	US20040250993 Heat-dissipating device
12/16/2004	US20040250991 Heat dissipation structure
12/16/2004	US20040250990 Cooling element for heat dissipation in electronic components
12/16/2004	US20040250989 Clothespin type heat dissipating apparatus for semiconductor module
12/16/2004	US20040250986 Streamline heat sink and method for manufacturing the heat sink
12/16/2004	US20040250563 Semiconductor cooling device
12/16/2004	US20040250558 Semiconductor cooling device
12/16/2004	US20040250411 Integrated inductor
12/16/2004	DE10356759A1 Drain to source transient disturbance detector for thyristor transient latch up measurement has pulse generator connected to p and n well CMOS test structure
12/16/2004	DE10324732A1 System for cooling processors arranged on a base plate comprises a base unit consisting of heat conducting tubes having the ends fixed on and/or in heat-receiving and heat-releasing plates and/or adapter systems
12/16/2004	DE10324220A1 Sockeldesign zur Selbstzentrierung Base design for self
12/16/2004	DE10324156A1 Verfahren und Anordnung zum thermischen Schutz elektronischer Einheiten in einem elektronischen Gerät Method and apparatus for thermal protection of electronic devices in an electronic device
12/16/2004	DE102004024616A1 Wärmeableitkonstruktion Heat dissipation
12/16/2004	DE102004004880A1 Verbindungsverfahren für direkt verbundene gestapelte integrierte Schaltungen Connection method to directly connected stacked integrated circuits
12/15/2004	EP1487019A1 Electronic device and method of manufacturing thereof
12/15/2004	EP1487018A2 Flexible substrate for a semiconductor package and method of manufacturing the same
12/15/2004	EP1487017A2 Thermally Enhanced Substrate for a BGA
12/15/2004	EP1487016A2 Flip-chip interconnect with increased current-carrying capability
12/15/2004	EP1487015A1 Semiconductor electronic device and method of manufacturing thereof
12/15/2004	EP1487014A1 Semiconductor device and method for assembling the same
12/15/2004	EP1486791A1 Semiconductor chip with a device for monitoring mechanical damages
12/15/2004	EP1485724A1 Scatterometry structure with embedded ring oscillator, and methods of using same
12/15/2004	EP1092338B1 Assembly of an electronic component with spring packaging
12/15/2004	CN2664203Y Packaging structure of image sensor
12/15/2004	CN2664198Y Multi-chip packaging structure
12/15/2004	CN2664197Y Liquid cooling type heat sink
12/15/2004	CN2664196Y Liquid cooling type heat sink
12/15/2004	CN2664195Y Liquid cooling type heat sink
12/15/2004	CN2664194Y Liquid cooling type heat sink
12/15/2004	CN2664193Y Heat sink
12/15/2004	CN2664192Y Water cooling type heat sink
12/15/2004	CN2664191Y Radiator unit
12/15/2004	CN2664190Y Heat pipe combined radiating fin sets improved structure
12/15/2004	CN2664189Y Heat sink for heat pipe
12/15/2004	CN2664188Y Radiator shutter device of heat sink
12/15/2004	CN2664187Y Radiator of elongated CPU
12/15/2004	CN2664186Y Radiating mechanism capable of protecting bare crystal packaging
12/15/2004	CN2664185Y Heat sink assembly
12/15/2004	CN2664184Y Heat sink
12/15/2004	CN2664183Y Heat sink
12/15/2004	CN2664182Y Heat sink
12/15/2004	CN2664181Y 散热器固定装置 Sink fixtures
12/15/2004	CN2664180Y Heat sink
12/15/2004	CN2664179Y 散热器与导热管构造 Radiators and heat pipe structure
12/15/2004	CN2664178Y Circulating type radiator
12/15/2004	CN2664177Y Integrated circuit package structure having central lead
12/15/2004	CN2664051Y A curvature radiator
12/15/2004	CN1555667A Surface mounting package
12/15/2004	CN1555578A Image sensor with recessed planarizing layers and method for making same
12/15/2004	CN1555577A Non-conductive substrate forming a strip or a panel, on which a plurality of carrier elements are configured
12/15/2004	CN1555576A Thin electronic label and method for making same
12/15/2004	CN1555575A Layered dielectric nanoporous materials and methods of producing same
12/15/2004	CN1555574A Method for packaging a microelectronic device using on-die bond pad expansion
12/15/2004	CN1555573A Microelectronic package having an integrated heat sink and build-up layers
12/15/2004	CN1555572A Inter-carrier for electronic components and method to solder-contact of such an inter-carrier
12/15/2004	CN1555563A Conductive materials with electrical stability for use in electronics devices
12/15/2004	CN1555506A Thin film transistor array panel for liquid crystal display
12/15/2004	CN1555405A Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
12/15/2004	CN1555095A New structure heat radiator
12/15/2004	CN1555091A Tree interlinking circuit analogue method based on transmission line model
12/15/2004	CN1555064A Nonvolatile semiconductor memory device and nonvolatile semiconductor memory system
12/15/2004	CN1180485C Packaged video image sensitive chip with light permeable piece and package method
12/15/2004	CN1180479C Electrostatic discharge protective circuit
12/15/2004	CN1180478C Planar plastic packaged module of integrated circuit
12/15/2004	CN1180477C Semiconductor device adn semiconductor assembly
12/15/2004	CN1180476C IC package structure without anti-welding film and its method
12/15/2004	CN1180475C High-density integrated circuit package structure and method
12/15/2004	CN1180474C Chip package structure and its substrate board
12/15/2004	CN1180473C High-density IC package structure and its method
12/15/2004	CN1180472C Surface mounting assembly including terminal at side
12/15/2004	CN1180471C Custom made lid for improving heat property of module by inverse mounting
12/15/2004	CN1180469C 半导体器件 Semiconductor devices
12/15/2004	CN1180464C Ball limiting tallury for input/outputs and methods of fabrication
12/15/2004	CN1180462C Method for coating metal on the surface of integrated circuit structure
12/15/2004	CN1180445C Semiconductor inductor and methods for making the same
12/15/2004	CN1180333C Fastener
12/15/2004	CN1180263C Probe adapter for spherical grid array component
12/14/2004	US6832049 Optical Module
12/14/2004	US6831528 High-frequency switching module and high-frequency apparatus equipped with the same
12/14/2004	US6831372 Electronic devices with semiconductor chips and a leadframe with device positions and methods for producing the same
12/14/2004	US6831371 Integrated circuit substrate having embedded wire conductors and method therefor
12/14/2004	US6831370 Method of using foamed insulators in three dimensional multichip structures
12/14/2004	US6831368 Semiconductor device and method of manufacturing the same
12/14/2004	US6831367 Semiconductor device and method of manufacturing the same

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